Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.

Abstract: A display device and a method of manufacturing the same are provided. The display device comprises a substrate comprising a display area in which emission areas are arranged, a main non-display area around the display area, a hole area surrounded by the display area, and an additional non-display area between the hole area and the display area; a circuit layer; a light emitting element layer; a sealing layer; a through portion in the hole area and penetrating at least the substrate; and sealing auxiliary structures in the additional non-display area and sequentially surrounding the hole area. Each of the sealing auxiliary structures comprises a first undercut portion in which a first cover layer protrudes from a first main layer; and a second undercut portion in which a second cover layer protrudes from a second main layer.

Abstract: An electric compressor capable of reducing a size and lightening weight of a package of an inverter unit, as a common mode choke (CM choke) is disposed radially outside of a circuit board of the inverter unit, and a high voltage connector, a CM choke, and a low voltage connector are integrated into a support body.

Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.

Abstract: The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.

Abstract: The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.