Patents by Inventor Mineo Kondo

Mineo Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS AND METHOD FOR FORMING SOLDER WICKING PREVENTION ZONE AND ELECTRONIC PART
    Publication number: 20080041923
    Abstract: The present invention provides an apparatus for forming a solder wicking prevention zone operating when a connector member with a connector is processed using molten solder, to hinder the solder from spreading to a contact site of the connector in a wettable manner. The apparatus includes a main forming agent tank which stores a main forming agent used to form the solder wicking prevention zone, an ejection nozzle which ejects the main forming agent stored in the main forming agent tank, and a direction control section which controls an ejection direction of the main forming agent ejected by the ejection nozzle. The direction control section controls the ejection direction of the main forming agent ejected by the ejection nozzle, so as to apply the main forming agent to a predetermined position on the connector member to form the solder wicking prevention zone.
    Type: Application
    Filed: January 11, 2007
    Publication date: February 21, 2008
    Applicants: MURATA CO., LTD., Morimura Bros., Inc.
    Inventors: Kazuhiko KATO, Satoshi Yanagida, Osamu Sato, Mineo Kondo
  • Apparatus and method for forming solder wicking prevention zone and electronic part
    Publication number: 20040224541
    Abstract: The present invention provides an apparatus for forming a solder wicking prevention zone operating when a connector member with a connector is processed using molten solder, to hinder the solder from spreading to a contact site of the connector in a wettable manner. The apparatus includes a main forming agent tank which stores a main forming agent used to form the solder wicking prevention zone, an ejection nozzle which ejects the main forming agent stored in the main forming agent tank, and a direction control section which controls an ejection direction of the main forming agent ejected by the ejection nozzle. The direction control section controls the ejection direction of the main forming agent ejected by the ejection nozzle, so as to apply the main forming agent to a predetermined position on the connector member to form the solder wicking prevention zone.
    Type: Application
    Filed: April 28, 2004
    Publication date: November 11, 2004
    Applicants: MURATA CO., LTD., Morimura Bros., Inc.
    Inventors: Kazuhiko Kato, Satoshi Yanagida, Osamu Sato, Mineo Kondo