Patents by Inventor Min Suh Park

Min Suh Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing the same
    Patent number: 8742551
    Abstract: A semiconductor package including: a lead frame including a chip attachment unit and a lead unit; a semiconductor chip that is mounted on the chip attachment unit of the lead frame; a wire that electrically connects the semiconductor chip to the lead unit; an insulation layer formed in the lead frame under the chip attachment unit; and an encapsulant that seals an upper portion of the lead frame, the semiconductor chip, and the wire, wherein the lead unit does not protrude to the outside of the encapsulant.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: June 3, 2014
    Assignee: STS Semiconductor & Telecommunications Co., Ltd
    Inventor: Min Suh Park