Abstract: Provided is an electrostatic chuck including a ceramic plate having a first surface and a second surface. The ceramic plate includes: a plurality of ceramic layers; a first electrode and a second electrode disposed between the plurality of ceramic layers; a first via and a second via penetrating some of the ceramic layers, the first via being connected to the first electrode, the second via being connected to the second electrode, and one end of the first via and one end of the second via being exposed on the second surface of the ceramic plate; and a conductive silicone pad disposed on the second surface of the ceramic plate and bonded to the one end of the first via and the one end of the second via to electrically connect the first via and the second via.

Abstract: The present disclosure provides a susceptor. The susceptor includes: a base member including a first cooling gas flow path configured to introduce a cooling gas; a thermal insulation member having a thermal conductivity of 20 W/mK or less, the thermal insulation member including a second cooling gas flow path in communication with the first cooling gas flow path and being stacked on the base member; and an insulating plate stacked on the thermal insulation member, the insulating plate including a plurality of gas holes in communication with the second cooling gas flow path and configured to discharge the cooling gas to cool a substrate.

Abstract: Disclosed is to a ceramic susceptor. The ceramic susceptor of the present disclosure may include: a base substrate having a gas flow path configured to supply cooling gas; an insulating plate fixed on the base substrate and having a gas hole penetrating the insulating plate in the thickness direction thereof; and a discharge prevention pin inserted into the gas hole and extending in the length direction of the gas hole.

Abstract: The present disclosure relates to an electrostatic chuck. The electrostatic chuck according to the present disclosure may include a base substrate; an electrostatic chuck plate fixed on the base substrate, the electrostatic chuck plate having an electrode therein; and an electrode part disposed in a hole in the base substrate to supply power to the electrode, wherein the electrode part may include a housing inserted into the hole in the base substrate, an electrode rod passing through the inner wall of the housing such that one end thereof is in contact with the electrode; and an elastic support body configured to support the electrode rod at multiple points on the inner wall of the housing.

Abstract: The present disclosure relates to an electrostatic chuck. The electrostatic chuck according to the present disclosure may include a base substrate; an electrostatic chuck plate fixed on the base substrate, the electrostatic chuck plate having an electrode therein; and an electrode part disposed in a hole in the base substrate to supply power to the electrode, wherein the electrode part may include a housing inserted into the hole in the base substrate, an electrode rod passing through the inner wall of the housing such that one end thereof is in contact with the electrode; and an elastic support body configured to support the electrode rod at multiple points on the inner wall of the housing.