Abstract: A light adjusting sheet includes a base and a first light adjusting structure layer. The base includes a first surface and a second surface opposite to the first surface. The first light adjusting structure layer is disposed on the first surface of the base, and the first light adjusting structure layer includes a plurality of light adjusting structures. Each light adjusting structure includes a major axis, a minor axis and a thickness, wherein the major axis of the light adjusting structure is in parallel with an extending direction. A ratio of a length of the minor axis to a length of the major axis is between 0.093 and 0.6, and the thickness is between 2 ?m to 6 ?m. A backlight module using the light adjusting sheet can achieve high brightness and large viewing angle.

Abstract: A light adjustment film is provided. The light adjustment film includes a substrate and a first light adjustment structure layer. The substrate has a first surface and a second surface opposite to each other. The first light adjustment structure layer is disposed on the first surface of the substrate. The first light adjustment structure layer includes a plurality of light adjustment structures. Each of the light adjustment structures has a long axis, a short axis and a thickness. The long axis of the light adjusting structures is parallel to an extending direction. The light adjusting structures are composed of at least 100 types of structures having different shapes from each other. A backlight module having the aforementioned light adjustment film is also provided.

Abstract: A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Abstract: A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

Abstract: A light adjusting sheet includes a base and a first light adjusting structure layer. The base includes a first surface and a second surface opposite to the first surface. The first light adjusting structure layer is disposed on the first surface of the base, and the first light adjusting structure layer includes a plurality of light adjusting structures. Each light adjusting structure includes a major axis, a minor axis and a thickness, wherein the major axis of the light adjusting structure is in parallel with an extending direction. A ratio of a length of the minor axis to a length of the major axis is between 0.093 and 0.6, and the thickness is between 2 mm to 6 mm. A backlight module using the light adjusting sheet can achieve high brightness and large viewing angle.

Abstract: A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Abstract: A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

Abstract: A method of reworking an integrated circuit device is described. A substrate having a dielectric layer, a barrier layer, a conductive layer and an anti-reflective layer formed thereon, is provided. The method of reworking the barrier layer, the conductive layer and the anti-reflective layer comprises removing the anti-reflection layer by performing a dry etching process, removing the conductive layer by performing a wet etching process, and then removing the barrier layer by performing a chemical machine polishing process.

Abstract: A method of reworking an integrated circuit device is described. A substrate having a dielectric layer, a barrier layer, a conductive layer and an anti-reflective layer formed thereon, is provided. The method of reworking the barrier layer, the conductive layer and the anti-reflective layer comprises removing the anti-reflection layer by performing a dry etching process, removing the conductive layer by performing a wet etching process, and then removing the barrier layer by performing a chemical machine polishing process.

Abstract: The UV resin used in the present invention is spread on the surface of a mother mold with lines. Illuminate UV light to harden the UV resin after it penetrated the lines completely. Thereby, to the depth and the shape of the lines of a pattern with deep lines, a complete duplication can be obtained in order to solve the deficiency of mother plate manufacturing technique at present. A seam between two mother plates is more smooth and has less influence on the lines structures at two sides thereof when a plurality of mother plate units are assembled to a big mother plate. The present invention provides an easy and novel plates assembly technique that gives consideration to both the lines in succeeding electroplating and impression procedures and required flatness for seams. Thereby, a seam between two mother plates is more smooth and has less influence on the lines structures at two sides thereof when a plurality of mother plate units are assembled to a big mother plate.