Patents by Inventor Minseung Kang

Minseung Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087834
    Abstract: An electrode assembly of the present disclosure includes: a first electrode plate and a second electrode plate, each of the first electrode plate and the second electrode plate comprising an electrode current collector and an electrode substrate tab extending externally from a portion of the electrode current collector; a separator interposed between the first electrode plate and the second electrode plate; and a reinforcing member interposed between the separator and an outermost electrode plate disposed at an outermost position of the electrode assembly, the outermost electrode plate being the first electrode plate of the second electrode plate, wherein the reinforcing member is disposed to correspond to an edge portion of the electrode current collector and the electrode substrate tab of the outermost electrode plate.
    Type: Application
    Filed: September 4, 2024
    Publication date: March 13, 2025
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Kyungho Kim, Minseung Kang, Kyeong-yun Park, Myeongjun Jo, Eunsong Lee
  • Publication number: 20250070410
    Abstract: A rechargeable battery according to the present disclosure includes an electrode assembly including a plurality of electrode plates, each electrode plate including an electrode base tab and disposed to be stacked on one another, and a separator interposed between the plurality of electrode plates, and a case accommodating the electrode assembly, wherein a width of an electrode base tab of an outermost electrode plate in the electrode assembly is smaller than a width of the electrode base tab of remaining electrodeplates.
    Type: Application
    Filed: August 26, 2024
    Publication date: February 27, 2025
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Kyungho Kim, Kyeong-yun Park, Eunsong Lee, Minseung Kang, Myeongjun Jo
  • Patent number: 12185788
    Abstract: Methods and systems are provided for forming a molded foam article. An example method may include molding a plurality of separate pieces of closed-cell foam by exposure to a temperature cycle within a sealed mold to soften the plurality of pieces sufficiently for physical bonding; and forming a molded foam article with the pieces bonded together without an adhesive, wherein, during the temperature cycle, the mold is unsealed at least once to release gases and/or pressure. In another example, a method includes exposing a filled, sealed mold filled with a plurality of pieces of foamed material to a heating cycle; at a threshold temperature, unsealing the filled, sealed mold until a pressure reduces to within a threshold of atmospheric pressure; and, following the unsealing, cooling the filled mold prior to removing a molded foam article.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: January 7, 2025
    Assignee: NIKE, Inc.
    Inventors: Jeongeun Bae, Rory S. Blanche, Ryan Creswell, William Denton, Caleb W. Dyer, Bryan N. Farris, Diego Zurita, David Jung, Minseung Kang
  • Publication number: 20220248803
    Abstract: Methods and systems are provided for forming a molded foam article. An example method may include molding a plurality of separate pieces of closed-cell foam by exposure to a temperature cycle within a sealed mold to soften the plurality of pieces sufficiently for physical bonding; and forming a molded foam article with the pieces bonded together without an adhesive, wherein, during the temperature cycle, the mold is unsealed at least once to release gases and/or pressure. In another example, a method includes exposing a filled, sealed mold filled with a plurality of pieces of foamed material to a heating cycle; at a threshold temperature, unsealing the filled, sealed mold until a pressure reduces to within a threshold of atmospheric pressure; and, following the unsealing, cooling the filled mold prior to removing a molded foam article.
    Type: Application
    Filed: January 19, 2022
    Publication date: August 11, 2022
    Inventors: Jeongeun Bae, Rory S. Blanche, Ryan Creswell, William Denton, Caleb W. Dyer, Bryan N. Farris, Diego Zurita, David Jung, Minseung Kang