Patents by Inventor Min Yu
Min Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250069525Abstract: A positioning method for an electrical shelf label, a computer device, and a non-transitory computer readable storage medium. The method includes: obtaining, by a server, a candidate electronic shelf label with a fuzzy positioning result; sequentially executing, by each of the candidate-matching shelf label pairs, a distance measurement task according to the distance measurement instruction to obtain a measured distance between the candidate electronic shelf label and each of the matching electronic shelf labels; revising, by the server, the fuzzy positioning result of the candidate electronic shelf label based on all the measured distances to determine an actual positioning result for the candidate electronic shelf label.Type: ApplicationFiled: September 27, 2024Publication date: February 27, 2025Applicant: HANSHOW TECHNOLOGY CO., LTD.Inventors: Min LIANG, Yaping JI, Sicheng YU
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Publication number: 20250062433Abstract: The present application relates to a silicone oil-based immersion coolant for an electronic component. The silicone oil-based immersion coolant for an electronic component includes a base oil and an additive. The base oil includes a low-viscosity silicone oil. The additive includes a silicone oil diluent and a thermally conductive inorganic filler. The viscosity of the low-viscosity silicone oil is less than or equal to 1000 cSt. The thermally conductive inorganic filler is an insulating filler. Based on the mass of the immersion coolant, a mass percentage content of the base oil is in a range from 70% to 85%, a mass percentage content of the silicone oil diluent is in a range from 10% to 20%, and a mass percentage content of the thermally conductive inorganic filler is in a range from 5% to 10%.Type: ApplicationFiled: November 17, 2023Publication date: February 20, 2025Applicant: CSG PWR GEN. (GUANGDONG) ENRGY. STR. TCH. CO. LTDInventors: Bangjin LIU, Zhiqiang WANG, Chao DONG, Jin WANG, Yueli ZHOU, Jiasheng WU, Cheng PENG, Min ZHANG, Bin WU, Linwei WANG, Qihua LIN, Xiaodong ZHENG, Zheng WENG, Shaohua ZHAO, Lunsen ZOU, Guobin ZHONG, Fei YU, Jia LUO, Xuan LIU, Kaiqi XU, Chao WANG
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Publication number: 20250062856Abstract: The present disclosure provides a system for signal optimization adjustment based on different heat source information. The system includes a plurality of heat source measurers, a first system chip, a second system chip, an electrical interconnection, and a bit error risk evaluator. The first system chip includes a signal transmitter, and the second system chip includes a signal receiver. The second system chip provides an electrical characteristic state of the signal receiver, and a signal adjustment information of the signal transmitter and/or the signal receiver. The bit error risk evaluator performs a signal optimization adjustment for an electrical characteristic of the signal receiver according to the electrical characteristic state. The present disclosure further provides a method for signal optimization adjustment.Type: ApplicationFiled: June 6, 2024Publication date: February 20, 2025Inventors: Wanfen TENG, Yi-Min YU, Jason YEH, Chao-Lung WEI, Fan-Cheng HUANG, Yi-Wen SU, Ting-Chu YEH, Mei-Yi HUANG
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Publication number: 20250062184Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.Type: ApplicationFiled: November 4, 2024Publication date: February 20, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
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Patent number: 12230804Abstract: A method of manufacturing an all-solid-state battery electrode, an all-solid-state battery electrode manufactured by the method, and an all-solid-state battery including the electrode are disclosed. In the method, a specific type of binder included in the electrode is prepared in a fiber form by applying pressure to the binder under specific conditions, so that the fiber-form binder thus prepared has an average fineness that satisfies a specific range. Therefore, the all-solid-state battery including the electrode has an advantage of having high capacity even in the case of electrode thickening for high loading.Type: GrantFiled: December 7, 2021Date of Patent: February 18, 2025Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA ELECTRONICS TECHNOLOGY INSTITUTEInventors: Jae Min Lim, Yong Gu Kim, Hong Seok Min, Sang Heon Lee, Sa Heum Kim, Yun Sung Kim, Ji Sang Yu, Kyung Su Kim, Goo Jin Jeong, Woo Suk Cho
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Patent number: 12230589Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.Type: GrantFiled: May 30, 2023Date of Patent: February 18, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Yang Yu, Jung-Wei Cheng, Yu-Min Liang, Jiun-Yi Wu, Yen-Fu Su, Chien-Chang Lin, Hsin-Yu Pan
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Publication number: 20250050272Abstract: The present invention provides a gas processing module, a gas processing method and a gas-phase organic compound processing method. A gas processing module comprises a cavity, a gas input unit, a light source, a photocatalyst, a liquid input unit, a gas discharge unit and a liquid discharge unit. The gas input unit is communicated with the inside of the cavity and used for supplying a to-be-processed gas comprising a gas-phase organic compound into the cavity. The light source is arranged in the cavity and used for providing a first light. The photocatalyst is arranged in the cavity, and at least a portion of the gas-phase organic compound of the to-be-processed gas which comes into contact with the photocatalyst generates an organic compound product under the action of the photocatalyst when irradiated by the first light.Type: ApplicationFiled: August 9, 2024Publication date: February 13, 2025Applicant: GREENFILTEC LTD.Inventors: Yi-Hui YU, Kuo-Min PENG, Yu-De LIEN, Ju-Ting LEE
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Publication number: 20250051402Abstract: What provided is a method for regulating in vitro biosynthesis activity by knocking-out of a nuclease system, comprising: screening five nucleases among numerous nucleases, and performing down-regulation or knocking-out on one of the five nucleases (e.g., EXN53). The method can improve the stability of nucleic acid and the protein production efficiency of an in vitro protein synthesis system.Type: ApplicationFiled: July 25, 2024Publication date: February 13, 2025Inventors: Min GUO, Lingxuan JIANG, Zhuxia ZHENG, Xue YU
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Publication number: 20250051172Abstract: A silica sol, a silica aerogel blanket using the same, and a method for manufacturing the same, wherein a hydrophobizing agent, a base catalyst, an organic solvent, and water are included in a catalyst composition when manufacturing the silica aerogel blanket, so that a wet aging step which is performed under high-temperature conditions and increases the amount of a solvent used, surface modification step which uses a large amount of an organic solvent and an expensive surface modifier, resulting in a process that is complex and long and thus inhibiting economic feasibility and productivity, can be omitted.Type: ApplicationFiled: October 30, 2024Publication date: February 13, 2025Applicant: LG Chem, Ltd.Inventors: Kyu Reon Lee, Se Won Baek, Hyun Woo Jeon, Mi Ri Kim, Sung Min Yu, Sang Woo Park, Bong June Kim
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Patent number: 12223127Abstract: An active stylus having physical writing function includes a tip shell including a first opening and a second opening, a first electrode including a first end protruded through the first opening of the tip shell and including a second end protruded through the second opening of the tip shell and entered a main body housing of the active stylus, wherein the first electrode includes conductive material. The tip shell includes non-conductive material. The first end of the first electrode is configured to leave colored traces on an object by physical friction caused between the first end of the first electrode and the object.Type: GrantFiled: July 27, 2023Date of Patent: February 11, 2025Assignees: Renaisser Technology Co., Ltd. Corp., Dexin Corp.Inventors: Shih-Yen Lee, Tzu-Yu Ting, Yeh Sen-Fan Chueh, Min-Hung Lin, Shih-Hsiung Hsiao
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Patent number: 12222576Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.Type: GrantFiled: November 9, 2023Date of Patent: February 11, 2025Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Kuen-Wang Tsai, Liang-Ting Ho, Chao-Hsi Wang, Chih-Wei Weng, He-Ling Chang, Che-Wei Chang, Sheng-Zong Chen, Ko-Lun Chao, Min-Hsiu Tsai, Shu-Shan Chen, Jungsuck Ryoo, Mao-Kuo Hsu, Guan-Yu Su
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Publication number: 20250048590Abstract: This application provides a flexible liquid cooling heat dissipation unit. The flexible liquid cooling heat dissipation unit is configured to dissipate heat for a heat generation component. A liquid inlet and a liquid outlet are provided on the flexible liquid cooling heat dissipation unit. A heat exchange cavity that is used for accommodating a coolant and allowing the coolant to flow from the liquid inlet to the liquid outlet is provided in the flexible liquid cooling heat dissipation unit. The liquid cooling heat dissipation unit includes a flexible sheet material. The flexible sheet material is obtained by compounding a plurality of functional film layers, the plurality of functional film layers include at least one anti-penetration layer, and permeability of the anti-penetration layer is less than 1 g/m2/24 hr.Type: ApplicationFiled: October 25, 2024Publication date: February 6, 2025Inventors: Min LI, Guangjing WANG, Lu BAI, Fei YU
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Patent number: 12218020Abstract: A semiconductor package includes a circuit structure, a first redistribution layer, a second redistribution layer, a first encapsulant, a bus die and a plurality of through vias. The first redistribution layer is disposed over the circuit structure. The second redistribution layer is disposed over the first redistribution layer. The first encapsulant is disposed between the first redistribution layer and the second redistribution layer. The through vias surround the bus die. The first encapsulant is extended along an entire sidewall of the bus die, and a first surface of the bus die is substantially coplanar with top surfaces of the first encapsulant and the plurality of through vias.Type: GrantFiled: March 16, 2022Date of Patent: February 4, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jiun-Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Yu-Min Liang
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Patent number: 12219755Abstract: An IC device includes an active area positioned in a substrate, first and second contact structures overlying and electrically connected to the active area, a conductive element overlying and electrically connected to each of the first and second contact structures, an anti-fuse transistor device including a dielectric layer between a gate structure and the active area, a first selection transistor overlying the active area adjacent to each of the anti-fuse transistor device and the first contact structure, and a second selection transistor overlying the active area adjacent to each of the anti-fuse transistor device and the second contact structure.Type: GrantFiled: January 19, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Min-Shin Wu, Meng-Sheng Chang, Shao-Yu Chou, Yao-Jen Yang
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Patent number: 12216370Abstract: A display panel is provided, which includes a first substrate and a second substrate arranged opposite to each other. The first substrate includes a first electrode and a second electrode. The second substrate includes a light shielding layer. The light shielding layer includes a light transmitting region and a light shielding region. The first electrode includes slits extending in a first direction, and an orthographic projection of two ends of at least one of the slits onto the first substrate is within an orthographic projection of the light shielding region onto the first substrate. A display panel and a display device are also provided.Type: GrantFiled: May 11, 2022Date of Patent: February 4, 2025Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Jing Li, Yanan Yu, Zhao Liu, Rui Fan, Xiao Yan, Haoyi Xin, Jianxiong Fan, Shangpeng Liu, Jingjing Xu, Min Zhang, Wei Ren, Chenrong Qiao, Yanfeng Li
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Patent number: 12215393Abstract: The disclosure discloses a method and application for rapid and accurate chromosomal location of economic traits in laver, belonging to the fields of genomics and molecular breeding, wherein comprising the following steps: distinguishing the different genotype sectors by the color difference of pigment mutants, releasing monospores based on the asexual reproduction of single-genotype sectors, forming offspring CMD population; performing QTL-seq analysis on the extreme phenotype pools of offspring CMD population by SNP/InDel markers; and combining KASP and RNA-seq to predict the location of the genes of discrete traits or major QTL. The disclosure may solve the problem of difficulty in genetic analysis of various traits caused by the genotypic chimeric haploid characteristics.Type: GrantFiled: February 25, 2021Date of Patent: February 4, 2025Assignees: Ocean University of China, Hainan Tropical Ocean UniversityInventors: Yunxiang Mao, Xinzi Yu, Fanna Kong, Min Cao
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Publication number: 20250033993Abstract: The present disclosure relates to a recycled positive electrode active material, a method of producing the recycled positive electrode active material, and a secondary battery including the same. The recycled positive electrode active material, including: 60 mol % or more of Ni; and crystalline LiF, or 0.24% by weight or less of residual Li2CO3, where the recycled positive electrode active material is one or more selected from the group consisting of a lithium nickel oxide (LNO)-based positive electrode active material, a nickel·cobalt·manganese (NCM)-based positive electrode active material, a nickel·cobalt·aluminum (NCA)-based positive electrode active material, and a nickel·cobalt·manganese·aluminum (NCMA)-based positive electrode active material.Type: ApplicationFiled: June 26, 2023Publication date: January 30, 2025Inventors: Yongsik SEO, Doo Kyung YANG, Min Seo KIM, Jeong Mi CHOI, Se Ho PARK, Jeongbae LEE, Eunkyu SEONG, Yeon Jun KIM, Hyemin YU
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Publication number: 20250034042Abstract: The present invention relates to a basalt fiber reinforced concrete, which includes: a cement slurry with a water-to-cement ratio between 0.3 and 0.5, and a slurry volume percentage between 15-25%; an aggregate with an aggregate volume percentage between 65% and 75%; a basalt fiber reinforcement with a fiber volume percentage between 0.2% and 1.00%; and a concrete admixture used to adjust the properties of the basalt fiber reinforced concrete.Type: ApplicationFiled: October 6, 2023Publication date: January 30, 2025Inventors: Jieh-Haur CHEN, Yu-Min SU, Min-Chih LIAO, Yen-Yu LIN, Cheng-Ching PENG
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Publication number: 20250032621Abstract: A drug conjugate includes a structure shown by the following formula: Z-(linker-[R]m)n. In the formula, Z is a drug compound, R is a sugar, and m and n are independently an integer from 1 to 6. The drug compound Z is a hepatitis virus targeting drug, a hepatitis B virus (HBV) drug, an inhibitor of apoptosis protein (IAP) antagonist, a multidrug resistance (MDR) inhibitor, or analogues, precursors, prodrugs, derivatives thereof.Type: ApplicationFiled: May 30, 2024Publication date: January 30, 2025Applicant: SeeCure Taiwan Co., Ltd.Inventors: Wuu-Jyh Lin, Min-Ching Chung, Chi-Shiang Ke, Ya-Chen Tseng, Chin-Yu Liang, Yen-Chun Lee, Hsin-Jou Li, Tai-Yun Huang, Nai-Chen Hsueh, Yan-Feng Jiang
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Publication number: 20250038288Abstract: The present disclosure relates to a recycled cathode active material, a method of producing the same, and a secondary battery including the same. Specifically, the method of producing a recycled cathode active material according to the present disclosure includes: step (a) of separating a current collector from a cathode active material layer and recovering a cathode active material in the cathode active material layer by thermally decomposing a binder and a conductive material in the cathode active material layer by heat-treating a waste cathode including the current collector and the cathode active material layer formed on the current collector; and step (b) of adding a lithium precursor and a cobalt-containing coating agent to the recovered cathode active material and performing annealing.Type: ApplicationFiled: October 11, 2023Publication date: January 30, 2025Inventors: Hyemin YU, Yeon Jun KIM, Doo Kyung YANG, Min Seo KIM, Jeong Mi CHOI, Eunkyu SEONG