Abstract: A method includes forming a composite package substrate. The formation of the composite package substrate includes encapsulating an interconnect die in an encapsulant, with the interconnect die including a plurality of through-vias therein, and forming a first plurality of redistribution lines (RDLs) and a second plurality of RDLs on opposite sides of the interconnect die. The method further includes bonding an organic package substrate to the composite package substrate, and bonding a first package component and a second package component to the first plurality of RDLs. The first package component and the second package component are electrically interconnected through the interconnect die and the first plurality of RDLs.

Abstract: A hard drive backplane has a plurality of ventilation holes, and the expansion cavity muffler is mounted in the ventilation holes of the hard drive backplane. The expansion cavity muffler includes at least one expansion cavity and at least one connecting pipe in communication in a first direction. The connecting pipe at one end of the expansion cavity muffler facing toward the hard drive backplane is fixedly mounted in the ventilation hole such that the expansion cavity muffler is in communication with the ventilation hole. An area of a cross-section that is of each expansion cavity and that is perpendicular to the first direction is larger than an area of a cross-section that is of the connecting pipe adjacent to the expansion cavity and that is perpendicular to the first direction. The first direction is perpendicular to a surface of the hard drive backplane.

Abstract: An assembly including at least one semiconductor die and an interposer is provided. A packaging substrate including substrate bonding pads is provided. The packaging substrate includes a first horizontal surface facing the assembly, a second horizontal surface located on an opposite side of the first horizontal surface, and an opening extending between the first horizontal surface and the second horizontal surface. The assembly is attached to the packaging substrate by bonding first solder material portions bonded to a respective one of the substrate bonding pads and to a respective one of first interposer bonding pads located on the interposer.

Abstract: A semiconductor device includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer of the semiconductor device includes a standard-gate field-effect transistor. The second semiconductor layer of the semiconductor device includes an extended-gate field-effect transistor. The first semiconductor layer and the second semiconductor layer are formed on top of one another.

Abstract: The present disclosure relates to methods, devices, and systems for invoking a capability of another device. In one example method, a source end device requests capability information of a sink end device. The sink end device sends the capability information to the source end device. The source end device sends first content and first request information to the sink end device when detecting a first operation of a user, where the first request information is used to request the sink end device to process the first content by using a first function. The sink end device processes the first content based on the first request information by using the first function, and sends a processing result of the first content to the source end device. The source end device prompts the user with the processing result.

Abstract: A semiconductor package includes a circuit board structure, a first redistribution layer structure and first bonding elements. The circuit board structure includes outermost first conductive patterns and a first mask layer adjacent to the outermost first conductive patterns. The first redistribution layer structure is disposed over the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure. In some embodiments, at least one of the first bonding elements covers a top and a sidewall of the corresponding outermost first conductive pattern.

Abstract: A photo mask for an extreme ultraviolet (EUV) lithography includes a mask alignment mark for aligning the photo mask to an EUV lithography tool, and sub-resolution assist patterns disposed around the mask alignment mark. A dimension of the sub-resolution assist patterns is in a range from 10 nm to 50 nm.

Abstract: A wet etching chemistry to selectively remove a polymer residue on an opening embedded in a low-k dielectric layer and an underlying stop layer in a process of forming an interconnect structure is provided. The wet etching chemistry includes: two type of organic solvents, wherein a concentration of the two type of organic solvents is greater than or equal to 70%; an Alkali source amine, at least comprising a tertiary amine; an inhibitor; and water. In some embodiment, the wet etching chemistry is free of a peroxide to avoid damage to the WdC hard mask.

Abstract: Described are a self-healing composition, and a preparation method for and an application of the composition. The composition is of a core-shell structure; the core contains a hydrogenated styrenic thermoplastic elastomer polymer and an inorganic filler; the shell contains a hydrophilic polymer; the composition has a density of 1.2-2 g/cm3, a water contact angle of no more than 90°, and a diesel oil and/or natural gas absorption expansion ratio of 5-15 times. By coating the hydrogenated styrenic thermoplastic elastomer and the inorganic filler with the hydrophilic (surface polarized) polymer, a core-shell structure is formed. When the composition is used for well cementing in an oil/gas field, the composition has a density and compatibility matching cement mortar and thus can form a uniform and stable cement slurry for well cementing in the oil/gas field, and has excellent oil/gas absorption expansion performance and thus can expand after absorbing oil/gas to perform self-healing.

Abstract: The present disclosure relates to an electronic device, a method, and a storage medium for a wireless communication system. Various embodiments regarding resource allocation and management for sidelink communication are described. In an embodiment, an electronic device for a first terminal device includes a processing circuit configured to: search for time-frequency resources based on at least two allocation modes to obtain a candidate resource set; select a time-frequency resource from the candidate resource set; and notify a second terminal device of the selected time-frequency resource to be used for sidelink communication with the second terminal device. The processing circuit is further configured to send resource selection information to a base station, where the resource selection information indicates whether a specified resource is selected.

Abstract: Methods for uplink transmission using a preconfigured uplink resource are provided. One embodiment of the subject application provides a method performed by a user equipment, including receiving a first preconfigured uplink resource configuration and one or more preconfigured uplink resource indications, and initiating an uplink transmission according to the first PUR configuration and the one or more PUR indications. Related apparatuses are also disclosed.

Abstract: The invention provides novel imidazole pyrazole derivatives having the general formula (I), and pharmaceutically acceptable salts thereof, wherein R1-R7 are as described herein: Further provided are pharmaceutical compositions including the compounds, processes of manufacturing the compounds and methods of using the compounds as medicaments, in particular methods of using the compounds as antibiotics for the treatment or prevention of bacterial infections and resulting diseases.

Abstract: A mobile device supports carrier phase based positioning using positioning signals received from positioning signals from a plurality of satellites in a satellite positioning system (SPS). In the presence of a discontinuous carrier phase, e.g., if a cycle slip is detected, the mobile device is configured to generate a continuous carrier phase using the device history of the mobile device. The mobile device, for example, may track the carrier phase of positioning signals and determine a position estimate for the mobile device at a first time. If a cycle clip of the carrier phase is detected at a second time, the mobile device resolves the integer ambiguity in the carrier phase at the second time based on the carrier phase and position estimate for the mobile device from the first time.

Abstract: The present disclosure provides a method for crystal growth. The method may include at one of the following operations: weighing reactants for growing an oxide crystal after a first preprocessing operation is performed on the reactants; placing the reactants, on which a second preprocessing operation has been performed, into a crystal growth device after an assembly preprocessing operation is performed on at least one component of the crystal growth device, wherein the at least one component of the crystal growth device includes a crucible, the assembly preprocessing operation includes at least one of a coating operation, an acid soaking and cleaning operation, or an impurity cleaning operation; introducing a protective gas into the crystal growth device after sealing the crystal growth device; activating the crystal growth apparatus to execute the crystal growth; and adding reactant supplements into the crystal growth device in real-time during the crystal growth.

Abstract: An integrated optical circulator comprising at least two single-fiber bidirectional optical fiber interfaces (1), a refractive element group (2), an optical isolation element group (3), and an optical fiber array (4), wherein the refractive element group (2) and the optical isolation element group (3) are sequentially arranged on a same optical path; an incident signal light from each single-fiber bidirectional optical fiber interface (1) sequentially passes through the refractive element group (2) and the optical isolation element group (3), then is output by a corresponding outgoing optical fiber (43, 44) of the optical fiber array (4); the incident signal light from each incident optical fiber (41, 42) of the optical fiber array (4) sequentially passes through the optical isolation element group (3) and the refractive element group (2), and is output by the corresponding single-fiber bidirectional optical fiber interface (1).

Abstract: A riding lawn mower includes a seat, a chassis configured to support the seat, a cutting assembly mounted to the chassis, a walking assembly configured to drive the riding lawn mower to walk on a plane, and a steering wheel assembly. The steering wheel assembly includes a steering wheel operable by the user and a connecting rod configured to connect the steering wheel and the chassis. The steering wheel assembly further includes a pivot assembly that rotatably connects the connecting rod and the chassis, and the pivot assembly enables the steering wheel assembly to switch between a working position and a storage position. A distance between the steering wheel and the plane when the steering wheel assembly is in the storage position is smaller than a distance between the steering wheel and the plane when the steering wheel assembly is in the working position.

Abstract: A security chip-based security authentication method and system, a security chip, and a readable storage medium are provided. The security authentication method includes: a security chip sending a key acquisition request to an auxiliary chip in response to a security authentication request sent by an upper computer ; the auxiliary chip sending, to the security chip, first ciphertext data formed by encrypting a security key in response to the key acquisition request; the security chip decrypting the first ciphertext data to obtain the security key, and performing security authentication with the upper computer in combination with code table data stored on the chip. The security key and the code table data required for security authentication are respectively stored into the security chip and the auxiliary chip.

Abstract: The present disclosure relates to an electronic device, a method, and a storage medium for a wireless communication system. Various embodiments of mobility management for multiple transmission and reception points (multi-TRP) are described. In an embodiment, an electronic device for a first TRP includes a processing circuit, where the processing circuit is configured to: in response to that the first TRP and the second TRP are a master TRP and a secondary TRP respectively serving a terminal device, provide measurement configuration information to the terminal device, receive a measurement report from the terminal device, and update TRPs serving the particular terminal device based at least on measurement quality of the first TRP and the second TRP.

Abstract: A package structure of an embedded power module includes a top insulation layer, a top metal pattern layer, a solder layer, a device layer, a bottom metal pattern layer and a bottom insulation layer sequentially arranged from top to bottom. The device layer includes at least two MOSFET bare dies and several metal connection blocks, and is filled with insulation filler to isolate the MOSFET bare dies and the metal connection blocks from each other. The drain electrodes of the bare dies are connected with the top metal pattern layer through the solder layer, and the source electrodes and the gate electrodes of the bare dies are electrically connected to the bottom metal pattern layer, respectively. The upper and lower surfaces of the metal connection blocks are electrically connected to the top metal pattern layer and the bottom metal pattern layer, respectively.

Abstract: The present disclosure relates to a device and a method for displaying videos. Specifically, the present disclosure provides an electronic device for displaying videos. The electronic device includes: a processor and a memory. The memory is coupled to the processor and includes an executable instruction stored thereon.