Abstract: A cooling apparatus includes a compressor; a condenser for condensing a refrigerant discharged from the compressor, an expansion valve to expand the refrigerant discharged from the condenser, and an evaporator to evaporate the refrigerant discharged from the expansion valve and to deliver the refrigerant to the compressor. The compressor includes a rotary compressor having a displacement volume less than about 3 cc, and refrigerant circulating inside the cooling apparatus includes at least one of R290, R600a, R123a, R1234yf, and R1234ze. The cooling apparatus and compressor attain miniaturization and high efficiency.

Abstract: Disclosed are a hybrid touch sensing electrode including first sensing patterns adhered to a first optical functional layer, and second sensing patterns adhered to a second optical functional layer, wherein the first and second optical functional layers have a dielectric constant/thickness value of 0.01 to 0.09 1/?m, respectively, and a sum of the dielectric constants of the first and second optical functional layers is 6 to 11, and thereby, the touch sensing electrode may be formed in a thin film structure with improved touch sensitivity while having reduced noise, as well as a touch screen panel including the same.

Abstract: Disclosed are a composite polarizing plate-integrated touch sensing electrode and a touch screen panel including the same. Specifically, disclosed are a composite polarizing plate-integrated touch sensing electrode including at least one sensing pattern formed on at least one surface of a composite polarizing plate to which a retarder and a polarizing plate are adhered by a coating method, thereby a thin structure may be implemented, and a touch screen panel including the same.

Abstract: The present invention relates to a polarizing-plate-integrated touch-sensing electrode. More specifically, the present invention relates to a polarizing-plate-integrated touch-sensing electrode including at least one sensing pattern disposed on at least one surface of the polarizing plate. The polarizing-plate-integrated touch-sensing electrode may implement a thin-film structure and have excellent visibility.

Abstract: A retarder-integrated touch-sensing electrode includes at least one sensing pattern formed on at least one surface of a retarder, wherein the difference in refractive index between the retarder and the sensing pattern disposed on the one surface of the retarder is about 0.8 or less. Accordingly, the retarder-integrated touch-sensing electrode implements a thin-film structure and has excellent visibility.

Abstract: A cooling apparatus includes a compressor; a condenser for condensing a refrigerant discharged from the compressor, an expansion valve to expand the refrigerant discharged from the condenser, and an evaporator to evaporate the refrigerant discharged from the expansion valve and to deliver the refrigerant to the compressor. The compressor includes a rotary compressor having a displacement volume less than about 3 cc, and refrigerant circulating inside the cooling apparatus includes at least one of R290, R600a, R123a, R1234yf, and R1234ze. The cooling apparatus and compressor attain miniaturization and high efficiency.

Abstract: An organic resin composition with a low coefficient of thermal expansion comprising (a) an organic resin and (b) an inorganic silicate containing alkali metals and alkaline earth metals in a total amount of 1,000 ppm or less.

Abstract: The present invention provides an anti-adhesion mechanism and a method of producing it and more particularly, it provides an anti-adhesion mechanism comprising a structure body, a resin binder layer comprising a resin binder coated on all or part of the surface of the structure body and a bead layer comprising a plurality of beads bond to the upper side of the coated resin binder layer and being salient outside, and a method of producing an anti-adhesion mechanism comprising coating a resin binder on the surface to be coated, spraying beads on the upper portion of the resin binder before the coated resin binder is hardened and hardening them to form bead protrusions.

Abstract: An organic resin composition with a low coefficient of thermal expansion comprising (a) an organic resin and (b) an inorganic silicate containing alkali metals and alkaline earth metals in a total amount of 1,000 ppm or less.

Abstract: A polishing pad conditioner cleaning method and an apparatus for effectively removing particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in a cleaning bath. The cleaning liquid is continuously supplied into the cleaning bath. An inert gas is injected into the cleaning liquid from a bottom of the cleaning bath. The injected inert gas bubbles the cleaning liquid, so that the particles sticking to the polishing pad conditioner are removed and overflow from the cleaning bath. The polishing pad conditioner is effectively cleaned, so that formation of particles and scratches on a wafer are reduced when a polishing process is subsequently carried out using the cleaned polishing pad conditioner.

Abstract: A polishing pad conditioner cleaning method and an apparatus for effectively removing particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in a cleaning bath. The cleaning liquid is continuously supplied into the cleaning bath. An inert gas is injected into the cleaning liquid from a bottom of the cleaning bath. The injected inert gas bubbles the cleaning liquid, so that the particles sticking to the polishing pad conditioner are removed and overflow from the cleaning bath. The polishing pad conditioner is effectively cleaned, so that formation of particles and scratches on a wafer are reduced when a polishing process is subsequently carried out using the cleaned polishing pad conditioner.

Abstract: A polishing pad conditioner cleaning method and an apparatus for effectively removing particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in a cleaning bath. The cleaning liquid is continuously supplied into the cleaning bath. An inert gas is injected into the cleaning liquid from a bottom of the cleaning bath. The injected inert gas bubbles the cleaning liquid, so that the particles sticking to the polishing pad conditioner are removed and overflow from the cleaning bath. The polishing pad conditioner is effectively cleaned, so that formation of particles and scratches on a wafer are reduced when a polishing process is subsequently carried out using the cleaned polishing pad conditioner.

Abstract: A polishing pad conditioner cleaning method and an apparatus for effectively removing particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in a cleaning bath. The cleaning liquid is continuously supplied into the cleaning bath. An inert gas is injected into the cleaning liquid from a bottom of the cleaning bath. The injected inert gas bubbles the cleaning liquid, so that the particles sticking to the polishing pad conditioner are removed and overflow from the cleaning bath. The polishing pad conditioner is effectively cleaned, so that formation of particles and scratches on a wafer are reduced when a polishing process is subsequently carried out using the cleaned polishing pad conditioner.