Patents by Inventor Minae Tanaka

Minae Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly dilutable polishing concentrates and slurries
    Patent number: 8771540
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 8, 2014
    Assignee: Fujifilm Planar Solutions, LLC
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • HIGHLY DILUTABLE POLISHING CONCENTRATES AND SLURRIES
    Publication number: 20130288478
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Application
    Filed: March 21, 2013
    Publication date: October 31, 2013
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Highly dilutable polishing concentrates and slurries
    Patent number: 8404143
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: March 26, 2013
    Assignee: Fujifilm Planar Solutions, LLC
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • HIGHLY DILUTABLE POLISHING CONCENTRATES AND SLURRIES
    Publication number: 20120145951
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Application
    Filed: February 22, 2012
    Publication date: June 14, 2012
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Highly dilutable polishing concentrates and slurries
    Patent number: 8192644
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: June 5, 2012
    Assignee: Fujifilm Planar Solutions, LLC
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • HIGHLY DILUTABLE POLISHING CONCENTRATES AND SLURRIES
    Publication number: 20110089143
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar