Patents by Inventor Min Seok JIN

Min Seok JIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same
    Patent number: 9460986
    Abstract: A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: October 4, 2016
    Assignee: HAESUNG DS CO., LTD
    Inventors: Sung Il Kang, In Seob Bae, Min Seok Jin
  • METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SUBSTRATE MANUFACTURED USING THE SAME
    Publication number: 20150194323
    Abstract: A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.
    Type: Application
    Filed: January 5, 2015
    Publication date: July 9, 2015
    Applicant: HAESUNG DS CO., LTD
    Inventors: Sung Il KANG, In Seob BAE, Min Seok JIN