Abstract: A polymer separator with improved charge and discharge performance and thermal stability, includes a porous polymer substrate and a coating layer formed on at least one surface of the porous polymer separator. The coating layer includes: functional group bonded to double bond-containing PVDF (DPVDE); and inorganic oxide particles bonded to the functional group.

Abstract: A method for refining waste plastic pyrolysis oil is provided, including: applying a voltage to a first mixed solution obtained by mixing waste plastic pyrolysis oil, washing water, and a demulsifier to dehydrate the first mixed solution to form a dehydrated first mixed solution; and hydrotreating a second mixed solution obtained by mixing the dehydrated first mixed solution dehydrated and a sulfur source to produce refined oil from which impurities have been removed, and a device related thereto. The method and device may prevent or minimize formation of an ammonium salt (NH4Cl) and/or prevent adhesion of impurity particles in a refining process of waste plastic pyrolysis oil containing impurities such as chlorine and nitrogen, and provides waste plastic pyrolysis oil having low content of impurities and olefins and excellent quality, and thus, may be used as a feedstock for blending with existing petroleum products or oil refining and petrochemical processes.

Abstract: An image decoding method comprises the steps of: obtaining a current coding tree unit (CTU) of a first size configuring a current picture; determining whether to implicitly divide the current coding tree unit; dividing the current coding tree unit into one or more coding units (CUs) based on the determination; obtaining, from a bitstream, division information for a current coding unit among the one or more coding units; and dividing and decoding the current coding unit..

Abstract: Disclosed are a method and device for managing a project by using a data pointer. A project is efficiently operated by dividing a project based on a minimum unit task and designing a plurality of child projects connected in sequential order such that a plurality of child projects proceed in order.

Abstract: Proposed is a device for assembling and disassembling a top nozzle of a nuclear fuel assembly wherein the top nozzle of the nuclear fuel assembly is assembled and disassembled with improved convenience, and the load value is measured to ensure stable operations without damaging components. To this end, the device includes a pedestal including a threaded hole through both sides, a screw bar screw-coupled to the threaded hole to reciprocate in a straight line, a top nozzle plate configured to be detachably coupled to the screw bar and to be able to be hooked by and coupled to the top nozzle of the nuclear fuel assembly, and a load cell provided between the top nozzle plate and the screw bar to measure a load value applied to the top nozzle plate hooked on the top nozzle.

Abstract: A semiconductor device includes a first substrate having a first surface and a second opposite surface, a first lower interlayer insulating layer on the second surface, a first active pattern including a first lower pattern contacting the first surface, a plurality of first sheet patterns spaced apart from the first lower pattern in a second direction, a first gate structure on the first lower pattern, a first source/drain pattern on a side of the first gate structure, a second lower interlayer insulating layer including a third surface and a fourth opposite surface, a second active pattern including a second lower pattern contacting the third surface, a plurality of second sheet patterns spaced apart from the second lower pattern in the second direction, a second gate structure on the second lower pattern, wherein the first lower pattern has a first height, and the second lower pattern has a second different height.

Abstract: The present disclosure relates to a hydrophilic modified polymer membrane and a method for fabricating the same, and more specifically, to a polymer membrane dip-coated with double bond-containing PVDF (DPVDF) and modified to be hydrophilic by reaction with a polymer or monomer containing an amine group, and a method of fabricating the same. The polymer membrane of the present disclosure is fabricated by physically coating a porous polymer substrate by dip coating with DPVDF, and then chemically modifying the surface of the dip-coated substrate to be hydrophilic using a polymer or monomer containing an amine group. That is, the polymer membrane is fabricated by performing both physical coating and chemical coating so that the dissolution of inorganic particles in the membrane can be further suppressed.

Abstract: In one example, an electronic device comprises a first substrate comprising a first dielectric structure and a first conductive structure, a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure, a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure, a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure, and a first electronic component coupled with an outward side of the first substrate. The first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure. Other examples and related methods are also disclosed herein.

Abstract: An electronic device includes a substrate comprising outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and a substrate conductive structure. The substrate conductive structure includes a grounded path and a powered path. An electronic component is coupled to the substrate top side. An encapsulant covers the electronic component and the substrate top side. The encapsulant includes apertures and the powered path is exposed by the apertures. A first network structure includes a first network cover over the encapsulant. and first network interconnects coupled to the first network cover and the powered path through the apertures. A second network structure includes a second network cover having a second cover ceiling and second cover sidewalls extending from the second cover ceiling; and a second network contact coupled to the second network cover and the grounded path.

Abstract: An electronic device includes a substrate comprising outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: In one example, an electronic device includes a substrate comprising a substrate top side, a substrate bottom side, and outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: In one example, an electronic device includes a substrate comprising a substrate top side, a substrate bottom side, and outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.

Abstract: The present invention relates to a superconducting magnet apparatus using movable iron core and induction heating apparatus thereof. The superconducting magnet structure is composed by including a pair of superconducting magnets and a pair of movable iron cores which are symmetrically located with respect to the heating target product located between the superconducting magnets and a part of which move through the cutouts of the superconducting magnets. And the distance from the superconducting magnets is adjusted by moving the movable iron cores. Further, the present invention manufactures an induction heating apparatus by using the superconducting magnet structure.

Abstract: The present disclosure relates to a flexible support apparatus for superconducting magnet in superconducting rotating machine. The present disclosure relates to a flexible support apparatus for superconducting magnet in superconducting rotating machine that includes a superconducting magnet that is located in a rotor body of a superconducting rotating machine, a vacuum container that internally stores the superconducting magnet, a first support that supports the superconducting magnet by being internally attached to the vacuum container, a third support that supports the superconducting magnet by being externally attached to the superconducting magnet, and a second support that is located between the first support and the second support and that supports the superconducting magnet by including a flexible material.

Abstract: The present disclosure relates to a flexible support apparatus for superconducting magnet in superconducting rotating machine. The present disclosure relates to a flexible support apparatus for superconducting magnet in superconducting rotating machine that includes a superconducting magnet that is located in a rotor body of a superconducting rotating machine, a vacuum container that internally stores the superconducting magnet, a first support that supports the superconducting magnet by being internally attached to the vacuum container, a third support that supports the superconducting magnet by being externally attached to the superconducting magnet, and a second support that is located between the first support and the second support and that supports the superconducting magnet by including a flexible material.

Abstract: The present invention relates to a superconducting magnet apparatus using movable iron core and induction heating apparatus thereof. The superconducting magnet structure is composed by including a pair of superconducting magnets and a pair of movable iron cores which are symmetrically located with respect to the heating target product located between the superconducting magnets and a part of which move through the cutouts of the superconducting magnets. And the distance from the superconducting magnets is adjusted by moving the movable iron cores. Further, the present invention manufactures an induction heating apparatus by using the superconducting magnet structure.

Abstract: Provided are a three-phase coaxial superconducting power cable and a structure thereof. A certain space is formed between adjacent superconducting wires of a superconducting layer (disposed at an outer portion) having more superconducting wires among a plurality of superconducting layers, and another wire is disposed in the space, or the superconducting wires of the respective superconducting layers are disposed to have different critical currents. Accordingly, a waste of superconducting wires is prevented, and the optimized three-phase coaxial superconducting power cable is provided.

Abstract: Provided are a three-phase coaxial superconducting power cable and a structure thereof. A certain space is formed between adjacent superconducting wires of a superconducting layer (disposed at an outer portion) having more superconducting wires among a plurality of superconducting layers, and another wire is disposed in the space, or the superconducting wires of the respective superconducting layers are disposed to have different critical currents. Accordingly, a waste of superconducting wires is prevented, and the optimized three-phase coaxial superconducting power cable is provided.

Abstract: The present invention relates to an apparatus and method for measuring the critical current of a superconducting tape. A continuous critical current measurement apparatus for measuring critical current of a superconducting tape while feeding a superconducting tape in a liquid nitrogen container includes wheel-type current terminals and wheel-type voltage terminals. The superconducting tape is continuously supplied and fed by a reel-to-reel device, and the critical current of the superconducting tape is measured in real time using the wheel-type current terminals and the wheel-type voltage terminals while the superconducting tape is fed at constant linear velocity in contact with the wheel-type current terminals and the wheel-type voltage terminals.