Patents by Inventor Min-Sheng Wu
Min-Sheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071536Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.Type: ApplicationFiled: August 10, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Sheng Chang, Yao-Jen Yang, Min-Shin Wu
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Patent number: 11915512Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.Type: GrantFiled: October 14, 2021Date of Patent: February 27, 2024Assignee: Himax Technologies LimitedInventors: Ching-Wen Wang, Cheng-Che Tsai, Ting-Sheng Hsu, Min-Chian Wu
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Patent number: 9373758Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: GrantFiled: April 25, 2014Date of Patent: June 21, 2016Assignee: EPISTAR CORPORATIONInventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Patent number: 9246068Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.Type: GrantFiled: June 16, 2014Date of Patent: January 26, 2016Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 9214610Abstract: A lighting apparatus includes a first doped semiconductor layer, a light-emitting layer disposed over the first doped semiconductor layer, a second doped semiconductor layer disposed over the light-emitting layer, a first conductive terminal, a second conductive terminal, and a photo-conversion layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. The first conductive terminal and the second conductive terminal each are disposed below the first doped semiconductor layer. The photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.Type: GrantFiled: June 16, 2014Date of Patent: December 15, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 9136442Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.Type: GrantFiled: January 25, 2013Date of Patent: September 15, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Jui-Ping Weng, Hsiao-Wen Lee, Chun-Chih Chang, Min-Sheng Wu, Hsin-Hsien Lee
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Patent number: 9105818Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.Type: GrantFiled: June 3, 2014Date of Patent: August 11, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Patent number: 9093618Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.Type: GrantFiled: June 16, 2014Date of Patent: July 28, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 9082942Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.Type: GrantFiled: December 26, 2013Date of Patent: July 14, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 9035334Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: GrantFiled: February 7, 2014Date of Patent: May 19, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 8889439Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.Type: GrantFiled: March 7, 2013Date of Patent: November 18, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 8860056Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: GrantFiled: December 1, 2011Date of Patent: October 14, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140295593Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.Type: ApplicationFiled: June 16, 2014Publication date: October 2, 2014Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Publication number: 20140291611Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A first conductive terminal and a second conductive terminal are each disposed below the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.Type: ApplicationFiled: June 16, 2014Publication date: October 2, 2014Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Publication number: 20140291610Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.Type: ApplicationFiled: June 16, 2014Publication date: October 2, 2014Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Publication number: 20140264268Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.Type: ApplicationFiled: June 3, 2014Publication date: September 18, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Patent number: 8835202Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: GrantFiled: December 26, 2013Date of Patent: September 16, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140231836Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: ApplicationFiled: April 25, 2014Publication date: August 21, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140209930Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.Type: ApplicationFiled: January 25, 2013Publication date: July 31, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Jui-Ping Weng, Hsiao-Wen Lee, Chun-Chih Chang, Min-Sheng Wu, Hsin-Hsien Lee
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Patent number: 8765500Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: GrantFiled: August 24, 2012Date of Patent: July 1, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin