Abstract: The cooling means for a driver semiconductor according to this invention is formed on a circuit board, which has a top side and a rear side. The front side of the circuit board is formed with a driver semiconductor that is soldered on the circuit board. The driver semiconductor has a plurality of input pins and output pins; at least a cooling element is conductively connected to the output pins of the driver semiconductor via the conductive layer on the back of the circuit board. In this way, when the driver semiconductor is overdriven, the produced heat energy is conducted from the output pins, through the conductive layer to the jumpers, radiated into the air and transmitted to the next electrical component.