Patents by Inventor Minako Izumi

Minako Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11279419
    Abstract: The present invention relates to a member for an automobile roof provided by compression molding a laminate, wherein the laminate comprises three layers: a layer A-a, a layer B, and a layer A-b laminated in the order mentioned, when the sum of the thickness of the layer A-a, the layer B and the layer A-b is assumed to correspond to 100%, the sum of the thickness of the layer A-a and the layer A-b accounts for from 6 to 8%, and the thickness of the layer A-a accounts for from 0.5 to 7.5%, the thickness of the layer A-b accounts for from 0.5 to 7.5%, and the thickness of the layer B accounts for from 92 to 94%, in such a way that the sum of the thickness of the layer A-a, the layer B and the layer A-b accounts for from 70 to 93%.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: March 22, 2022
    Assignees: Sumitomo Chemical Company, Limited, Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuichi Miyake, Toshio Watanabe, Wataru Tokuhara, Minako Izumi, Shunsuke Chiba
  • Publication number: 20200307719
    Abstract: The present invention relates to a member for an automobile roof provided by compression molding a laminate, wherein the laminate comprises three layers: a layer A-a, a layer B, and a layer A-b laminated in the order mentioned, when the sum of the thickness of the layer A-a, the layer B and the layer A-b is assumed to correspond to 100%, the sum of the thickness of the layer A-a and the layer A-b accounts for from 6 to 8%, and the thickness of the layer A-a accounts for from 0.5 to 7.5%, the thickness of the layer A-b accounts for from 0.5 to 7.5%, and the thickness of the layer B accounts for from 92 to 94%, in such a way that the sum of the thickness of the layer A-a, the layer B and the layer A-b accounts for from 70 to 93%.
    Type: Application
    Filed: March 2, 2020
    Publication date: October 1, 2020
    Applicants: Sumitomo Chemical Company, Limited, Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuichi Miyake, Toshio Watanabe, Wataru Tokuhara, Minako Izumi, Shunsuke Chiba
  • Patent number: 10053151
    Abstract: A reinforcing structure of a vehicle frame member includes: ribs that integrally connect standing wall portions, that are formed at a planar portion of a vehicle frame member, to one another, and that reinforce the planar portion; portions of gradually changing thickness that are formed at connected portions of the ribs with the standing wall portions; portions of gradually changing height that are formed at the connected portions of the ribs with the standing wall portions; first curved portions that are formed at the portions of gradually changing thickness; second curved portions that are formed at the portions of gradually changing thickness; third curved portions that are formed at the portions of gradually changing height; and fourth curved portions that are formed at the portions of gradually changing height.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: August 21, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Soshiro Murata, Takashi Sasaki, Hideaki Kanasugi, Kazuki Shimizu, Minako Izumi
  • Publication number: 20170183036
    Abstract: A reinforcing structure of a vehicle frame member includes: ribs that integrally connect standing wall portions, that are formed at a planar portion of a vehicle frame member, to one another, and that reinforce the planar portion; portions of gradually changing thickness that are formed at connected portions of the ribs with the standing wall portions; portions of gradually changing height that are formed at the connected portions of the ribs with the standing wall portions; first curved portions that are formed at the portions of gradually changing thickness; second curved portions that are formed at the portions of gradually changing thickness; third curved portions that are formed at the portions of gradually changing height; and fourth curved portions that are formed at the portions of gradually changing height.
    Type: Application
    Filed: December 7, 2016
    Publication date: June 29, 2017
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Soshiro MURATA, Takashi SASAKI, Hideaki KANASUGI, Kazuki SHIMIZU, Minako IZUMI
  • Patent number: 8314346
    Abstract: A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: November 20, 2012
    Assignee: Kyocera Corporation
    Inventors: Tomohide Hasegawa, Minako Izumi, Yasuhiro Sasaki, Noriaki Hamada, Takuji Okamura, Koichi Motomura
  • Publication number: 20110169037
    Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.
    Type: Application
    Filed: March 24, 2011
    Publication date: July 14, 2011
    Applicant: KYOCERA CORPORATION
    Inventors: Tomohide HASEGAWA, Minako IZUMI, Yasuhiro SASAKI, Noriaki HAMADA, Takuji OKAMURA, Koichi MOTOMURA
  • Publication number: 20080043444
    Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.
    Type: Application
    Filed: March 30, 2005
    Publication date: February 21, 2008
    Applicant: KYOCERA CORPORATION
    Inventors: Tomohide Hasegawa, Minako Izumi, Yasuhiro Sasaki, Noriaki Hamada, Takuji Okamura, Koichi Motomura