Abstract: A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant optical filters may be used in a variety of applications including etalon applications.

Abstract: In an integrated optical waveguide device including a first top portion on the substrate, and a plurality of juxtaposed waveguide cores within cladding layers on a second top portion of the substrate, the waveguide cores having respective inner endfaces parallel to a longitudinal open slotway formed in the substrate between the first and second top portions, the substrate being undercut from the slotway to produce a cantilevered section of the waveguide cores and cladding layers, for permitting the plurality of waveguide cores and associated cladding layers to be simultaneously cleaved, thereby providing a smooth endface thereacross.

Abstract: A method for shaping an end of an optical fiber having a core to provide a novel optical fiber (or waveguide) includes the steps of contacting the fiber against a mold having a predetermined shape, The fiber and/or mold is heated. The fibers can be made of silica. The method is well suited for making wedge-shaped (i.e., standard screwdriver-like shaped) fiber tips. In addition, an apparatus for molding a shaped tip precisely located with respect to a core of an optical fiber includes a mold having one or more surfaces of the mold being configured and dimensioned to impart a predetermined shape to an end of an optical fiber contacted therewith, the predetermined shape being precisely located with respect to the core of the optical fiber.

Abstract: A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.

Abstract: A solder bonding system that includes a substrate having a recess and a conductive pad having a width. The conductive pad is disposed in the recess of the substrate. The solder bonding system also includes a solder pad contacting the conductive pad. The solder pad has a width greater than the width of the conductive pad. When the solder pad is heated, it forms a stable solder bond between the conductive pads.

Abstract: A method and apparatus for passively aligning an optical element on an optical die wherein multiple potential mounting pads are supplied for potential mounting of the optical component. Appropriate tables are generated for 1) the response of the optical detecting component for a given light power level as a function of the mounting position of the optical detecting component, and 2) the asymmetry of the light generating component. Given the two tables an algorithm is prepared for automatically determining the appropriate mounting position to provide desired detection device response characteristics for any given light generating component to be mounted on the die.

Abstract: A portable purge system for transporting materials, such as semiconductor wafers used in the manufacture of ICs, comprises a carrier having compartments for releasably receiving and enclosing the materials therein. The carrier is flooded with an inert gas such as nitrogen so as to adsorb the nitrogen on the surface of the materials, dilute contaminants, and purge the contaminants from the carrier. The carrier and the flooding means are mounted in a transport case. A humidifier is connected to the flooding means so that the materials will adsorb water and thereby further resist adsorption of hydrocarbon contaminants.

Abstract: A process is provided for the formation of a thin film of gate dielectric or similar material on a silicon semiconductor substrate from an organic precursor by atomic layer epitaxy, wherein the organic precursor is introduced to react with the treated surface to form a bonded monolayer of reactive species. A second reactant is introduced to react with the surface to form the desired dielectric. After each step in the cycle, the reaction chamber is purged with an inert gas to prevent reactions except on the surface. The cycle is repeated tens to hundreds of times to achieve a desired final film thickness. No less frequently than every third cycle, the film undergoes a discrete treatment step wherein ozone is introduced into the chamber to oxidize carbon contaminants therein to form volatile products which are removed from the reaction chamber by purging with the inert gas.

Abstract: A method is disclosed for forming a self-aligned optical subassembly for supporting an optical fiber and associated optical component(s). In particular, sequential masking layer/silicon substrate etch operations are performed so as to etch, in series, the largest opening first and the narrowest opening last. By following this procedure, axial alignment between tandem grooves is maintained.

Abstract: An LED has both its p and n bonding pads on the p side of the wafer for simultaneous solder bump alignment and electrical connection of the LED with a device carrier. A groove is formed dividing the p material of the device into an active region and an inactive region. The groove also provides a path for the device's n-contact, which extends from the n-material at the base of the groove, up the side of the groove, to the n bonding pad on the surface of the inactive p material.

Abstract: Solder bumps are electrodeposited onto a substrate with carefully controlled heights by forming patterned conductors on an substrate, depositing and patterning a layer of material, such as titanium that is easily oxidized, and electrodepositing the solder bumps. The solder does not deposit on the titanium. Solder bumps of uniform height are obtained because the titanium layer acts as part of the electrical circuit during electrodeposition.

Abstract: A method for providing an essentially uniform coating over the outer surface of an article of manufacture. In particular, a vapor deposition process is disclosed for coating relatively small articles, such as spheres which may be used as lenses in optical systems. The coating may comprise an anti-reflective or alternatively, reflective, material.

Abstract: An optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components. The technique as disclosed is useful in the packaging of a single active optical device and associated electronics, a pair of optical devices and electronics (transceiver), or an array of any desired number of such components. Since the silicon may be processed to include etched alignment fiducials and metallized bond pad sites, solder bump self-alignment and silicon optical bench technology may be used to provide for alignment between the active device, coupling lens and associated optical fiber.

Abstract: An optical subassembly is disclosed which provides self-alignment between an active optical device and associated optical elements. In particular, the subassembly comprises a first substrate member which is utilized to support the active optical device. A separate plurality of substrate members is used to form a support for the associated optical elements (i.e., fiber, coupling lens or both), where the separate members are stacked, one on top of the other, and an aperture through the center thereof utilized to support the optical elements. The aperture may be formed to include a mechanical stop suitable for fixing the location of an optical fiber endface. Alignment fiducials formed on the device support member and the stack provide self-alignment therebetween, as well as physical attachment of the support member to the stack. The various substrate members may comprise any suitable material including, but not limited to, silicon, metal, or molded plastic.

Abstract: An optical subassembly is disclosed which provides for passive alignment between an active optical device, lens and optical fiber. A first substrate is used as a mount for the active optical device and a second substrate is formed to include an aperture designed to capture the lens. Alignment fiducials formed on the mating surfaces of the first and second substrates provide accurate optical alignment between the active device and the lens. An optical fiber receptacle is formed to mate with the optical header supporting the substrates and thus provide alignment between the optical fiber and the active device/lens configuration. Preferably, the receptacle is formed to prevent physical contact with the aligned substrates, so that any movement of the receptacle will not effect the alignment between the device and lens.

Abstract: An optical assembly is disclosed which utilizes a pair of separate members to support an optical device and an associated optical fiber. Fiducial features, in conjunction with an optical device conductive attachment means, are utilized to provide self-alignment between the device and the fiber. Aligned fiducials are formed on each member such that when the members are physically joined, alignment between the optical device and fiber is achieved. In particular, the members are mated such that a direct optical signal path between the device and fiber is formed.

Abstract: An m-input/n-output (e.g., 2.times.2) optical fiber switch is disclosed which alters the location of the fibers by the application of an external force. Illustratively, the switch uses a housing with a diamond-shaped opening extending therethrough, with pairs of optical fibers positioned in orthogonally located V-grooves. Upon the application of an external force, the fibers are moved into the remaining, vacant V-grooves formed by the diamond-shaped opening. In a preferred embodiment, a (2.times.2) switch is magnetically activated.

Abstract: Ionic drift in integrated optical devices is reduced by the utilization of a gettering layer interposed between the surface dielectric and the electrodes. The material used to form this layer is capable of gettering the mobile ions at a relatively low temperature (for example <600.degree. C.).