Abstract: A DRAM cell capacitor is provided, having HSG (hemispherical grain) silicon disposed on a selected portion of a storage node. The capacitor resembles a solid cylindrical configuration having a top portion, a side wall, and a top edge portion sloped downward from the top portion to the side wall. HSG silicon is disposed only on the top portion and the side wall, but not on the sloped top edge portion.

Abstract: A DRAM cell capacitor is provided wherein a capacitor bottom electrode has an HSG (Hemi-Spherical Grain) layer formed thereon so as to increase capacitance of the capacitor. In the DRAM cell capacitor, the capacitor bottom electrode has an angled shape at a top edge thereof, and the HSG silicon layer is not formed on the top edge of the capacitor bottom electrode. A method for manufacturing the DRAM cell capacitor comprises etching an upper portion of the conductive layer using the photoresist pattern as a mask, and at the same time forming a polymer on both sidewalls of the photoresist pattern to etch the upper portion thereof and thereby to make a top edge of the conductive layer be angled. The method further comprises etching a remaining portion of the conductive layer sing a combination of the photoresist pattern and the polymer as a mask until an upper surface of the interlayer insulating layer is exposed, to thereby form the capacitor bottom electrode.

Abstract: A method for forming a fine pattern, e.g., for forming the storage electrodes of the capacitors of the memory cells of semiconductor memory devices, which includes the steps of depositing a mask layer on the layer to be patterned, depositing a photoresist layer on the mask layer, patterning the photoresist layer, to thereby form a photoresist pattern, anisotropically etching the mask layer, using the photoresist pattern as an etching mask, to thereby form a mask layer pattern, wherein etch by-products are formed on sidewalls of a composite layer comprised of the photoresist pattern and the mask layer pattern, and, etching the layer to be patterned using the composite layer and the etch by-products as an etching mask, to thereby form a fine pattern. The mask layer is made of a material, e.g., a high-temperature oxide, having different physical properties than that of the photoresist. Further, the anisotropic etching process is preferably carried out by means of a plasma etching process using a mixture of CF.