Patents by Inventor Mina Iskander

Mina Iskander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11696390
    Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: July 4, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Jeahyeong Han, Suhyung Hwang, Mina Iskander, Rajneesh Kumar, Darryl Sheldon Jessie
  • Patent number: 11322855
    Abstract: A transmission line network is provided that includes a slow-wave transmission line to couple a first terminal to a first antenna. The transmission line network also includes a conventional transmission line to couple a second terminal to a second antenna.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: May 3, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Darryl Sheldon Jessie, Mina Iskander, Avantika Sodhi
  • Publication number: 20210410274
    Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.
    Type: Application
    Filed: November 20, 2020
    Publication date: December 30, 2021
    Inventors: Jeahyeong Han, Suhyung Hwang, Mina Iskander, Rajneesh Kumar, Darryl Sheldon Jessie
  • Publication number: 20210226340
    Abstract: A transmission line network is provided that includes a slow-wave transmission line to couple a first terminal to a first antenna. The transmission line network also includes a conventional transmission line to couple a second terminal to a second antenna.
    Type: Application
    Filed: January 21, 2020
    Publication date: July 22, 2021
    Inventors: Darryl Sheldon JESSIE, Mina ISKANDER, Avantika SODHI
  • Publication number: 20180323765
    Abstract: Aspects of the disclosure are directed to an inductor-capacitor (LC) resonator. In accordance with one aspect, the LC resonator architecture includes a lower metal plate, the lower metal plate is of an open configuration; an upper metal plate, the upper metal plate is stacked vertically above the lower metal plate and is vertically aligned to the lower metal plate; a first ultra thick metal (UTM) plate, the first UTM plate is stacked vertically above the upper metal plate and is vertically aligned to both the upper metal plate and the lower metal plate; and an electrical coupling to couple the first UTM plate to the upper metal plate, wherein a current on the first UTM plate flows through to the upper metal plate through the electrical coupling, the current flows in a direction on the first UTM plate and in the same direction on the upper metal plate.
    Type: Application
    Filed: May 3, 2017
    Publication date: November 8, 2018
    Inventors: Miena Armanious, Lan Nan, Mina Iskander
  • Patent number: 10075138
    Abstract: Exemplary embodiments of the present disclosure are related to inductor shielding. A device may include an inductor and a plurality of conductive strips extending across the inductor. At least a first conductive strip of the plurality of conductive strips is physically isolated from at least a second conductive strip of the plurality of conductive strips in a region of overlay of the first and second conductive strips.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: September 11, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Victor Korol, Mina Iskander
  • Publication number: 20170104459
    Abstract: Exemplary embodiments of the present disclosure are related to inductor shielding. A device may include an inductor and a plurality of conductive strips extending across the inductor. At least a first conductive strip of the plurality of conductive strips is physically isolated from at least a second conductive strip of the plurality of conductive strips in a region of overlay of the first and second conductive strips.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Inventors: Victor Korol, Mina Iskander