Abstract: Provided is an ultrasonic sensor which includes a piezoelectric vibrator made of a lithium niobate (LN) single crystal and may be used in a high temperature region by generating a high ultrasonic wave output, and prevents cracks from being generated in the crystal. A piezoelectric vibrator 1 of the present invention has a surface (Y-axis 36° cut surface) obtained by rotating a surface orthogonal to a Y-axis of the LN crystal about an X-axis by 36°±2° as an output surface. The ultrasonic sensor further includes a retarder 3 made of titanium and a bonding layer 2 for bonding one surface of the retarder 3 to the output surface. The bonding layer 2 is made of silver and frit glass, and the frit glass has a coefficient of linear expansion ranging from 5×10?6 K?1 to 15×10?6 K?1.

Abstract: Provided is an ultrasonic sensor which includes a piezoelectric vibrator made of a lithium niobate (LN) single crystal and may be used in a high temperature region by generating a high ultrasonic wave output, and prevents cracks from being generated in the crystal. A piezoelectric vibrator 1 of the present invention has a surface (Y-axis 36° cut surface) obtained by rotating a surface orthogonal to a Y-axis of the LN crystal about an X-axis by 36°±2° as an output surface. The ultrasonic sensor further includes a retarder 3 made of titanium and a bonding layer 2 for bonding one surface of the retarder 3 to the output surface. The bonding layer 2 is made of silver and frit glass, and the frit glass has a coefficient of linear expansion ranging from 5×10?6 K?1 to 15×10?6 K?1.

Abstract: A high frequency device having a membrane structure with improved mechanical strength is provided. The high frequency device includes: a substrate having an aperture; a first dielectric layer that is formed from a material having etching selectivity in relation to a material of the substrate and is provided on the substrate to cover the aperture; a second dielectric layer on the first dielectric layer; and a high frequency element provided in a position opposed to the aperture on the second dielectric layer.

Abstract: A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates.

Abstract: A high frequency device having a membrane structure with improved mechanical strength is provided. The high frequency device includes: a substrate having an aperture; a first dielectric layer that is formed from a material having etching selectivity in relation to a material of the substrate and is provided on the substrate to cover the aperture; a second dielectric layer on the first dielectric layer; and a high frequency element provided in a position opposed to the aperture on the second dielectric layer.

Abstract: A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.

Abstract: This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick.

Abstract: A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member (4). On bonding surfaces of these substrates (2) and (3), grooves (5) and (6) are formed. These grooves (5) and (6) are formed so as to function as a heat pipe of a loop type when these substrates (2) and (3) are bonded.

Abstract: A surface processing method for processing the surface of an insulating article in which an ion-implanted surface-modified layer is effectively formed on the article 2. In surface processing the article 2 of an insulating material, an electrically conductive thin metal film 50 is first formed on the article surface. A pulsed voltage containing a positive pulsed voltage and a negative pulsed voltage is applied to the article in a plasma containing ions to be implanted to implant ions in the article surface. This implants ions at right angles to the article surface to generate a surface-modified layer 51. There is no possibility of the article 2 being charged up due to application of a pulsed voltage.

Abstract: A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.

Abstract: A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member (4). On bonding surfaces of these substrates (2) and (3), grooves (5) and (6) are formed. These grooves (5) and (6) are formed so as to function as a heat pipe of a loop type when these substrates (2) and (3) are bonded.

Abstract: The present invention provides a cooling device having improved cooling performance and providing higher flexibility, an electronic apparatus and an acoustic apparatus employing the cooling device, and a method for producing the cooling device. The cooling device is provided with an evaporator that is capable of cooling an object to be cooled, and a condenser that is capable of releasing to the outside heat that has been absorbed during the cooling by the evaporator. A vapor-phase conduit and a liquid-phase conduit, both of which are made of fluorocarbon resin and through which an operating medium flows, are disposed between and coupled to the evaporator and the condenser, thereby circulating the operating medium.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.