Patents by Inventor Min Son

Min Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENT HAVING LEAD PART INCLUDING REGIONS HAVING DIFFERENT THICKNESSES AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190267178
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Dong Jin JEONG, Kyung Seop LEE, Yong Un CHOI, Kyung Min SON
  • Electronic component having lead part including regions having different thicknesses and method of manufacturing the same
    Patent number: 10332667
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Kyung Seop Lee, Yong Un Choi, Kyung Min Son
  • Apparatus for receiving wireless power and method of controlling same
    Patent number: 10284002
    Abstract: A reception device for receiving wireless power may include: a power reception circuit configured to wirelessly receive power from a transmission device, rectify the received power, and output the rectified power; a charger configured to process the rectified power received from the power reception circuit and charge a battery of the reception device or output the rectified power to a system of the reception device; and a control circuit configured to, when an event for changing an input current limit of the charger is detected, gradually change the input current limit of the charger by stepping up or stepping down the input current limit to one or more intermediary values until the input current limit reaches a predetermined value.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: May 7, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Min Lee, Young-Mi Ha, Hong-Min Son, Sung-Joon Cho
  • SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES
    Publication number: 20190131228
    Abstract: A semiconductor device and a method of manufacturing the same, the device including a through-hole electrode structure extending through a substrate; a redistribution layer on the through-hole electrode structure; and a conductive pad, the conductive pad including a penetrating portion extending through the redistribution layer; and a protrusion portion on the penetrating portion, the protrusion portion protruding from an upper surface of the redistribution layer, wherein a central region of an upper surface of the protrusion portion is flat and not closer to the substrate than an edge region of the upper surface of the protrusion portion.
    Type: Application
    Filed: August 21, 2018
    Publication date: May 2, 2019
    Inventors: Jin-Ho CHUN, Seong-Min SON, Hyung-Jun JEON, Kwang-Jin MOON, Jin-Ho AN, Ho-Jin LEE, Atsushi FUJISAKI
  • GATE DRIVER AND FLAT PANEL DISPLAY DEVICE INCLUDING THE SAME
    Publication number: 20190103049
    Abstract: Disclosed herein are a gate driver capable of implementing a narrow bezel by deleting dummy gate-in-panels (GIPs) and a flat panel display device including the same. The gate driver includes gate-in-panels (GIPs) equal in number to a plurality of gate lines in order to sequentially supply scan pulses to the plurality of gate lines. A k-th GIP is enabled by a carry pulse from a GIP of a (k?a)-th stage and is disabled by a carry pulse output from a GIP of a (k+b)-th stage (a and b are natural numbers), first a GIPs are enabled by a gate start signal output from a timing controller, and last b GIPs are disabled by a reset signal output from the timing controller.
    Type: Application
    Filed: September 20, 2018
    Publication date: April 4, 2019
    Inventors: Seok NOH, Hae-Jin PARK, Ki-Min SON
  • Method for providing multi number service
    Patent number: 10251051
    Abstract: A method for providing a multi number service using a universal integrated circuit card (UICC) comprises the steps of: according to a command received from the outside of a UICC, selecting any one subscriber identification information set among a plurality of subscriber identification information sets stored in a memory allocated to a subscriber identification information set managing application; and activating the selected subscriber identification information set.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: April 2, 2019
    Assignee: KONA I CO., LTD
    Inventors: Chung Il Cho, Sung Hwan Kim, Young Min Son, Chang Yong Choi, Joo Yeol Oh, Hyun Sung Hong
  • SEMICONDUCTOR DEVICE
    Publication number: 20190067228
    Abstract: A semiconductor device includes a protective layer, a redistribution pattern, a pad pattern and an insulating polymer layer. The protective layer may be formed on a substrate. The redistribution pattern may be formed on the protective layer. An upper surface of the redistribution may be substantially flat. The pad pattern may be formed directly on the redistribution pattern. An upper surface of the pad pattern may be substantially flat. The insulating polymer layer may be formed on the redistribution pattern and the pad pattern. An upper surface of the insulating polymer layer may be lower than the upper surface of the pad pattern. The semiconductor device may have a high reliability.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 28, 2019
    Inventors: Seong-Min SON, Jeong-Gi JIN, Jin-Ho AN, Jin-Ho CHUN, Kwang-Jin MOON, Ho-Jin LEE
  • Preparation Containing Esomeprazole
    Publication number: 20190046459
    Abstract: The present invention relates to a preparation containing esomeprazole as an active ingredient. The present invention is characterized in that a controlled-release system is introduced such that the efficacy of esomeprazole, which is an active ingredient, can be continuously exhibited.
    Type: Application
    Filed: January 17, 2017
    Publication date: February 14, 2019
    Inventors: Jung Ju KIM, Yun Mo KUK, Hyung Min SON
  • Channel estimation method and apparatus in wireless communication system
    Patent number: 10181965
    Abstract: The present disclosure relates to a 5G or a pre-5G communication system to be provided in order to support a higher data transmission rate than a beyond 4G communication system such as LTE. A method for estimating a channel, by a terminal, in a wireless communication system supporting beamforming using a plurality of antenna elements, which embodiments of the present disclosure provide, comprises: a step of receiving, from a base station, a set of reference beams including a plurality of reference beams; a step of selecting at least one effective beam from the plurality of reference beams included in the set of reference beams; a step of estimating a channel between the base station and the terminal on the basis of the selected effective beam; a step of generating channel information regarding the estimated channel; and a step of transmitting the generated channel information to the base station.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: January 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyuk-Min Son, Hyun-Kyu Yu, Jae-Won Kim, Jeong-Ho Park, Nam-Jeong Lee, Cheol Jeong
  • DEVICE AND METHOD FOR TRANSMITTING/RECEIVING DATA IN WIRELESS COMMUNICATION SYSTEM
    Publication number: 20190007968
    Abstract: The present disclosure relates to a communication technique for converging, with an IoT technology, a 5G communication system for supporting a higher data transmission rate than a 4G system, and a system therefor. The present disclosure may be applied to intelligent services, such as smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail businesses, and security and safety related services, on the basis of 5G communication s technologies and IoT-related technologies. To this end, a communication device may determine control information for a superposition transmission, and acquire selection sources in response to the determined control information.
    Type: Application
    Filed: December 15, 2016
    Publication date: January 3, 2019
    Inventors: Hyuk-Min SON, Hyun-Kyu YU
  • MOVING OBJECT, CLEANING ROBOT, FLOOR CONDITION DETERMINING DEVICE, METHOD OF CONTROLLING THE MOVING OBJECT, AND METHOD OF CONTROLLING THE CLEANING ROBOT
    Publication number: 20180368642
    Abstract: Provided are a moving object, a cleaning robot, a floor condition determining device, a method of controlling the moving object, and a method of controlling the cleaning robot. The moving object includes a light source configured to irradiate a first light to a floor surface, a plurality of sensors for receiving light reflected from the floor surface at different positions from each other, and a controller configured to determine a condition of the floor surface on the basis of a result sensed by the plurality of sensors.
    Type: Application
    Filed: October 27, 2016
    Publication date: December 27, 2018
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Hyung Min SON, Jung Won CHOI, Yong Jong PARK, Jun Hoe CHOI, Jeong Su HAN
  • Power module having dual-sided cooling
    Patent number: 10147665
    Abstract: A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: December 4, 2018
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jun Hee Park, Jeong Min Son
  • Cooking appliance and method of controlling the same
    Patent number: 10132505
    Abstract: A cooking appliance includes a cooking chamber in which food is accommodated, a machine room separated from the cooking chamber, an exhaust assembly configured to discharge fluids inside the machine room to the outside, and a sensor assembly provided in the machine room and configured to measure the amount of steam of fluids which flow from the cooking chamber to the machine room by driving of the exhaust assembly.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: November 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Min Son, Byung Ik Choi, Jun Hoe Choi, Myoung Keun Kwon, Ji-Young Lee, Jeong Su Han
  • Method for providing multi number service
    Patent number: 10136307
    Abstract: A method for providing a multi number service using a universal integrated circuit card (UICC) comprises the steps of: according to a command received from the outside of a UICC, selecting any one subscriber identification information set among a plurality of subscriber identification information sets stored in a memory allocated to a subscriber identification information set managing application; and activating the selected subscriber identification information set.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: November 20, 2018
    Assignee: KONA I CO., LTD
    Inventors: Chung Il Cho, Sung Hwan Kim, Young Min Son, Chang Yong Choi, Joo Yeol Oh, Hyun Sung Hong
  • Method and apparatus for random access for multiple devices in wireless communication system
    Patent number: 10111254
    Abstract: A method for performing a random access by a device in a wireless communication system is provided. The method includes receiving a broadcast signal including location information which indicates each of at least two partial areas included in a transmission area of a preamble sequence, and transmitting the preamble sequence through one of the at least two partial areas on the basis of the broadcast signal.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hyuk-Min Son
  • APPARATUS FOR SUPPORTING OPTICAL REFLECTOR
    Publication number: 20180224088
    Abstract: An apparatus for supporting an optical reflector to change a path of light and introduce the light to a lens includes an inclined unit configured to support a reflective surface of the optical reflector; a guide wall formed at a side of the inclined unit to support a side surface of the optical reflector; a guide opening formed in the guide wall; and a support member made of a material different from the material of the optical reflector and inserted into the guide opening so that an inner surface of the support member is fixedly coupled to the side surface of the optical reflector.
    Type: Application
    Filed: January 3, 2018
    Publication date: August 9, 2018
    Applicant: JAHWA electronics Co., Ltd.
    Inventors: Chul Soon PARK, Jung Min SON, Min Gyu SUH
  • Dummy wafer, thin-film forming method, and method of fabricating a semiconductor device using the same
    Patent number: 10041170
    Abstract: Provided are a dummy wafer, a thin-film forming method, and a method of fabricating a semiconductor device using the same. The dummy wafer includes an insulating substrate with a first surface opposite a second surface, and a plurality of openings formed in the insulating substrate. The plurality of openings penetrate at least a portion of the insulating substrate in a direction from the first surface toward the second surface. The first and second surfaces of the insulating substrate, and an inner surface of each of the plurality of openings, include protrusions.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: August 7, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheolkyu Yang, Young-Jin Noh, Chulyoung Jang, Joongyun Ra, Dong-min Son
  • POWER MODULE HAVING DUAL-SIDED COOLING
    Publication number: 20180174945
    Abstract: A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.
    Type: Application
    Filed: June 30, 2017
    Publication date: June 21, 2018
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jun Hee PARK, Jeong Min SON
  • Display Panel and Organic Light-Emitting Diode Display Device Using the Same
    Publication number: 20180138256
    Abstract: A display panel and an OLED display device using the same are disclosed. The display panel includes an active region including data lines, gate lines crossing the data lines, and pixels arranged in a matrix, and a shift register arranged distributively in the active region and configured to supply a gate pulse to the gate lines.
    Type: Application
    Filed: November 10, 2017
    Publication date: May 17, 2018
    Inventors: In-Hyo HAN, Ki-Min SON, Kil-Hwan OH, Hae-Jin PARK, Kyung-Min KIM
  • SEMICONDUCTOR CHIP
    Publication number: 20180138137
    Abstract: A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on the bump region and the non-bump region of the semiconductor substrate. No bump is on the non-bump region. A thickness of the passivation layer in the bump region is thicker than a thickness of the passivation layer in the non-bump region. The passivation layer includes a step between the bump region and the non-bump region.
    Type: Application
    Filed: October 24, 2017
    Publication date: May 17, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeong-gi JIN, Nae-in Lee, Jum-yong Park, Jin-ho Chun, Seong-min Son, Ho-jin Lee