Abstract: A lead frame includes: a die pad having a die disposing area; a plurality of lead pads located around the die pad; an outer frame, located at a periphery of the die pad and the lead pads; and at least two tie bars, respectively connected between the outer frame and two opposite sides of the die pad. At least one of the die pad and the tie bars includes a thermal deformation mitigation structure.

Abstract: A package structure, includes: a lead frame, having a die pad and lead pads around the die pad; a chip die on the die pad, wherein the lead pads are electrically connected with the chip die via lead wires; a thermal conductive adhesive layer on the chip die; a thermal conductive plate on the thermal conductive adhesive layer; and a packaging material, encapsulating the lead frame, the chip die, the thermal conductive plate, and the thermal conductive adhesive layer. The thermal conductive plate is exposed on a top of the package material, and the lead frame is exposed on a bottom surface of the package material. The package structure has an upper thermal conduction path passing through the chip die, the thermal conductive adhesive layer, and the thermal conductive plate; and a lower thermal conduction path passing through the chip die and the lead frame.