Patents by Inventor Mina IWAI

Mina IWAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9137890
    Abstract: There is provided a wiring board. The wiring board includes: a first insulating layer; a plurality of wiring patterns on the first insulating layer so as to be spaced apart from each other; a plating layer on at least one of the wiring patterns; a second insulating layer containing silicone therein and having an opening, wherein an outermost surface of the plating layer is exposed from the opening and serves as a connection pad; and a silica film on the outermost surface of the plating layer.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: September 15, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazutaka Kobayashi, Mitsuhiro Aizawa, Hiroshi Shimizu, Mina Iwai
  • Publication number: 20140226346
    Abstract: There is provided a wiring board. The wiring board includes: a first insulating layer; a plurality of wiring patterns on the first insulating layer so as to be spaced apart from each other; a plating layer on at least one of the wiring patterns; a second insulating layer containing silicone therein and having an opening, wherein an outermost surface of the plating layer is exposed from the opening and serves as a connection pad; and a silica film on the outermost surface of the plating layer.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 14, 2014
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazutaka KOBAYASHI, Mitsuhiro AIZAWA, Hiroshi SHIMIZU, Mina IWAI