Patents by Inventor Mi-Na Choi
Mi-Na Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240088531Abstract: The present disclosure relates to an electrode lead for an electrochemical device, including a nickel plating layer disposed on the surface of a metallic terminal, having a surface irregularity structure on the nickel plating layer, and including a polar group-containing coating layer. The present disclosure also relates to an electrochemical device including the electrode lead. The electrode lead for an electrochemical device provides increased binding force between the electrode lead and the lead film by increasing the contact area between the electrode lead and the lead film, while not causing damages upon the surface of the electrode lead.Type: ApplicationFiled: September 26, 2022Publication date: March 14, 2024Applicant: LG Energy Solution, Ltd.Inventors: Mi-Na Kim, Yong-Su Choi, Gyung-Soo Kang
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Patent number: 10999486Abstract: To solve the above problem, a monitoring apparatus according to an embodiment of the present invention comprises: a communication unit for receiving an original image acquired by a camera; a storage unit for storing the original image; a screen unit for displaying the original image and a corrected image obtained by dewarping the original image; and a control unit for controlling operations of the communication unit, the storage unit, and the screen unit, wherein the screen unit displays an icon in a dewarping area of the original image where the corrected image is obtained by dewarping the original image, indicates that the dewarping area is selected when the icon located in the dewarping area is selected, and displays a polygon representing the selected dewarping area.Type: GrantFiled: July 22, 2016Date of Patent: May 4, 2021Assignee: HANWHA TECHWIN CO., LTD.Inventors: Kyoung Jeon Jeong, Yoo Mi Cha, Sung Pil Chun, Dong Won Kim, Chang Hee Song, Mi Na Choi
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Patent number: 10924652Abstract: A monitoring apparatus includes: a communication interface configured to receive an original image acquired by a camera; a storage configured to store the original image; a display configured to display the original image and a calibrated image obtained by dewarping the original image; and a controller configured to control operations of the communication interface, the storage, and the display, wherein, in a view mode in which only the calibrated image among the original image and the calibrated image is displayed, in response to the calibrated image being selected, the display is configured to display a mini map which shows the original image in a portion of the selected calibrated image.Type: GrantFiled: December 3, 2018Date of Patent: February 16, 2021Assignee: HANWHA TECHWIN CO., LTD.Inventors: Yoo Mi Cha, Kyoung Jeon Jeong, Dong Won Kim, Sung Pil Chun, Chang Hee Song, Mi Na Choi
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Publication number: 20200288056Abstract: To solve the above problem, a monitoring apparatus according to an embodiment of the present invention comprises: a communication unit for receiving an original image acquired by a camera; a storage unit for storing the original image; a screen unit for displaying the original image and a corrected image obtained by dewarping the original image; and a control unit for controlling operations of the communication unit, the storage unit, and the screen unit, wherein the screen unit displays an icon in a dewarping area of the original image where the corrected image is obtained by dewarping the original image, indicates that the dewarping area is selected when the icon located in the dewarping area is selected, and displays a polygon representing the selected dewarping area.Type: ApplicationFiled: July 22, 2016Publication date: September 10, 2020Applicant: Hanwha Techwin Co., Ltd.Inventors: Kyoung Jeon JEONG, Yoo Mi CHA, Sung Pil CHUN, Dong Won KIM, Chang Hee SONG, Mi Na CHOI
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Publication number: 20190104254Abstract: A monitoring apparatus includes: a communication interface configured to receive an original image acquired by a camera; a storage configured to store the original image; a display configured to display the original image and a calibrated image obtained by dewarping the original image; and a controller configured to control operations of the communication interface, the storage, and the display, wherein, in a view mode in which only the calibrated image among the original image and the calibrated image is displayed, in response to the calibrated image being selected, the display is configured to display a mini map which shows the original image in a portion of the selected calibrated image.Type: ApplicationFiled: December 3, 2018Publication date: April 4, 2019Applicant: Hanwha Techwin Co., Ltd.Inventors: Yoo Mi CHA, Kyoung Jeon JEONG, Dong Won KIM, Sung Pil CHUN, Chang Hee SONG, Mi Na CHOI
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Patent number: 9704815Abstract: A package substrate may include an insulating substrate, internal circuits and a warpage-suppressing member. The insulating substrate may have a plurality of mount regions in which semiconductor chips may be mounted, and a peripheral region. The internal circuits may be arranged in the mount regions. The warpage-suppressing member is different from the semiconductor chips and may be arranged in at least one of the mount regions to suppress a warpage of the insulating substrate. Thus, warpage of the package substrate may be suppressed during a reflow process.Type: GrantFiled: May 16, 2016Date of Patent: July 11, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi-Na Choi, Young-Deuk Kim, Jae-Choon Kim, Eon-Soo Jang, Hee-Jung Hwang
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Publication number: 20160372423Abstract: A package substrate may include an insulating substrate, internal circuits and a warpage-suppressing member. The insulating substrate may have a plurality of mount regions in which semiconductor chips may be mounted, and a peripheral region. The internal circuits may be arranged in the mount regions. The warpage-suppressing member is different from the semiconductor chips and may be arranged in at least one of the mount regions to suppress a warpage of the insulating substrate. Thus, warpage of the package substrate may be suppressed during a reflow process.Type: ApplicationFiled: May 16, 2016Publication date: December 22, 2016Inventors: Mi-Na CHOI, Young-Deuk KIM, Jae-Choon KIM, Eon-Soo JANG, Hee-Jung HWANG
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Patent number: 9324696Abstract: In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and smoothly transmitted toward the upper semiconductor package, thereby increasing or maximizing a heat exhaust effect of the PoP device.Type: GrantFiled: August 26, 2014Date of Patent: April 26, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Mi-Na Choi, Seran Bae, Yunhyeok Im
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Patent number: 9177887Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.Type: GrantFiled: October 31, 2013Date of Patent: November 3, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi-Na Choi, Ji-Chul Kim, Se-Ran Bae, Eun-Seok Cho, Hee-Jung Hwang
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Patent number: 8994169Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.Type: GrantFiled: August 29, 2012Date of Patent: March 31, 2015Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Ji-Chul Kim, Jin-Kwon Bae, Mi-Na Choi, Hee-Jung Hwang
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Patent number: 8988645Abstract: A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.Type: GrantFiled: August 28, 2012Date of Patent: March 24, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Jichul Kim, Young-Deuk Kim, Eunseok Cho, Mi-Na Choi
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Publication number: 20150061095Abstract: In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and smoothly transmitted toward the upper semiconductor package, thereby increasing or maximizing a heat exhaust effect of the PoP device.Type: ApplicationFiled: August 26, 2014Publication date: March 5, 2015Inventors: Mi-Na Choi, Seran Bae, Yunhyeok Im
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Patent number: 8858007Abstract: A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.Type: GrantFiled: August 22, 2012Date of Patent: October 14, 2014Assignee: Samsung Electronics Co., LtdInventors: Young-Deuk Kim, Ji-Chul Kim, Se-Ran Bae, Eun-Seok Cho, Mi-Na Choi
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Publication number: 20140239300Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.Type: ApplicationFiled: October 31, 2013Publication date: August 28, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Mi-Na CHOI, Ji-Chul KIM, Se-Ran BAE, Eun-Seok CHO, Hee-Jung HWANG
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Publication number: 20140184312Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon KIM, Eunseok CHO, Mi-Na CHOI, Kyoungsei CHOI, Heejung HWANG, Seran BAE
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Patent number: 8692349Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.Type: GrantFiled: September 22, 2011Date of Patent: April 8, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jae Choon Kim, Eunseok Cho, Mi-Na Choi, Kyoungsei Choi, Heejung Hwang, Seran Bae
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Patent number: 8648478Abstract: A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.Type: GrantFiled: June 13, 2011Date of Patent: February 11, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Wook Yoo, Kyoung-Sei Choi, Eun-Seok Cho, Mi-Na Choi, Hee-Jung Hwang, Se-Ran Bae
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Publication number: 20130155653Abstract: A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.Type: ApplicationFiled: August 22, 2012Publication date: June 20, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Deuk KIM, Ji-Chul KIM, Se-Ran BAE, Eun-Seok CHO, Mi-Na CHOI
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Publication number: 20130135823Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.Type: ApplicationFiled: August 29, 2012Publication date: May 30, 2013Applicant: Samsung Electronics Co., Ltd.Inventors: Ji-Chul Kim, Jin-Kwon Bae, Mi-Na Choi, Hee-Jung Hwang
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Publication number: 20130057559Abstract: A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.Type: ApplicationFiled: August 28, 2012Publication date: March 7, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jichul KIM, Young-Deuk KIM, Eunseok CHO, Mi-Na CHOI