Patents by Inventor MINFANG MU

MINFANG MU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10967428
    Abstract: Disclosed herein are coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Further disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 6, 2021
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Patent number: 10672922
    Abstract: Disclosed herein are solar cells comprising semiconductor substrates and Cu electrodes attached thereto, wherein, the Cu electrodes are derived from conductive pastes containing powder mixtures of Cu particles and crystalline Ge particles and glass frits dispersed in organic media.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: June 2, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng
  • Patent number: 10629323
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 21, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose Manuel Rodriguez-Parada
  • Patent number: 10611931
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 7, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Patent number: 10325693
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: June 18, 2019
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Minfang Mu, Yundan Wu
  • Publication number: 20180282591
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.
    Type: Application
    Filed: August 28, 2015
    Publication date: October 4, 2018
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Publication number: 20180250740
    Abstract: Disclosed herein are coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Further disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper particles, and optional (c) solvent.
    Type: Application
    Filed: August 28, 2015
    Publication date: September 6, 2018
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Publication number: 20180237618
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.
    Type: Application
    Filed: August 28, 2015
    Publication date: August 23, 2018
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Patent number: 10030176
    Abstract: Disclosed herein is an electrically conductive adhesive composition and its use in solar cell modules, wherein the electrically conductive adhesive comprises a fluoroelastomer matrix and dispersed in the fluoroelastomer matrix about 40-90 wt % of conductive particles, with the wt % of all components comprised in the compositions totaling to 100 wt %.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: July 24, 2018
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Minfang Mu, Zengjun Liu
  • Patent number: 10032945
    Abstract: Disclosed herein is an electrically conductive adhesive composition and its use in solar cell modules, wherein the electrically conductive adhesive comprises a polymer matrix and dispersed in the polymer matrix about 40-90 wt % of conductive particles, with the wt % of all components comprised in the compositions totaling to 100 wt %, and wherein the polymer matrix comprises or is formed of a blend of at least one ethylene/alkyl (meth)acrylate copolymer elastomer and at least one ethylene vinyl acetate copolymer at a weight ratio ranging from about 10:90 to about 70:30.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: July 24, 2018
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Minfang Mu, Zengjun Liu
  • Patent number: 9951231
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder of coated Cu particles and glass frit dispersed in an organic medium.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: April 24, 2018
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: Minfang Mu
  • Patent number: 9882078
    Abstract: A process for forming a back-sheet assembly for a photovoltaic module having multiple solar cells with back-side electrical contacts includes providing a substrate, adhering an electrically conductive metal circuit to the substrate, adhering release pads to the metal circuit in a pattern, adhering an insulating layer to the metal circuit, forming openings in said insulating layer in a pattern over the release pads, and filling the openings with electrically conductive material that is in electrical contact with the electrically conductive metal circuit. A process for forming a photovoltaic module with this back-sheet assembly is also provided. The back-sheet assembly and photovoltaic module made with the back-sheet assembly are also provided.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: January 30, 2018
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Changming Lei, Zelin Liu, Minfang Mu
  • Publication number: 20170287587
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
    Type: Application
    Filed: August 28, 2014
    Publication date: October 5, 2017
    Inventors: Minfang Mu, Yundan Wu
  • Publication number: 20170278989
    Abstract: Disclosed herein are solar cells comprising semiconductor substrates and Cu electrodes attached thereto, wherein, the Cu electrodes are derived from conductive pastes containing powder mixtures of Cu particles and crystalline Ge particles and glass frits dispersed in organic media.
    Type: Application
    Filed: August 28, 2014
    Publication date: September 28, 2017
    Inventors: Minfang Mu, Dan Feng
  • Publication number: 20170275477
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder of coated Cu particles and glass frit dispersed in an organic medium.
    Type: Application
    Filed: August 28, 2014
    Publication date: September 28, 2017
    Inventor: Minfang Mu
  • Publication number: 20150357497
    Abstract: Disclosed herein is an electrically conductive adhesive composition and its use in solar cell modules, wherein the electrically conductive adhesive comprises a polymer matrix and dispersed in the polymer matrix about 40-90 wt % of conductive particles, with the wt % of all components comprised in the compositions totaling to 100 wt %, and wherein the polymer matrix comprises or is formed of a blend of at least one ethylene/alkyl (meth)acrylate copolymer elastomer and at least one ethylene vinyl acetate copolymer at a weight ratio ranging from about 10:90 to about 70:30.
    Type: Application
    Filed: January 9, 2014
    Publication date: December 10, 2015
    Inventors: Minfang Mu, Zengjun Liu
  • Publication number: 20150353779
    Abstract: Disclosed herein is an electrically conductive adhesive composition and its use in solar cell modules, wherein the electrically conductive adhesive comprises a fluoroelastomer matrix and dispersed in the fluoroelastomer matrix about 40-90 wt % of conductive particles, with the wt % of all components comprised in the compositions totaling to 100 wt %.
    Type: Application
    Filed: January 9, 2014
    Publication date: December 10, 2015
    Inventors: Minfang Mu, Zengjun Liu
  • Publication number: 20150155399
    Abstract: An integrated back sheet with an aluminum conductive circuit and a back-contact photovoltaic module are provided. In the integrated back sheet and the back-contact photovoltaic module, metallic conductive parts are directly welded in a certain pattern onto the front side of the aluminum conductive circuit by ultrasonic welding. Electrical bonding parts connect the metallic conductive parts through an insulation layer to the electric back contacts of a photovoltaic cell. A method of making the integrated back sheet with an aluminum conductive circuit and a back-contact photovoltaic module incorporating the integrated back sheet are also provided.
    Type: Application
    Filed: December 4, 2014
    Publication date: June 4, 2015
    Inventors: Minfang MU, Zelin LIU
  • Publication number: 20140190545
    Abstract: A process for forming a back-sheet assembly for a photovoltaic module having multiple solar cells with back-side electrical contacts includes providing a substrate, adhering an electrically conductive metal circuit to the substrate, adhering release pads to the metal circuit in a pattern, adhering an insulating layer to the metal circuit, forming openings in said insulating layer in a pattern over the release pads, and filling the openings with electrically conductive material that is in electrical contact with the electrically conductive metal circuit. A process for forming a photovoltaic module with this back-sheet assembly is also provided. The back-sheet assembly and photovoltaic module made with the back-sheet assembly are also provided.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 10, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: CHANGMING LEI, ZELIN LIU, MINFANG MU
  • Publication number: 20140150862
    Abstract: An assembly for forming a back-contact photovoltaic module includes an integrated back-sheet with a substrate, an electrically conductive metal circuit adhered to a front surface of the substrate, and a back insulating layer adhered to the electrically conductive metal circuit. The back insulating layer has openings aligned with the electrically conductive metal circuit and with electrical contacts on the back side of a back-contact solar cell. A front sheet and front encapsulant layer are provided on a front surface of the solar cell. The back insulating layer or the front encapsulant layer has a concave opening that complements the solar cell profile. When the back-contact solar cell is received in the concave opening, the electrical contacts on the back side of the solar cell align with the openings of the back insulating layer and with the electrically conductive metal circuit. A process for forming the described assembly is also provided.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 5, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Zelin Liu, Minfang Mu, Ke Yu, Philip L. Boydell