Patents by Inventor Minehiro Imamura
Minehiro Imamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10189259Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.Type: GrantFiled: August 7, 2017Date of Patent: January 29, 2019Assignee: SEIKO EPSON CORPORATIONInventors: Hiroyuki Tsuchiya, Yasuhide Matsuo, Kenji Otsuka, Minehiro Imamura, Tomohiro Hayashi, Kei Tadachi
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Publication number: 20170334207Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.Type: ApplicationFiled: August 7, 2017Publication date: November 23, 2017Applicant: SEIKO EPSON CORPORATIONInventors: Hiroyuki TSUCHIYA, Yasuhide MATSUO, Kenji OTSUKA, Minehiro IMAMURA, Tomohiro HAYASHI, Kei TADACHI
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Patent number: 9789691Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.Type: GrantFiled: February 26, 2015Date of Patent: October 17, 2017Assignee: SEIKO EPSON CORPORATIONInventors: Hiroyuki Tsuchiya, Yasuhide Matsuo, Kenji Otsuka, Minehiro Imamura, Tomohiro Hayashi, Kei Tadachi
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Publication number: 20150239223Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.Type: ApplicationFiled: February 26, 2015Publication date: August 27, 2015Inventors: Hiroyuki TSUCHIYA, Yasuhide MATSUO, Kenji OTSUKA, Minehiro IMAMURA, Tomohiro HAYASHI, Kei TADACHI
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Patent number: 8182641Abstract: A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.Type: GrantFiled: March 23, 2010Date of Patent: May 22, 2012Assignee: Seiko Epson CorporationInventors: Minehiro Imamura, Kazuhiro Gomi
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Publication number: 20100304157Abstract: A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding filmType: ApplicationFiled: May 13, 2010Publication date: December 2, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Mitsuru SATO, Takatoshi YAMAMOTO, Nobuhiro NAITO, Minehiro IMAMURA
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Publication number: 20100304156Abstract: A bonding method includes: preparing a first base material and a second base material to be bonded to each other via a bonding film; forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of the first base material and the second base material, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing tType: ApplicationFiled: May 12, 2010Publication date: December 2, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Mitsuru SATO, Takatoshi YAMAMOTO, Nobuhiro NAITO, Minehiro IMAMURA
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Publication number: 20100243134Abstract: A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.Type: ApplicationFiled: March 23, 2010Publication date: September 30, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Minehiro IMAMURA, Kazuhiro GOMI
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Publication number: 20100243145Abstract: A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure.Type: ApplicationFiled: March 23, 2010Publication date: September 30, 2010Applicant: Seiko Epson CorporationInventors: Minehiro IMAMURA, Kazuhiro GOMI
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Publication number: 20100206474Abstract: A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and curing the liquid coating to obtain a bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.Type: ApplicationFiled: February 16, 2010Publication date: August 19, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Mitsuru SATO, Takatoshi YAMAMOTO, Nobuhiro NAITO, Minehiro IMAMURA
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Publication number: 20100092767Abstract: A bonding method includes applying a liquid material containing silicone materials to at least one of the first base member and the second base member so as to form a liquid film, drying the liquid film so as to obtain a bonding film on the at least one of the first base member and the second base member, heating the bonding film so as to cross-link the silicone materials contained in the bonding film to each other, and applying energy to the bonding film so as to develop adhesiveness around a surface of the bonding film so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed between the first base member and the second base member.Type: ApplicationFiled: October 12, 2009Publication date: April 15, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Nobuhiro NAITO, Mitsuru SATO, Takatoshi YAMAMOTO, Minehiro IMAMURA
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Publication number: 20100092788Abstract: A bonding method includes: a) applying a liquid material containing a silicone material to at least one of the first base member and the second base member so as to form a liquid film on the at least one of the base members; b) drying the liquid film so as to obtain the bonding film on the at least one of the first base member and the second base member; c) bringing plasma into contact with the bonding film so as to develop adhesiveness around a surface of the bonding film; and d) bringing the first base member and the second base member into contact with each other in a manner to interpose the bonding film on which adhesiveness is developed therebetween so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed therebetween.Type: ApplicationFiled: October 12, 2009Publication date: April 15, 2010Applicant: SEIKO EPSON CORPORATIONInventors: Nobuhiro NAITO, Mitsuru SATO, Takatoshi YAMAMOTO, Minehiro IMAMURA
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Patent number: 7599415Abstract: A light source device includes a light source section for supplying a laser beam, a wavelength conversion element for converting a wavelength of the laser beam from the light source section, a temperature measuring section for measuring temperature, a temperature adjusting section for adjusting the temperature of the wavelength conversion element in accordance with a result of the measurement by the temperature measuring section, and a thermal diffusion section for diffusing heat to be conducted to the wavelength conversion element, wherein the thermal diffusion section is provided with a first surface disposed on a side of the wavelength conversion element and a second surface disposed on an opposite side to the first surface, and the temperature measuring section is provided to a part of the thermal diffusion section, which is located on a side of the second surface and has higher thermal conductivity of the thermal diffusion section between the side of the first surface and the side of the second surface tType: GrantFiled: February 1, 2008Date of Patent: October 6, 2009Assignee: Seiko Epson CorporationInventors: Kunihiko Takagi, Minehiro Imamura, Akira Egawa
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Patent number: 7561612Abstract: A laser source device provided with a light source, a wavelength conversion element, an external resonator, and an optical path conversion element. The wavelength conversion element is disposed inside the resonance structure, the second laser beam is taken out on the second optical path by the optical path conversion element and is led to a direction substantially the same as the proceeding direction of the first laser beam, and is used with the first laser beam as the output light beam. The selectively reflective film and the reflective surface for taking out the second laser beam are integrated.Type: GrantFiled: September 28, 2006Date of Patent: July 14, 2009Assignee: Seiko Epson CorporationInventors: Keiko Kumagai, Minehiro Imamura
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Publication number: 20080187014Abstract: A light source device includes a light source section for supplying a laser beam, a wavelength conversion element for converting a wavelength of the laser beam from the light source section, a temperature measuring section for measuring temperature, a temperature adjusting section for adjusting the temperature of the wavelength conversion element in accordance with a result of the measurement by the temperature measuring section, and a thermal diffusion section for diffusing heat to be conducted to the wavelength conversion element, wherein the thermal diffusion section is provided with a first surface disposed on a side of the wavelength conversion element and a second surface disposed on an opposite side to the first surface, and the temperature measuring section is provided to a part of the thermal diffusion section, which is located on a side of the second surface and has higher thermal conductivity of the thermal diffusion section between the side of the first surface and the side of the second surface tType: ApplicationFiled: February 1, 2008Publication date: August 7, 2008Applicant: SEIKO EPSON CORPORATIONInventors: Kunihiko TAKAGI, Minehiro IMAMURA, Akira EGAWA
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Publication number: 20080080185Abstract: A laser source device provided with a light source, a wavelength conversion element, an external resonator, and an optical path conversion element. The wavelength conversion element is disposed inside the resonance structure, the second laser beam is taken out on the second optical path by the optical path conversion element and is led to a direction substantially the same as the proceeding direction of the first laser beam, and is used with the first laser beam as the output light beam. The selectively reflective film and the reflective surface for taking out the second laser beam are integrated.Type: ApplicationFiled: September 28, 2006Publication date: April 3, 2008Applicant: SEIKO EPSON CORPORATIONInventors: Keiko KUMAGAI, Minehiro IMAMURA
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Publication number: 20060175938Abstract: A piezoelectric device includes: packages, each of which having therein a piezoelectric element having a predetermined direction of detection, wherein the packages are connected to each other so that the directions of detection of the piezoelectric elements intersect each other.Type: ApplicationFiled: February 1, 2006Publication date: August 10, 2006Inventors: Minehiro Imamura, Shinji Mizuno