Patents by Inventor Mindaugus F. Dautargas

Mindaugus F. Dautargas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level packaging for optoelectronic devices
    Patent number: 7345316
    Abstract: An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: March 18, 2008
    Assignee: Shipley Company, L.L.C.
    Inventors: David W. Sherrer, Mindaugus F. Dautargas, Neil Ricks, Dan A. Steinberg
  • Wafer level packaging for optoelectronic devices
    Publication number: 20040264866
    Abstract: An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
    Type: Application
    Filed: October 24, 2001
    Publication date: December 30, 2004
    Inventors: David W. Sherrer, Mindaugus F. Dautargas, Neal Ricks, Dan A. Steinberg