Patents by Inventor Min Pei
Min Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250055217Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.Type: ApplicationFiled: October 28, 2024Publication date: February 13, 2025Applicant: Intel CorporationInventors: Min Pei, Lejie Liu, Ralph Miele, Phil Geng, Steven Klein
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Publication number: 20240413054Abstract: Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.Type: ApplicationFiled: August 20, 2024Publication date: December 12, 2024Applicant: Intel CorporationInventors: Min Pei, Ralph V. Miele, Lejie Liu, Phil Geng, Caleb Million Tessema
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Publication number: 20240407092Abstract: Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.Type: ApplicationFiled: August 15, 2024Publication date: December 5, 2024Applicant: Intel CorporationInventors: Ariatne Ramirez Macias, Allison Van Horn, Kristin L. Weldon, Israel Cruz Ruiz, Fernando Gonzalez Lenero, Min Pei, Francisco Javier Colorado Alonso, Randall Scott Sanford, Emery Evon Frey, Eric W. Buddrius
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Publication number: 20240133945Abstract: A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.Type: ApplicationFiled: December 29, 2023Publication date: April 25, 2024Inventors: Mohanraj Prabhugoud, David Shia, Lejie Liu, Silver Alfonso Rodriguez Estrada, Min Pei, Ralph V. Miele, Caleb Million Tessema
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Publication number: 20230209702Abstract: Warpage reduction through laminate glass cloth design modification is described herein. In one example, a substrate for a microelectronic assembly, includes one or more glass-cloth containing layers. At least one of the glass-cloth containing layers includes a glass cloth having a weave including: a first plurality of parallel glass fibers, a second plurality of parallel glass fibers, and a third plurality of parallel glass fibers interwoven with one another in a plane. The second plurality of parallel glass fibers crosses the first plurality of glass fibers at a first angle, and the third plurality of parallel glass fibers crosses the first plurality of glass fibers at a second angle and crosses the second plurality of glass fibers at a third angle. In one example, the glass cloth weave includes a hexagonal pattern.Type: ApplicationFiled: December 23, 2021Publication date: June 29, 2023Inventors: Satyajit WALWADKAR, Min PEI, George HSIEH
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Publication number: 20230014898Abstract: Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.Type: ApplicationFiled: September 28, 2022Publication date: January 19, 2023Inventors: Phil Geng, Jordan Johnson, Mengqi Liu, Ralph Miele, Min Pei
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Publication number: 20170287757Abstract: Devices and methods are shown that use sensors to detect physical characteristics of an IC circuit or other device over time. The physical characteristics and time data may be used to calculate a damage metric of the IC circuit or other device. The damage metric may be used to notify a user about a condition of the IC circuit or other device.Type: ApplicationFiled: March 30, 2016Publication date: October 5, 2017Inventors: Robert F. Kwasnick, Min Pei, Alan E. Lucero
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Patent number: 8765370Abstract: A method for screening cells with high level expression of a target protein is disclosed. The method includes introducing into a plurality of host cells a DNA construct that encodes both a target protein and an inhibitor to an endogenous selectable marker in the host cells, screening host cells harboring the DNA construct for the expression of the endogenous selectable marker, and isolating cells with reduced expression of the selectable marker. Also disclosed is a DNA construct configured to express both the target protein and the inhibitor inside the host cell.Type: GrantFiled: June 3, 2010Date of Patent: July 1, 2014Assignee: Scinopharm Taiwan, LtdInventors: Wei-Kuang Liu, Min-Pey Ding
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Publication number: 20140168909Abstract: Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a gap between respective openings in a solder resist layer of the microelectronic substrate and each of the joint pads. Such attachment structures may reduce or substantially eliminate contact between a solder interconnect and a solder resist layer of the microelectronic board/interposer, which may, in turn, reduce or substantially eliminate the potential of crack initiation and propagation at contact areas between the solder interconnect and a solder resist layer of the microelectronic board/interposer due to stresses induced by a mismatch of thermal expansion between the microelectronic package and the microelectronic board/interposer during thermal cycling.Type: ApplicationFiled: December 19, 2012Publication date: June 19, 2014Inventors: Tieyu Zheng, Jin A. Zhao, Ru Han, Min Pei
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Patent number: 8642327Abstract: A method for screening cells with high level expression of a target protein is disclosed. The method includes introducing into a plurality of host cells a DNA construct that encodes both a target protein and an inhibitor to an endogenous selectable marker in the host cells, screening host cells harboring the DNA construct for the expression of the endogenous selectable marker, and isolating cells with reduced expression of the selectable marker. Also disclosed is a DNA construct configured to express both the target protein and the inhibitor inside the host cell.Type: GrantFiled: September 13, 2011Date of Patent: February 4, 2014Assignee: Scinopharm Taiwan, Ltd.Inventors: Wei-Kuang Liu, Min-Pey Ding
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Publication number: 20120070891Abstract: A method for screening cells with high level expression of a target protein is disclosed. The method includes introducing into a plurality of host cells a DNA construct that encodes both a target protein and an inhibitor to an endogenous selectable marker in the host cells, screening host cells harboring the DNA construct for the expression of the endogenous selectable marker, and isolating cells with reduced expression of the selectable marker. Also disclosed is a DNA construct configured to express both the target protein and the inhibitor inside the host cell.Type: ApplicationFiled: September 13, 2011Publication date: March 22, 2012Inventors: Wei-Kuang LIU, Min-Pey Ding
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Publication number: 20110124509Abstract: A method for screening cells with high level expression of a target protein is disclosed. The method includes introducing into a plurality of host cells a DNA construct that encodes both a target protein and an inhibitor to an endogenous selectable marker in the host cells, screening host cells harboring the DNA construct for the expression of the endogenous selectable marker, and isolating cells with reduced expression of the selectable marker. Also disclosed is a DNA construct configured to express both the target protein and the inhibitor inside the host cell.Type: ApplicationFiled: June 3, 2010Publication date: May 26, 2011Applicant: ScinoPharm Taiwan, Ltd.Inventors: Wei-Kuang LIU, Min-Pey DING
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Publication number: 20100317532Abstract: A method for screening cells with high level expression of a target protein is disclosed. The method includes introducing into a plurality of host cells a DNA construct that encodes both a target protein and an inhibitor to an endogenous selectable marker in the host cells, screening host cells harboring the DNA construct for the expression of the endogenous selectable marker, and isolating cells with reduced expression of the selectable marker. Also disclosed is a DNA construct configured to express both the target protein and the inhibitor inside the host cell.Type: ApplicationFiled: June 3, 2010Publication date: December 16, 2010Applicant: Scinopharm Taiwan, Ltd.Inventors: Wei-Kuang LIU, Min-Pey Ding
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Patent number: 7108978Abstract: It is provided isolated polynucleotides that include sequences from genomic region around the gene CD 81. The polynucleotides include polymorphisms associated with treatment response of HCV patients to interferon-? and ribavirin combined therapy and are useful as the probes in screening for patients who will response to interferon-? and ribavirin combined therapy. It is further provided linkage disequilibrium structure of the CD81 gene and haplotype information within a particular LD block, which can be used for prediction of the treatment outcome of the interferon-? and ribavirin combined therapy on HCV patients.Type: GrantFiled: July 15, 2003Date of Patent: September 19, 2006Assignee: Vita Genomics, Inc.Inventors: Jui-Lin Chen, Yuchi Hwang, Min-Pey Ding, Wen-Pi Chu, Shu-Ching Wang, Kuei-Ling Belinda Chen, Wan-Lin Yao, Kuang-Den Chen, Ding-Shinn Chen, Pei-Jer Chen, Ming-Yang Lai
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Publication number: 20050014159Abstract: It is provided isolated polynucleotides that include sequences from genomic region around the gene CD 81. The polynucleotides include polymorphisms associated with treatment response of HCV patients to interferon-? and ribavirin combined therapy and are useful as the probes in screening for patients who will response to interferon-? and ribavirin combined therapy. It is further provided linkage disequilibrium structure of the CD81 gene and haplotype information within a particular LD block, which can be used for prediction of the treatment outcome of the interferon-? and ribavirin combined therapy on HCV patients.Type: ApplicationFiled: July 15, 2003Publication date: January 20, 2005Inventors: Jui-Lin Chen, Yuchi Hwang, Min-Pey Ding, Wen-Pi Chu, Shu-Ching Wang, Kuei-Ling Chen, Wan-Lin Yao, Kuang-Den Chen, Ding-Shinn Chen, Pei-Jer Chen, Ming-Yang Lai