Abstract: Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.

Abstract: Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.