Patents by Inventor Min-Seok Ha

Min-Seok Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9123388
    Abstract: A disk drive that includes a noise reduction unit, and a method of reducing noise by using the disk drive. The disk drive includes a main chassis; a tray operatively coupled to the main chassis such that the tray is slidable relative to the main chassis, the tray including a disk accommodation portion configured to accommodate a storage medium such that the storage medium is rotatable relative to the disk accommodation portion; and a noise reduction unit configured to reduce a pressure concentration on an end portion of the storage medium as the storage medium rotates to reduce noise.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: September 1, 2015
    Assignee: Toshiba Samsung Storage Technology Korea Corporation
    Inventors: Min-shik Roh, Se-yoon Kim, Bo-won Hwang, Byung-yeob Park, Dong-ha Jung, Ji-won Jung, Min-seok Ha
  • Publication number: 20140144609
    Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool a heat generating electronic component that generates heat during operation, the evaporator including: a body including an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a copper powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a surface of the sintered wick, wherein the additional layer is formed by sintering copper particles having a size smaller than that of the copper powder forming the sintered wick, and the working fluid moved from the sintered wick is changed in a vapor state to be discharged.
    Type: Application
    Filed: February 15, 2013
    Publication date: May 29, 2014
    Applicant: ZALMAN TECH CO., LTD.
    Inventors: Jee Hoon CHOI, Yun Keun LEE, Min Whan SEO, Min Seok HA
  • Patent number: 8726301
    Abstract: A cover for an optical disc drive. The cover includes: a body having a top portion that is configured to cover a disc if the disc is inserted into the optical disc drive, and a pressure structure formed on the body and having an asymmetrical shape.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: May 13, 2014
    Assignee: Toshiba Samsung Storage Technology Korea Corporation
    Inventors: Dong-ha Jung, Bo-won Hwang, Min-shik Roh, Byung-yeob Park, Se-yoon Kim, Ji-won Jung, Min-seok Ha
  • Publication number: 20120297402
    Abstract: A cover for an optical disc drive. The cover includes: a body having a top portion that is configured to cover a disc if the disc is inserted into the optical disc drive, and a pressure structure formed on the body and having an asymmetrical shape.
    Type: Application
    Filed: February 24, 2012
    Publication date: November 22, 2012
    Inventors: Dong-ha Jung, Bo-won Hwang, Min-shik Roh, Byung-yeob Park, Se-yoon Kim, Ji-won Jung, Min-seok Ha
  • Publication number: 20120102508
    Abstract: A disk drive that includes a noise reduction unit, and a method of reducing noise by using the disk drive. The disk drive includes a main chassis; a tray operatively coupled to the main chassis such that the tray is slidable relative to the main chassis, the tray including a disk accommodation portion configured to accommodate a storage medium such that the storage medium is rotatable relative to the disk accommodation portion; and a noise reduction unit configured to reduce a pressure concentration on an end portion of the storage medium as the storage medium rotates to reduce noise.
    Type: Application
    Filed: October 20, 2011
    Publication date: April 26, 2012
    Inventors: Min-shik Roh, Se-yoon Kim, Bo-won Hwang, Byung-yeob Park, Dong-ha Jung, Ji-won Jung, Min-seok Ha
  • Patent number: 6339251
    Abstract: A method of preparing a semiconductor wafer includes the step of forming first and second layers of a first material on opposing respective first and second faces of the semiconductor wafer. The second layer of the first material is then removed from the second face of the semiconductor wafer. More particularly, the first material can be polysilicon. Warping of the semiconductor wafer can thus be reduced.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: January 15, 2002
    Assignee: Samsung Electronics Co., LTD
    Inventors: Min-Seok Ha, Jin-Kee Choi, Cheol Jeong
  • Publication number: 20010014515
    Abstract: A method of preparing a semiconductor wafer includes the step of forming first and second layers of a first material on opposing respective first and second faces of the semiconductor wafer. The second layer of the first material is then removed from the second face of the semiconductor wafer. More particularly, the first material can be polysilicon. Warping of the semiconductor wafer can thus be reduced.
    Type: Application
    Filed: November 29, 1999
    Publication date: August 16, 2001
    Inventors: MIN-SEOK HA, JIN-KEE CHOI, CHEOL JEONG
  • Patent number: 6025250
    Abstract: A method of preparing a semiconductor wafer includes the step of forming first and second layers of a first material on opposing respective first and second faces of the semiconductor wafer. The second layer of the first material is then removed from the second face of the semiconductor wafer. More particularly, the first material can be polysilicon. Warping of the semiconductor wafer can thus be reduced.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: February 15, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Seok Ha, Jin-Kee Choi, Cheol Jeong