Patents by Inventor Minae Tanaka

Minae Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240400333
    Abstract: A sheet ejection device includes an output tray to be stacked with a plurality of sheets. The output tray includes a first mount that mounts the sheets and a second mount that abuts on the first mount. The second mount mounts the sheets. A mover moves the first mount.
    Type: Application
    Filed: May 3, 2024
    Publication date: December 5, 2024
    Applicant: Ricoh Company, Ltd.
    Inventor: Mina TANAKA
  • Publication number: 20200198918
    Abstract: An adhering jig and an adhering method that can improve workability when adhering a film to an adherent. The adhering jig includes a film retaining portion (3), a pressing portion (4), and a guide member (2). The film retaining portion includes at least a first retaining portion (11) and a second retaining portion (12) that are separated from each other, and retains the film (51) by the first retaining portion and the second retaining portion. The pressing member presses the film retained by the retaining portion to a first side in a first direction. The guide member guides a movement of the pressing member between the first retaining portion and the second retaining portion of the film retaining portion, in a second direction that intersects the first direction.
    Type: Application
    Filed: May 25, 2018
    Publication date: June 25, 2020
    Inventors: Takayoshi Fujino, Masayuki Kubota, Yasuyuki Daigo, Akihide Okamoto, Mina Tanaka, Hiroyuki Matsuoka
  • Patent number: 8771540
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 8, 2014
    Assignee: Fujifilm Planar Solutions, LLC
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Publication number: 20130288478
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Application
    Filed: March 21, 2013
    Publication date: October 31, 2013
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Patent number: 8404143
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: March 26, 2013
    Assignee: Fujifilm Planar Solutions, LLC
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Publication number: 20120145951
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Application
    Filed: February 22, 2012
    Publication date: June 14, 2012
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Patent number: 8192644
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: June 5, 2012
    Assignee: Fujifilm Planar Solutions, LLC
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
  • Publication number: 20110089143
    Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Inventors: Hyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar