Patents by Inventor Min-Shin Ou

Min-Shin Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package for controlling warpage
    Patent number: 8629541
    Abstract: A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: January 14, 2014
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Min-Shin Ou, Chun-Yang Lee, Jun Zhai
  • SEMICONDUCTOR PACKAGE FOR CONTROLLING WARPAGE
    Publication number: 20120056336
    Abstract: A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.
    Type: Application
    Filed: April 28, 2011
    Publication date: March 8, 2012
    Inventors: Min-Shin Ou, Chun-Yang Lee, Jun Zhai