Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.

Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool a heat generating electronic component that generates heat during operation, the evaporator including: a body including an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a copper powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a surface of the sintered wick, wherein the additional layer is formed by sintering copper particles having a size smaller than that of the copper powder forming the sintered wick, and the working fluid moved from the sintered wick is changed in a vapor state to be discharged.

Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.

Abstract: Provided is a method of manufacturing an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to a method of manufacturing an evaporator for a loop heat pipe system which provides a simple manufacturing process capable of improving a contact state between a sintered wick and a heating plate.

Abstract: An evaporator for a loop heat pipe (LHP) system. The evaporator an evaporator body for accommodating a sintered wick formed by sintering metal powders, a discharging hole for discharging a working fluid filled into voids formed between particles of the sintered wick and changed into a vapor due to being heated, and an inlet hole for introducing the working fluid changed into a liquid; a first chamber portion coupled to a side of the inlet hole, and including an inlet for introducing the working fluid in a liquid phase, and an accommodation space portion for accommodating the working fluid in a liquid phase; and a capillary structure that is porous and that is inserted into the accommodating space portion, wherein the working fluid in a liquid phase introduced through the inlet is introduced to the evaporator body through the capillary structure.

Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler. Accordingly, the air drawn by the cooling fans is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler, thereby cooling the notebook computer.

Abstract: An evaporator for a looped heat pipe (LHP) system, the evaporator including a plurality of wicks having pores formed therein; a plurality of heat transferring fins respectively having a wick coupler to be coupled to one of the plurality of wicks; a plurality of unit assemblies formed by respectively coupling each of the wicks and each of the heat transferring fins; an assembly structure formed by horizontally disposing the unit assemblies to enable a bottom surface of each of the unit assemblies to be located on a planar surface; a heat transferring plate coupled to a bottom part of the assembly structure; and a covering member coupled to the heat transferring plate.

Abstract: Provided is a method of manufacturing an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to a method of manufacturing an evaporator for a loop heat pipe system which provides a simple manufacturing process capable of improving a contact state between a sintered wick and a heating plate.

Abstract: Provided is an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to an evaporator having an increased contact area between a sintered wick and a heating plate.

Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler.