Patents by Inventor Minako Izumi
Minako Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11279419Abstract: The present invention relates to a member for an automobile roof provided by compression molding a laminate, wherein the laminate comprises three layers: a layer A-a, a layer B, and a layer A-b laminated in the order mentioned, when the sum of the thickness of the layer A-a, the layer B and the layer A-b is assumed to correspond to 100%, the sum of the thickness of the layer A-a and the layer A-b accounts for from 6 to 8%, and the thickness of the layer A-a accounts for from 0.5 to 7.5%, the thickness of the layer A-b accounts for from 0.5 to 7.5%, and the thickness of the layer B accounts for from 92 to 94%, in such a way that the sum of the thickness of the layer A-a, the layer B and the layer A-b accounts for from 70 to 93%.Type: GrantFiled: March 2, 2020Date of Patent: March 22, 2022Assignees: Sumitomo Chemical Company, Limited, Toyota Jidosha Kabushiki KaishaInventors: Yuichi Miyake, Toshio Watanabe, Wataru Tokuhara, Minako Izumi, Shunsuke Chiba
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Publication number: 20200307719Abstract: The present invention relates to a member for an automobile roof provided by compression molding a laminate, wherein the laminate comprises three layers: a layer A-a, a layer B, and a layer A-b laminated in the order mentioned, when the sum of the thickness of the layer A-a, the layer B and the layer A-b is assumed to correspond to 100%, the sum of the thickness of the layer A-a and the layer A-b accounts for from 6 to 8%, and the thickness of the layer A-a accounts for from 0.5 to 7.5%, the thickness of the layer A-b accounts for from 0.5 to 7.5%, and the thickness of the layer B accounts for from 92 to 94%, in such a way that the sum of the thickness of the layer A-a, the layer B and the layer A-b accounts for from 70 to 93%.Type: ApplicationFiled: March 2, 2020Publication date: October 1, 2020Applicants: Sumitomo Chemical Company, Limited, Toyota Jidosha Kabushiki KaishaInventors: Yuichi Miyake, Toshio Watanabe, Wataru Tokuhara, Minako Izumi, Shunsuke Chiba
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Patent number: 10053151Abstract: A reinforcing structure of a vehicle frame member includes: ribs that integrally connect standing wall portions, that are formed at a planar portion of a vehicle frame member, to one another, and that reinforce the planar portion; portions of gradually changing thickness that are formed at connected portions of the ribs with the standing wall portions; portions of gradually changing height that are formed at the connected portions of the ribs with the standing wall portions; first curved portions that are formed at the portions of gradually changing thickness; second curved portions that are formed at the portions of gradually changing thickness; third curved portions that are formed at the portions of gradually changing height; and fourth curved portions that are formed at the portions of gradually changing height.Type: GrantFiled: December 7, 2016Date of Patent: August 21, 2018Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Soshiro Murata, Takashi Sasaki, Hideaki Kanasugi, Kazuki Shimizu, Minako Izumi
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Publication number: 20170183036Abstract: A reinforcing structure of a vehicle frame member includes: ribs that integrally connect standing wall portions, that are formed at a planar portion of a vehicle frame member, to one another, and that reinforce the planar portion; portions of gradually changing thickness that are formed at connected portions of the ribs with the standing wall portions; portions of gradually changing height that are formed at the connected portions of the ribs with the standing wall portions; first curved portions that are formed at the portions of gradually changing thickness; second curved portions that are formed at the portions of gradually changing thickness; third curved portions that are formed at the portions of gradually changing height; and fourth curved portions that are formed at the portions of gradually changing height.Type: ApplicationFiled: December 7, 2016Publication date: June 29, 2017Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Soshiro MURATA, Takashi SASAKI, Hideaki KANASUGI, Kazuki SHIMIZU, Minako IZUMI
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Patent number: 8314346Abstract: A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.Type: GrantFiled: March 24, 2011Date of Patent: November 20, 2012Assignee: Kyocera CorporationInventors: Tomohide Hasegawa, Minako Izumi, Yasuhiro Sasaki, Noriaki Hamada, Takuji Okamura, Koichi Motomura
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Publication number: 20110169037Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.Type: ApplicationFiled: March 24, 2011Publication date: July 14, 2011Applicant: KYOCERA CORPORATIONInventors: Tomohide HASEGAWA, Minako IZUMI, Yasuhiro SASAKI, Noriaki HAMADA, Takuji OKAMURA, Koichi MOTOMURA
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Publication number: 20080043444Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.Type: ApplicationFiled: March 30, 2005Publication date: February 21, 2008Applicant: KYOCERA CORPORATIONInventors: Tomohide Hasegawa, Minako Izumi, Yasuhiro Sasaki, Noriaki Hamada, Takuji Okamura, Koichi Motomura