Patents by Inventor Minekazu Sakai

Minekazu Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190301866
    Abstract: Within a housing portion in which a recessed portion is formed, a circuit board is arranged on the bottom surface of the recessed portion, through a first connecting member. An acceleration sensor is stacked on the circuit board, through a second connecting member. Hence, sections that function as three or more springs, i.e., an anti-vibration portion, the first connecting member, and the second connecting member, are situated between an angular velocity sensor and the acceleration sensor. For this reason, transmission of vibration of the vibrating element in the angular velocity sensor to the acceleration sensor can be restricted, and reduction in the detection accuracy of the acceleration sensor can be restricted.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 3, 2019
    Inventors: Takeru KANAZAWA, Minekazu SAKAI, Naoki YOSHIDA, Kiyomasa SUGIMOTO, Nobuaki KUZUYA
  • Patent number: 10393523
    Abstract: A physical quantity sensor includes a detection unit outputting a detection signal corresponding to a vibration of a vibrating element in an angular velocity sensor, and a self-diagnostic unit self-diagnosing a detection environment of an acceleration sensor and the angular velocity sensor on a basis of the detection signal outputted by the detection unit.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: August 27, 2019
    Assignee: DENSO CORPORATION
    Inventors: Kiyomasa Sugimoto, Naoki Yoshida, Minekazu Sakai, Nobuaki Kuzuya
  • Patent number: 10338092
    Abstract: In a physical quantity sensor, a contact part that is directly and electrically connected to an external circuit is formed in a support substrate, and the support substrate is maintained at a predetermined potential through the contact part. With this configuration, the support substrate is maintained at the predetermined potential without disposing an electrode in the interior of the semiconductor layer. For that reason, a processing precision can be restrained from being reduced in forming the movable electrode, and hence a detection precision can be restrained from being reduced.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: July 2, 2019
    Assignee: DENSO CORPORATION
    Inventors: Minekazu Sakai, Kiyomasa Sugimoto
  • Patent number: 10132631
    Abstract: An angular velocity sensor includes a first substrate having first and second surfaces, a vibrating member disposed on the first substrate and including a drive piece capable of vibrating along the first substrate, a second substrate disposed on the first surface side, a first drive piece control electrode, a first drive piece auxiliary electrode, and a first drive piece control circuit applying a voltage to the first drive piece auxiliary electrode. The first drive piece control circuit adjusts, based on the capacitance generated between the first drive piece control electrode and the first drive piece auxiliary electrode, the voltage to be applied to the first drive piece auxiliary electrode to maintain a constant distance between the first drive piece control electrode and the first drive piece auxiliary electrode.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: November 20, 2018
    Assignee: DENSO CORPORATION
    Inventors: Minekazu Sakai, Naoki Yoshida, Kiyomasa Sugimoto
  • Patent number: 10126323
    Abstract: A capacitive physical quantity sensor includes a first substrate, a movable electrode, a fixed electrode, a second substrate, a signal applying unit, a C-V conversion circuit, and an auxiliary electrode. The auxiliary electrode is disposed from a portion of the second substrate which faces the movable electrode to a portion of the second substrate which faces a displaceable region of the movable electrode. The signal applying unit applies a predetermined potential to the auxiliary electrode at the time of self-diagnosis, to thereby increase a density of electric force lines generated between the fixed electrode located in a direction of displacing the movable electrode and the movable electrode.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: November 13, 2018
    Assignee: DENSO CORPORATION
    Inventors: Minekazu Sakai, Kiyomasa Sugimoto
  • Patent number: 10060744
    Abstract: When one direction of plane directions of a substrate is a first direction and a direction of the plane directions of the substrate perpendicular to the first direction is a second direction, a vibrating member is supported at an outer peripheral section via a plurality of beam sections having first beam-configuring members that can displace at least in the first direction and second beam-configuring members that are joined to the first beam-configuring members and that can displace at least in the second direction. In at least a subset of the plurality of beam sections, beam-configuring members on a side of the outer peripheral section among the first beam-configuring members and the second beam-configuring members are integrated with each other.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: August 28, 2018
    Assignee: DENSO CORPORATION
    Inventors: Minekazu Sakai, Tomoya Jomori
  • Patent number: 10001375
    Abstract: A sensor device has a gyro sensor and an acceleration sensor. The gyro sensor has a fixed base portion formed in a rectangular frame shape. The acceleration sensor is formed in an inside space of the fixed base portion of the rectangular frame shape. The gyro sensor is formed in an outside space formed between the fixed base portion and an outer frame portion of a sensor base plate. The gyro sensor and the acceleration sensor are formed in one chip. As a result, the sensor device can be made smaller in size.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: June 19, 2018
    Assignee: DENSO CORPORATION
    Inventors: Takeru Kanazawa, Minekazu Sakai
  • Patent number: 9823266
    Abstract: A capacitive physical quantity sensor includes a first substrate, a movable electrode, a fixed electrode, and a second substrate. An auxiliary electrode is disposed on a portion of the second substrate to face the movable electrode and the auxiliary electrode has a facing area that faces the movable electrode. The facing area in a case where the movable electrode is displaced in one direction is different from the facing area in a case where the movable electrode is displaced in an opposite direction opposite to the one direction. The physical quantity is detected based on a capacitance, which is generated corresponding to the interval between the fixed electrode and the movable electrode, and a capacitance, which is generated corresponding to an interval between the facing area of the movable electrode and the auxiliary electrode.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: November 21, 2017
    Assignee: DENSO CORPORATION
    Inventors: Kiyomasa Sugimoto, Minekazu Sakai
  • Patent number: 9791472
    Abstract: In an acceleration sensor, a semiconductor layer is provided with a rod-shaped weight portion that passes through a center of a frame portion, extends in a second direction, and is connected to the frame portion through a first beam portion. A first-direction movable electrode and a second-direction movable electrode are provided on the weight portion. According to the above configuration, because a mass of the first- and second-direction movable electrodes can be applied to the vicinity of a center of the frame portion, and a rotational moment can be reduced. Thus, detection accuracy can be restrained from being reduced.
    Type: Grant
    Filed: September 1, 2014
    Date of Patent: October 17, 2017
    Assignee: DENSO CORPORATION
    Inventors: Minekazu Sakai, Kiyomasa Sugimoto
  • Patent number: 9739797
    Abstract: A sensor device includes a semiconductor substrate and multiple sensing portions that are placed on one side of the semiconductor substrate and convert a physical quantity into an electrical signal. The one side is parallel to a reference plane defined by an X-direction and a Y-direction perpendicular to each other. The semiconductor substrate has a center point that is both a geometric center and a center of mass. The semiconductor substrate is axisymmetric with respect to each of a first reference line passing through the center point and parallel to the X-direction and a second reference line passing through the center point and parallel to the Y-direction. Each of the sensing portions is axisymmetric with respect to each of the first reference line and the second reference line.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: August 22, 2017
    Assignee: DENSO CORPORATION
    Inventors: Fumiyoshi Ariki, Minekazu Sakai, Kiyomasa Sugimoto
  • Publication number: 20170108335
    Abstract: When one direction of plane directions of a substrate is a first direction and a direction of the plane directions of the substrate perpendicular to the first direction is a second direction, a vibrating member is supported at an outer peripheral section via a plurality of beam sections having first beam-configuring members that can displace at least in the first direction and second beam-configuring members that are joined to the first beam-configuring members and that can displace at least in the second direction. In at least a subset of the plurality of beam sections, beam-configuring members on a side of the outer peripheral section among the first beam-configuring members and the second beam-configuring members are integrated with each other.
    Type: Application
    Filed: June 11, 2015
    Publication date: April 20, 2017
    Inventors: Minekazu SAKAI, Tomoya JOMORI
  • Publication number: 20170074653
    Abstract: Within a housing portion in which a recessed portion is formed, a circuit board is arranged on the bottom surface of the recessed portion, through a first connecting member. An acceleration sensor is stacked on the circuit board, through a second connecting member. Hence, sections that function as three or more springs, i.e., an anti-vibration portion, the first connecting member, and the second connecting member, are situated between an angular velocity sensor and the acceleration sensor. For this reason, transmission of vibration of the vibrating element in the angular velocity sensor to the acceleration sensor can be restricted, and reduction in the detection accuracy of the acceleration sensor can be restricted.
    Type: Application
    Filed: June 11, 2015
    Publication date: March 16, 2017
    Inventors: Takeru KANAZAWA, Minekazu SAKAI, Naoki YOSHIDA, Kiyomasa SUGIMOTO, Nobuaki KUZUYA
  • Publication number: 20170059320
    Abstract: A physical quantity sensor includes a detection unit outputting a detection signal corresponding to a vibration of a vibrating element in an angular velocity sensor, and a self-diagnostic unit self-diagnosing a detection environment of an acceleration sensor and the angular velocity sensor on a basis of the detection signal outputted by the detection unit.
    Type: Application
    Filed: June 11, 2015
    Publication date: March 2, 2017
    Inventors: Kiyomasa SUGIMOTO, Naoki YOSHIDA, Minekazu SAKAI, Nobuaki KUZUYA
  • Publication number: 20170052027
    Abstract: A vibration angular velocity sensor includes a fixed portion, a movable portion, a beam portion, and an anti-vibration spring structure. The movable portion has driving-detection weights. The beam portion has detection beams, support members, and driving beams, and has a frame structure formed of the driving beams, the support members, and the driving-detection weights. The anti-vibration spring structure is disposed between the detection beams and the fixed portion and is deformable along a first axis and a second axis. The vibration angular velocity sensor causes the driving-detection weights disposed on both sides of the fixed portion to undergo driving vibrations in directions opposite to each other along the first axis about the fixed portion and detects an angular velocity based on a fact that the driving-detection weights vibrate also along the second axis upon application of the angular velocity.
    Type: Application
    Filed: June 2, 2015
    Publication date: February 23, 2017
    Inventors: Tomoya JOMORI, Minekazu SAKAI
  • Publication number: 20170016724
    Abstract: An angular velocity sensor includes a first substrate having first and second surfaces, a vibrating member disposed on the first substrate and including a drive piece capable of vibrating along the first substrate, a second substrate disposed on the first surface side, a first drive piece control electrode, a first drive piece auxiliary electrode, and a first drive piece control circuit applying a voltage to the first drive piece auxiliary electrode. The first drive piece control circuit adjusts, based on the capacitance generated between the first drive piece control electrode and the first drive piece auxiliary electrode, the voltage to be applied to the first drive piece auxiliary electrode to maintain a constant distance between the first drive piece control electrode and the first drive piece auxiliary electrode.
    Type: Application
    Filed: April 17, 2015
    Publication date: January 19, 2017
    Inventors: Minekazu SAKAI, Naoki YOSHIDA, Kiyomasa SUGIMOTO
  • Publication number: 20170016727
    Abstract: A sensor device has a gyro sensor and an acceleration sensor. The gyro sensor has a fixed base portion formed in a rectangular frame shape. The acceleration sensor is formed in an inside space of the fixed base portion of the rectangular frame shape. The gyro sensor is formed in an outside space formed between the fixed base portion and an outer frame portion of a sensor base plate. The gyro sensor and the acceleration sensor are formed in one chip. As a result, the sensor device can be made smaller in size.
    Type: Application
    Filed: July 7, 2016
    Publication date: January 19, 2017
    Inventors: Takeru KANAZAWA, Minekazu SAKAI
  • Publication number: 20170012602
    Abstract: An oscillation device includes a vibrator made of a quartz substrate, a vibration substrate coupled to the vibrator and including a peripheral portion surrounding a periphery of the vibrator, a support substrate jointed to the vibration substrate at the peripheral portion of the vibration substrate, a cap layer disposed on an opposite side of the vibration substrate from the support substrate and jointed to the vibration substrate at the peripheral portion of the vibration substrate via a joint. At least one pad electrically connected to the vibration substrate is formed on the cap layer. At least one conductor pattern opposed to the pad is formed on a vibration substrate side surface of the cap layer and is electrically connected to the pad.
    Type: Application
    Filed: July 5, 2016
    Publication date: January 12, 2017
    Inventors: Takeru KANAZAWA, Minekazu SAKAI
  • Patent number: 9513245
    Abstract: A humidity sensor includes a detection device with a capacitance changing with humidity at a first ratio and a reference device with a capacitance changing with humidity at a second ratio smaller than the first ratio. The detection device has detection electrodes facing each other with a first gap and a detection humidity-sensitive film covering the detection electrodes. The reference device has reference electrodes facing each other with a second gap and a reference humidity-sensitive film covering the reference electrodes. The detection humidity-sensitive film and the reference humidity-sensitive film are made from the same material and have the same thickness. The detection electrodes and the reference electrodes are made from the same material and have the same width and thickness. The second ratio peaks when the second gap is equal to a predetermined value. The second gap is smaller than the first gap and the predetermined value.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: December 6, 2016
    Assignee: DENSO CORPORATION
    Inventors: Minekazu Sakai, Naohisa Niimi
  • Publication number: 20160223582
    Abstract: In a physical quantity sensor, a contact part that is directly and electrically connected to an external circuit is formed in a support substrate, and the support substrate is maintained at a predetermined potential through the contact part. With this configuration, the support substrate is maintained at the predetermined potential without disposing an electrode in the interior of the semiconductor layer. For that reason, a processing precision can be restrained from being reduced in forming the movable electrode, and hence a detection precision can be restrained from being reduced.
    Type: Application
    Filed: September 23, 2014
    Publication date: August 4, 2016
    Inventors: Minekazu SAKAI, Kiyomasa SUGIMOTO
  • Publication number: 20160187371
    Abstract: In an acceleration sensor, a semiconductor layer is provided with a rod-shaped weight portion that passes through a center of a frame portion, extends in a second direction, and is connected to the frame portion through a first beam portion. A first-direction movable electrode and a second-direction movable electrode are provided on the weight portion. According to the above configuration, because a mass of the first- and second-direction movable electrodes can be applied to the vicinity of a center of the frame portion, and a rotational moment can be reduced. Thus, detection accuracy can be restrained from being reduced.
    Type: Application
    Filed: September 1, 2014
    Publication date: June 30, 2016
    Inventors: Minekazu SAKAI, Kiyomasa SUGIMOTO