Patents by Inventor Mina SEKIKAWA

Mina SEKIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid-repellent structure, production method thereof, wrapping material, and separation sheet
    Patent number: 11969977
    Abstract: The liquid-repellent structure comprises a major surface to which liquid repellency is imparted, and a liquid-repellent layer formed on the major surface; wherein the liquid-repellent layer contains a scale-like filler having an average particle size of 0.1 to 6 ?m, inclusive, a thermoplastic resin, and a fluorine compound, and has aggregates containing the scale-like filler; and the ratio WS1/(WP+WFC) of the mass WS1 of the scale-like filler contained in the liquid-repellent layer to the sum (WP+WFC) of the mass WP of the thermoplastic resin and the mass WFC of the fluorine compound contained in the liquid-repellent layer is 0.1 to 10 inclusive.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: April 30, 2024
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Ryoji Kato, Kosuke Kinoshita, Masayoshi Suzuta, Mina Sekikawa
  • LIQUID-REPELLENT STRUCTURE, PRODUCTION METHOD THEREOF, WRAPPING MATERIAL, AND SEPARATION SHEET
    Publication number: 20210129508
    Abstract: The liquid-repellent structure comprises a major surface to which liquid repellency is imparted, and a liquid-repellent layer formed on the major surface; wherein the liquid-repellent layer contains a scale-like filler having an average particle size of 0.1 to 6 ?m, inclusive, a thermoplastic resin, and a fluorine compound, and has aggregates containing the scale-like filler; and the ratio WS1/(WP+WFC) of the mass WS1 of the scale-like filler contained in the liquid-repellent layer to the sum (WP+WFC) of the mass WP of the thermoplastic resin and the mass WFC of the fluorine compound contained in the liquid-repellent layer is 0.1 to 10 inclusive.
    Type: Application
    Filed: December 15, 2020
    Publication date: May 6, 2021
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Ryoji KATO, Kosuke KINOSHITA, Masayoshi SUZUTA, Mina SEKIKAWA