Abstract: The present disclosure relates generally to a high capacity cathode material suitable for use in a non-aqueous electrochemical cell that comprises a mixture of at least three different cathode materials, and more specifically a mixture of fluorinated carbon, an oxide of copper and an oxide of manganese. The present disclosure additionally relates to a non-aqueous electrochemical cell comprising such a cathode material and, in particular, to such a non-aqueous electrochemical cell that can deliver a higher capacity than a conventional cell, and/or that possesses an improved end-of-life indication.

Abstract: A cathode material suitable for use in non-aqueous electrochemical cells that includes copper manganese vanadium oxide and, optionally, fluorinated carbon. A non-aqueous electrochemical cell comprising such a cathode material, and a non-aqueous electrochemical cell that additionally includes a lithium anode.

Abstract: Zymomonas expressing xylose isomerase from A. missouriensis was found to have improved xylose utilization, growth, and ethanol production when grown in media containing xylose. Xylose isomerases related to that of A. missouriensis were identified structurally through molecular phylogenetic and Profile Hidden Markov Model analyses, providing xylose isomerases that may be used to improve xylose utilization.

Abstract: The present disclosure relates generally to indicating an end of life condition of an electrochemical device, and more particularly to systems and methods for sensing and determining an end of life condition in a cell comprising a high capacity cathode material suitable for use in a non-aqueous electrochemical cell. The high capacity cathode material has an amorphous or semi-crystalline form of copper manganese oxide, and optionally fluorinated carbon. The present disclosure additionally relates to transmitting the determined end of life condition to a user or monitoring device of the cell.

Abstract: The present disclosure relates generally to a high capacity cathode material suitable for use in a non-aqueous electrochemical cell that comprises a mixture of at least three different cathode materials, and more specifically a mixture of fluorinated carbon, an oxide of copper and an oxide of manganese. The present disclosure additionally relates to a non-aqueous electrochemical cell comprising such a cathode material and, in particular, to such a non-aqueous electrochemical cell that can deliver a higher capacity than a conventional cell, and/or that possesses an improved end-of-life indication.

Abstract: The present disclosure relates generally to a high capacity cathode material suitable for use in a non-aqueous electrochemical cell that comprises copper manganese oxide, which may be in amorphous or semi-crystalline form, and optionally fluorinated carbon. The present disclosure additionally relates to a non-aqueous electrochemical cell comprising such a cathode material and, in particular, to such a non-aqueous electrochemical cell that can deliver a higher capacity than conventional cell.

Abstract: A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.

Abstract: The invention relates to a method for transformation of plant chloroplasts with genetic constructs by insertion of a RUBISCO gene in a non-RUBISCO site of the chloroplast genome to generate transformed plants that produce large amounts of a functional RUBISCO enzyme.

Abstract: The invention describes isolation and functional expression of RUBISCO genes derived from C4 plants and red algae in C3 plant hosts. Specifically the RUBISCO genes of Amaranthus edulis were functionally expressed at high levels in the transgenic crop plants soybean and tobacco, while the RUBISCO gene from Griffithsia monilis alga was expressed at lower levels in the transgenic crop tobacco.

Abstract: A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.

Abstract: A heat sink with heat pipes includes a base (10). The base includes a bottom surface contacting a heat-generating component (40), an upper surface opposite to the bottom surface, and a plurality of grooves (14) defined on the upper surface of the base. The heat sink further includes two heat pipes (32, 36) received in the grooves, each heat pipe comprising an evaporating section (322, 362) and a condensing section (324, 364) respectively, wherein the evaporating sections of the heat pipes are closely arranged on a portion of the base, and wherein the condensing sections of the heat pipes spread out from said portion of the base by extending in the grooves to other parts of the base so that heat absorbed by the base from the heat-generating component can be evenly spread to the whole base.

Abstract: A heat sink includes a base (10) and heat pipes (20). The base includes a bottom surface contacting with a heat-generating electronic component (100), an upper surface defining grooves (12) receiving the heat pipes therein. Evaporating sections (22) of the heat pipes are located near a first end portion (10a) and condensing sections (24) of the heat pipes are located near a second end portion (10b) of the base. A first fin assembly (30) is mounted on the upper surface and a second fin assembly (40) is mounted on the bottom surface of the base near the second end portion thereof. A fan (200) is located near the second end portion of the base.

Abstract: A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a plurality of channels (16) extending through front and rear ends of the heat sink. A cavity (40) is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.

Abstract: A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.

Abstract: A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping arms in the cutouts of the heat sink. Each clamping arm defines a slit. A clip includes two abutting portions rotatablely connecting with the pads and the clamping arms, and two pressing portions slidably received in the slots of the pads and the slits of the clamping arms. When the clip is moved to a locked position, the pressing portions of the clip press the pads downwardly a distance relative to the clamping arms so that the heat sink can have an intimate contact with an electronic device.

Abstract: A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.

Abstract: A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping arms in the cutouts of the heat sink. Each clamping arm defines a slit. A clip includes two abutting portions rotatablely connecting with the pads and the clamping arms, and two pressing portions slidably received in the slots of the pads and the slits of the clamping arms. When the clip is moved to a locked position, the pressing portions of the clip press the pads downwardly a distance relative to the clamping arms so that the heat sink can have an intimate contact with an electronic device.

Abstract: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

Abstract: The skew between a received clock signal and a received data signal that are source synchronous, is accounted for such that stable bit values of the received data signal may be sampled. For programmable skew cancellation, a skew value corresponding to the amount of the skew is determined and programmed into a data storage device. Sampling clock signals of the same frequency but different phases are generated from the clock signal, and one of the sampling clock signals having the desired phase is selected depending on the programmed skew value. Alternatively, for automatic skew cancellation, a phase locked loop compares the received data signal to one of the sampling clock signals to determine the skew value for selecting the sampling clock signal having the desired phase. Stable bit values of the data signal are then sampled with the selected sampling clock signal.

Abstract: A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.