Abstract: Methods, systems, and computer programs are presented for eliminating bias while training an ML model using training data that includes past experimental data. One method includes accessing experiment results, for A/B testing of a first model, that comprise information regarding engagement with a first set of items presented to users, each item being presented within an ordered list of results. A position bias is calculated for positions within the ordered list of results where the items were presented. A machine-learning program is trained to obtain a second model using a training set comprising values for features that include the calculated position bias. The method includes detecting a second set of items to be ranked for presentation to a first user, and calculates, using the second model, a relevance score for the second set of items, which are ranked based on the respective relevance score and presented on a display.

Abstract: Disclosed is a secondary battery including a case configured to surround an exterior of an electrode assembly, and a strain sensor attached to an exterior of the case to detect deformation of the case. The strain sensor may include a backing part attached to the exterior of the case; a strain gauge installed on the backing part and formed of single-crystal silicon; a wiring part stacked on the backing part, along with the strain gauge, and electrically connected to the strain gauge; and an encapsulation part fixed to the backing part while surrounding the strain gauge and the wiring part excluding a portion of the wiring part.

Abstract: An interaction control method for detecting a default object in a real-time image and an electronic device are introduced. The method includes steps of image recognition, interaction area setting, movement detection, and playing execution, wherein a default object, a reference object and a setting object are recognized by artificial intelligence in the real-time image, and the electronic device triggers a preset instruction corresponding to the interaction content corresponding to an interaction area by artificial intelligence to recognize a preset instruction corresponding to the interaction content of an interaction area, and the electronic device executes the preset instruction to play a sound response. A terminal device in communication connection with an electronic device and a non-transitory computer-readable recording medium are further provided.

Abstract: A polybutylene adipate terephthalate resin composition, and a method for preparing the same. The polybutylene adipate terephthalate resin composition includes a polybutylene adipate terephthalate resin, a chain extender, and a gel reducer. The polybutylene adipate terephthalate resin composition suppresses gel formation during the preparation process, and exhibits excellent mechanical properties and external appearance.

Abstract: The invention provides a waste gas purification apparatus and residual heat utilization and control device for intelligent printing and dyeing waste gas. The apparatus includes: a circulating water storage tank; a liquid circulation tank; a water filtration system, connected to the storage tank; a bubble generation device, connected to the storage tank; and an organic waste gas removal device. An upper end of the waste gas removal device is connected to the bubble generation device and the liquid circulation tank, and a lower end is connected to the liquid circulation tank. The utilization and control device includes a residual heat cascade utilization unit, a spraying unit, a composite pulse static absorption column unit, a twin-stage high-temperature water white smoke elimination unit, and an air discharge unit sequentially disposed in a waste gas flow direction, and includes an oil-water separation box, a sodium chloride electrolysis device, and the purification apparatus.

Abstract: In a semiconductor structure, a first conductive feature is formed in a trench by PVD and a glue layer is then deposited on the first conductive feature in the trench before CVD deposition of a second conductive feature there-over. The first conductive feature acts as a protection layer to keep silicide from being damaged by later deposition of metal or a precursor by CVD. The glue layer extends along the extent of the sidewall to enhance the adhesion of the second conductive features to the surrounding dielectric layer.

Abstract: The invention provides a waste gas purification apparatus and residual heat utilization and control device for intelligent printing and dyeing waste gas. The apparatus includes: a circulating water storage tank; a liquid circulation tank; a water filtration system, connected to the storage tank; a bubble generation device, connected to the storage tank; and an organic waste gas removal device. An upper end of the waste gas removal device is connected to the bubble generation device and the liquid circulation tank, and a lower end is connected to the liquid circulation tank. The utilization and control device includes a residual heat cascade utilization unit, a spraying unit, a composite pulse static absorption column unit, a twin-stage high-temperature water white smoke elimination unit, and an air discharge unit sequentially disposed in a waste gas flow direction, and includes an oil-water separation box, a sodium chloride electrolysis device, and the purification apparatus.

Abstract: Embodiments of the present disclosure relate to a method, system, and computer program product for domain adaptation. According to the method, a source model of a source domain is obtained, where the source model is trained to generate a label indicating a predicted category of data from the source domain. A training sample from a target domain is obtained, where the training sample comprises training data from the target domain and a true label indicating a true category of the training data from the target domain. A first label is generated for the training data by using the source model. The first label indicates a predicted category of the training data. A target model of the target domain is trained based on the training data, the true label and the first label.

Abstract: The present invention provides a polymer molecule, a monomeric structure and a polymeric structure comprising same, a related product, a preparation method, and uses. A polymer blocking the binding to a receptor is formed by the polymerization effect of the polymer molecule, thus effectively increasing the binding capability with respect to a virus. The polymer molecule is characterized in that: multiple binding-blocking molecular units used for blocking the binding between the virus and a cell receptor are polymerized into the polymeric structure.

Abstract: A battery module includes a plurality of battery cells, a first bracket disposed to top surfaces of the plurality of the battery cells, a second bracket disposed to bottom surfaces of the plurality of the battery cells, a plurality of first connecting plates disposed to a top surface of the first bracket, a plurality of second connecting plates and two third connecting plates. Each first connecting plate has a plurality of first slits. The plurality of the second connecting plates are disposed to a bottom surface of the second bracket. Each second connecting plate has a plurality of second slits. The two third connecting plates are disposed to two opposite sides of the first bracket. Each third connecting plate has a plurality of third slits.

Abstract: A zone heater assembly of a reflow solder tool includes a gas deflector having a single-layer structure. The single-layer structure may include one or more gas-permeating patterns through which a process gas is to flow from one or more gas outlets to a gas exhaust of the zone heater assembly. The one or more gas-permeating patterns in the single-layer structure promote uniformity of gas flow through the gas exhaust and into a heating zone of the reflow solder tool. The uniformity of the gas flow of the process gas enables convection heat provided by the process gas to be uniformly distributed across the heating zone. In this way, the gas deflector described herein may decrease hot spots and/or cold spots in the heating zone, which enables greater flexibility in placement of semiconductor package substrates on a conveyor device of the reflow solder tool.

Abstract: A semiconductor structure includes a conductive layer, an IMD layer and a plurality of protrusions. The IMD layer is formed on the conductive layer and has a first etch rate. Each protrusion includes an etching slowing layer, a lower electrode and a MTJ layer, wherein the etching slowing layer is formed on the IMD layer and has a second etch rate, the lower electrode passes through the IMD layer and the etching slowing layer, and the MTJ layer is formed on the lower electrode. The second etch rate is less than the first etch rate.

Abstract: Disclosed in embodiments of the present disclosure are a communication terminal, a communication system and an audio information processing method, the communication terminal includes a sound reception assembly and a basic communication module, wherein the basic communication module of the communication terminal receives second pickup audio information in a wireless manner, such that the communication terminal acquires returned audio information according to first pickup audio information generated by the communication terminal and the received second pickup audio information, and transmits outwards the returned audio information. Therefore, the technical solution in the embodiments of the present disclosure may realize synchronous sound reception of a plurality of wireless sound reception apparatuses or wireless sound reception components, and may satisfy a requirement for multiple people to use, thereby achieving a good sound reception effect.

Abstract: A semiconductor structure includes a substrate component, an IC die component over the substrate component, and a composite redistribution structure interposed between and electrically coupled to the substrate and IC die components. The composite redistribution structure includes a local interconnect component between a first redistribution structure overlying the substrate component and a second redistribution structure underlying the IC die component, and an insulating encapsulation between the first and second redistribution structures and embedding the local interconnect component therein.

Abstract: A memory device includes multiple first memory cells each having a first terminal coupled to a first node and a second terminal coupled to a corresponding one in multiple first bit lines; multiple second memory cells each having a first terminal coupled to a second node and a second terminal coupled to a corresponding one in multiple second bit lines; and a driver circuit coupled between the first node and the second node, and configured to generate, in response to a first voltage at the first node, a second voltage at the second node when a memory operation is performed to one of the first memory cells. The first voltage and the second voltage have different polarity.

Abstract: Methods for reading a memory are provided. In response to a first address signal, a first signal is obtained according to first data of the memory and a second signal is obtained according to second data of the memory by a decoding circuit. Binary representation of the first signal is complementary to that of the second signal. A first sensing signal is provided according to a reference signal and the first signal and a second sensing signal is provided according to the reference signal and the second signal by a sensing circuit. An output corresponding to the first sensing signal or the second sensing signal is output in response to a control signal, by an output buffer.

Abstract: A positioning method for an electrical shelf label, a computer device, and a non-transitory computer readable storage medium. The method includes: obtaining, by a server, a candidate electronic shelf label with a fuzzy positioning result; sequentially executing, by each of the candidate-matching shelf label pairs, a distance measurement task according to the distance measurement instruction to obtain a measured distance between the candidate electronic shelf label and each of the matching electronic shelf labels; revising, by the server, the fuzzy positioning result of the candidate electronic shelf label based on all the measured distances to determine an actual positioning result for the candidate electronic shelf label.

Abstract: The present disclosure provides a system for signal optimization adjustment based on different heat source information. The system includes a plurality of heat source measurers, a first system chip, a second system chip, an electrical interconnection, and a bit error risk evaluator. The first system chip includes a signal transmitter, and the second system chip includes a signal receiver. The second system chip provides an electrical characteristic state of the signal receiver, and a signal adjustment information of the signal transmitter and/or the signal receiver. The bit error risk evaluator performs a signal optimization adjustment for an electrical characteristic of the signal receiver according to the electrical characteristic state. The present disclosure further provides a method for signal optimization adjustment.

Abstract: The present application relates to a silicone oil-based immersion coolant for an electronic component. The silicone oil-based immersion coolant for an electronic component includes a base oil and an additive. The base oil includes a low-viscosity silicone oil. The additive includes a silicone oil diluent and a thermally conductive inorganic filler. The viscosity of the low-viscosity silicone oil is less than or equal to 1000 cSt. The thermally conductive inorganic filler is an insulating filler. Based on the mass of the immersion coolant, a mass percentage content of the base oil is in a range from 70% to 85%, a mass percentage content of the silicone oil diluent is in a range from 10% to 20%, and a mass percentage content of the thermally conductive inorganic filler is in a range from 5% to 10%.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.