Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.

Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.

Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.

Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.

Abstract: This invention provides a method for fabricating a semiconductor device and a carrier applied therein. The method includes the steps of: disposing a chip-mounted substrate in an opening of a carrier; forming at least a storage aperture and at least an inspection aperture in the carrier; infusing an adhesive into the storage aperture to fill a gap between the substrate and carrier with the adhesive by capillarity; determining whether the inspection aperture is filled with the adhesive to ascertain whether the gap is completely filled with the adhesive; in response to a positive result, performing a molding process to form a molding compound for encapsulating the chip; and performing implantation of solder ball and a singulation process to form a semiconductor device with desirable dimensions.

Abstract: A method for fabricating a heat-dissipating package and a heat-dissipating structure applicable thereto are disclosed. The method includes: mounting and electrically connecting to a chip carrier a semiconductor chip mounted with a heat-dissipating structure; disposing on the heat-dissipating structure a covering layer protrudingly formed with an abutting portion surrounding the covering layer, wherein the size of the heat-dissipating structure is greater than the predetermined one of the package to position the chip carrier in a cavity of a mold and encapsulate the heat-dissipating structure and semiconductor chip by encapsulant, and the protruding portion abuts against a top surface of the cavity and prevent the heat-dissipating structure from warping; and singulating the package and removing the encapsulant from the covering layer thereunder according to the predetermined size of the package.