Patents by Inventor Min-Yi Lee

Min-Yi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11937440
    Abstract: The present invention may provide an organic electroluminescent device which exhibits low driving voltage as well as high efficiency by including an electron transporting layer material having an improved electron transporting ability.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: March 19, 2024
    Assignee: SOLUS ADVANCED MATERIALS CO., LTD.
    Inventors: Song Ie Han, Min Sik Eum, Jae Yi Sim, Yong Hwan Lee, Woo Jae Park, Tae Hyung Kim
  • Patent number: 11917910
    Abstract: The present invention relates to a novel organic compound and an organic electroluminescent device using the same, and more particularly, to a novel compound having excellent electron transport capability and light emitting capability, and an organic electroluminescent device improved in terms of luminous efficiency, driving voltage, lifespan, etc. by including the novel compound in one or more organic layers.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: February 27, 2024
    Assignee: SOLUS ADVANCED MATERIALS CO., LTD.
    Inventors: Yong Hwan Lee, Min Sik Eum, Jae Yi Sim, Woo Jae Park, Song Ie Han
  • Patent number: 8810261
    Abstract: An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: August 19, 2014
    Assignee: TPK Touch Solutions Inc.
    Inventor: Min-Yi Lee
  • Publication number: 20130337476
    Abstract: Disclosed herein is a method for the detection or preliminary screening of coronary artery disease, including: obtaining a urine sample from a human subject suspected of having coronary artery disease; detecting a level of sCD14 in the urine sample from the human subject suspected of having coronary artery disease; and comparing the detected level of sCD14 in the urine sample with a predetermined standard, wherein the level of sCD14 in the urine sample from the human subject suspected of having coronary artery disease greater than the predetermined standard is indicative of the presence of coronary artery disease.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 19, 2013
    Inventors: Min-Yi Lee, Shyh-Horng Chiou, Wen-Jen Chen
  • Publication number: 20120138451
    Abstract: An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module.
    Type: Application
    Filed: February 14, 2012
    Publication date: June 7, 2012
    Inventor: MIN-YI LEE
  • Patent number: 8143905
    Abstract: An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: March 27, 2012
    Assignee: TPK Touch Solutions Inc.
    Inventor: Min-Yi Lee
  • Publication number: 20110186422
    Abstract: An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module.
    Type: Application
    Filed: April 13, 2011
    Publication date: August 4, 2011
    Inventor: MIN-YI LEE
  • Patent number: 7977953
    Abstract: An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
    Type: Grant
    Filed: December 22, 2007
    Date of Patent: July 12, 2011
    Assignee: TPK Touch Solutions Inc.
    Inventor: Min-Yi Lee
  • Publication number: 20090101489
    Abstract: An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module.
    Type: Application
    Filed: December 22, 2007
    Publication date: April 23, 2009
    Inventor: Min-Yi Lee
  • Publication number: 20090090000
    Abstract: An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode.
    Type: Application
    Filed: December 22, 2007
    Publication date: April 9, 2009
    Inventors: Sheng-Pin SU, Min-Yi Lee