Patents by Inventor MINDI NI

MINDI NI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11551831
    Abstract: A data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic shielding layer arranged on an outer side of the plastic layer. The metallic shielding layer has a length matching the data transmission cable and a width greater than the circumferential extension length of the data transmission cable, two ends of the metallic shielding layer in a width direction are compacted and bonded to each other on one side of the data transmission cable in the width direction, to form a shielding portion covering the plastic layer and a compacting portion connected to one side of the shielding portion.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: January 10, 2023
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventor: Mindi Ni
  • Patent number: 11277913
    Abstract: An electrical connector assembly comprises a printed circuit board and a data transmission cable. The printed circuit board has a substrate and a routing structure, the substrate has a welding region and a routing region, the routing structure comprises a plurality of bonding pads. The data transmission cable comprises several juxtaposed wires, a plastic layer and a metallic layer formed by a metal material belt, each wire has a conductor, the metallic layer has at least an aluminum foil layer and a bonding layer. The metallic layer is bonded to the outer side of the plastic layer via the bonding layer. The wires are soldered with corresponding bonding pads, the center distance between every two neighboring wires is same as the center distance between every two neighboring bonding pads.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 15, 2022
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Mindi Ni, Yichang Chen
  • Publication number: 20220076863
    Abstract: A data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic shielding layer arranged on an outer side of the plastic layer. The metallic shielding layer has a length matching the data transmission cable and a width greater than the circumferential extension length of the data transmission cable, two ends of the metallic shielding layer in a width direction are compacted and bonded to each other on one side of the data transmission cable in the width direction, to form a shielding portion covering the plastic layer and a compacting portion connected to one side of the shielding portion.
    Type: Application
    Filed: September 8, 2021
    Publication date: March 10, 2022
    Inventor: MINDI NI
  • Publication number: 20210014969
    Abstract: An electrical connector assembly comprises a printed circuit board and a data transmission cable. The printed circuit board has a substrate and a routing structure, the substrate has a welding region and a routing region, the routing structure comprises a plurality of bonding pads. The data transmission cable comprises several juxtaposed wires, a plastic layer and a metallic layer formed by a metal material belt, each wire has a conductor, the metallic layer has at least an aluminum foil layer and a bonding layer. The metallic layer is bonded to the outer side of the plastic layer via the bonding layer. The wires are soldered with corresponding bonding pads, the center distance between every two neighboring wires is same as the center distance between every two neighboring bonding pads.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Inventors: MINDI NI, YICHANG CHEN
  • Patent number: 10827612
    Abstract: A printed circuit board comprises a substrate and a routing structure arranged on the substrate, the substrate has a welding region and a routing region electrical connected with the welding region. The routing structure comprises a plurality of bonding pads connected with corresponding wires and a plurality of conductive traces electrically connected with the bonding pads, the bonding pads is arranged in the welding region, and the conductive traces are disposed in both the welding region and the routing region. The bonding pads are arranged abreast, and in the arrangement direction of the bonding pads, the bonding pads defines at least two grounding pads for connecting with grounding wires and at least a signal pad between the two grounding pads.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: November 3, 2020
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Mindi Ni, Yichang Chen
  • Patent number: 10772202
    Abstract: A flat data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic layer formed by a metal material belt arranged on an outer side of the plastic layer in a spiral winding way. In the length direction of the data transmission cable, the data transmission cable has at least one bending portion, the data transmission cable is formed with a first section and a second section on both sides of the bending portion, and a stable bending angle is formed between the first section and the second section.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: September 8, 2020
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Mindi Ni, Yichang Chen
  • Patent number: 10772201
    Abstract: A flat data transmission cable includes a plurality of juxtaposed wires and a plastic layer enclosing on the wires integrally, each wire has a conductor. Central axes of the conductors are located on a same plane, and the plastic layer defines a top surface and a bottom surface parallel to the plane in which the central axes of the conductors located, the wires define at least two grounding wires and at least a signal wire between the two grounding wires.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: September 8, 2020
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Mindi Ni, Yichang Chen
  • Patent number: 10772203
    Abstract: A flat data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic layer formed by a metal material belt arranged on an outer side of the plastic layer in a spiral winding way, each wire has a conductor. The metallic layer has at least an aluminum foil layer and a bonding layer arranged on the side of the aluminum foil layer facing to the plastic layer, the metallic layer is bonded to the outer side of the plastic layer by the bonding layer.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: September 8, 2020
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Mindi Ni, Yichang Chen
  • Publication number: 20190371493
    Abstract: A flat data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic layer formed by a metal material belt arranged on an outer side of the plastic layer in a spiral winding way. In the length direction of the data transmission cable, the data transmission cable has at least one bending portion, the data transmission cable is formed with a first section and a second section on both sides of the bending portion, and a stable bending angle is formed between the first section and the second section.
    Type: Application
    Filed: May 9, 2019
    Publication date: December 5, 2019
    Inventors: MINDI NI, YICHANG CHEN
  • Publication number: 20190371491
    Abstract: A flat data transmission cable includes a plurality of juxtaposed wires and a plastic layer enclosing on the wires integrally, each wire has a conductor. Central axes of the conductors are located on a same plane, and the plastic layer defines a top surface and a bottom surface parallel to the plane in which the central axes of the conductors located, the wires define at least two grounding wires and at least a signal wire between the two grounding wires.
    Type: Application
    Filed: May 9, 2019
    Publication date: December 5, 2019
    Inventors: MINDI NI, YICHANG CHEN
  • Publication number: 20190371492
    Abstract: A flat data transmission cable includes a plurality of juxtaposed wires, a plastic layer enclosing on the wires integrally and a metallic layer formed by a metal material belt arranged on an outer side of the plastic layer in a spiral winding way, each wire has a conductor. The metallic layer has at least an aluminum foil layer and a bonding layer arranged on the side of the aluminum foil layer facing to the plastic layer, the metallic layer is bonded to the outer side of the plastic layer by the bonding layer.
    Type: Application
    Filed: May 9, 2019
    Publication date: December 5, 2019
    Inventors: MINDI NI, YICHANG CHEN
  • Publication number: 20190373726
    Abstract: A printed circuit board comprises a substrate and a routing structure arranged on the substrate, the substrate has a welding region and a routing region electrical connected with the welding region. The routing structure comprises a plurality of bonding pads connected with corresponding wires and a plurality of conductive traces electrically connected with the bonding pads, the bonding pads is arranged in the welding region, and the conductive traces are disposed in both the welding region and the routing region. The bonding pads are arranged abreast, and in the arrangement direction of the bonding pads, the bonding pads defines at least two grounding pads for connecting with grounding wires and at least a signal pad between the two grounding pads.
    Type: Application
    Filed: May 9, 2019
    Publication date: December 5, 2019
    Inventors: MINDI NI, YICHANG CHEN