Patents by Inventor Minami Hanada

Minami Hanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5409993
    Abstract: Fluid gasket composition with fine rubber particles has sufficient elasticity. The particle size of the rubber particles contained in the fluid gasket composition is desired to be 0.1 to 3.0 mm. The fluid gasket composition applied to a joint portion between mechanical parts or the like exhibits an effect of sealing and absorbing vibrations, dislocation and mechanical movements taking place in the mechanical parts.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: April 25, 1995
    Assignee: Three Bond Co., Ltd.
    Inventors: Kazuhiro Kojima, Minami Hanada
  • Patent number: 5397812
    Abstract: An adhesive composition for being applied to at least one of thread contact faces of screw members so as to stick said thread contact faces to each other in engaging the screw members with each other for the purpose of locking and sealing the engaged screw members, in which micro-capsules enclosing at least a reactive monomer of a reactive adhesive composition comprising said monomer, a polymerization initiator of the aforesaid monomer and/or an activator of the aforesaid polymerization initiator is dispersed in a binder comprising a photo-hardening resin composition.
    Type: Grant
    Filed: March 9, 1993
    Date of Patent: March 14, 1995
    Assignee: Three Bond Co., Ltd.
    Inventors: Ikuzo Usami, Makoto Kurihara, Minami Hanada, Kunihiko Nakajima
  • Patent number: 5352308
    Abstract: A self-locking agent for a fastening device comprises a microencapsulated adhesive composition comprising the following constituents (a) to (c):(a) an epoxy compound having at least two epoxy groups,(b) an aromatic diamine represented by the following formula (a) or (b): ##STR1## wherein R.sub.1 to R.sub.4 each represent CH.sub.3, C.sub.2 H.sub.5, C.sub.3 H.sub.7, CH(CH.sub.3).sub.2, C.sub.4 H.sub.9 or a halogen, or ##STR2## wherein R.sub.5 to R.sub.7 each represent CH.sub.3, C.sub.2 H.sub.5, C.sub.3 H.sub.7 or a halogen, and(c) at least one compound selected from the group consisting of thiosalicylic acid, salicylic acid, benzoic anhydride, boron trifluoride and boron trifluoride complexes, wherein at least one of the epoxy compound (a) and aromatic diamine (b) is microencapsulated to keep them apart from each other, said self-locking agent has excellent thermal resistance and storage stability.
    Type: Grant
    Filed: June 4, 1993
    Date of Patent: October 4, 1994
    Assignee: Three Bond Co., Ltd.
    Inventors: Kenichi Tomihara, Naoki Sato, Minami Hanada, Isao Noguchi, Yumi Oka