Patents by Inventor Min Sub Han

Min Sub Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming multi-level metal interconnection
    Patent number: 6372649
    Abstract: A method for forming a multi-level metal interconnection, comprising the step of forming a first metal interconnection over an underlying layer; forming an insulating layer having a selected thickness over the underlying layer including the first metal interconnection; etching the insulating layer to form a contact hole, thereby exposing the first metal interconnection; forming a metal plug in the contact hole to contact with the first metal interconnection; etching the insulating layer by a portion of the selected thickness; forming a pair of metal spacers in sidewalls of the metal plug over the insulating layer; and forming a second metal interconnection over the insulating layer to contact with the first metal interconnection through one of the metal spacers.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: April 16, 2002
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Min Sub Han, Tae Gook Lee, Wan Soo Kim, Byoung Ju Kang