Abstract: Leadframe for a semiconductor package and manufacturing from such leadframe including a plurality of connection leads supported in a frame. Die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads which are electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is connected to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and supports the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.

Abstract: A method to assemble a non-leaded semiconductor package is disclosed. In one embodiment, a carrier tape is attached to a metal foil. A plurality of leadframes are formed in the metal foil, each leadframe including a die pad laterally surrounded by a plurality of contact leads. A semiconductor die, including an active surface with a plurality of die contact pads, is attached to each die attach pad and electrically connected to the leadframe by a plurality of bond wires connecting the die contact pads and the lead contact areas of the contact leads. A plurality of leadframes, each including a wire bonded semiconductor die, are encapsulated with mold material. The carrier tape is removed and the non-leaded semiconductor packages separated.

Abstract: A method to assemble a non-leaded semiconductor package (1) comprises the following steps. A carrier tape (13) is attached to a metal foil (12). A plurality of leadframes (3) is formed in the metal foil (12), each leadframe (3) comprising a die pad (4) laterally surrounded by a plurality of contact leads (5). A semiconductor die (2), including an active surface with a plurality of die contact pads (7), is attached to each die attach pad (4) and electrically connected to the leadframe (3) by a plurality of bond wires (9) connecting the die contact pads (7) and the lead contact areas (6) of the contact leads (5). A plurality of leadframes (3), each including a wire bonded semiconductor die, are encapsulated with mold material (10). The carrier tape (13) is removed and the non-leaded semiconductor packages (1) separated.

Abstract: A leadframe for a semiconductor package and a semiconductor package manufactured from such a leadframe including a plurality of connection leads supported in a frame. A die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads with each support lead electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is designed for connection to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and is arranged to support the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.