Abstract: This application discloses a multi-link communication probe request method and apparatus. The method includes: a non-access point multi-link device (non-AP MLD) generates a probe request frame, and sends the probe request frame to an access point multi-link device (AP MLD), and the AP MLD receives the probe request frame, and generates a probe response frame and sends to the non-AP MLD. The probe request frame includes a first multi-link element (MLE) that is used to request link information of the AP MLD and that includes a first link information field. The first link information field includes a first field. The first field indicates that the non-AP MLD requests the AP MLD to feed back complete information or partial information of a first link. The first link information field corresponds to the first link.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: The invention discloses a glass carrier having a protection structure, comprising a glass body and a protection layer. The glass body has a top surface, a bottom surface, and a lateral surface. The protection layer covers the lateral surface of the glass body. The protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body. The invention further discloses a manufacturing method of a glass carrier having a protection structure, comprising the following steps: covering the protection layer around the lateral surface of the glass body, wherein the protection layer is the hard material with the stiffness coefficient higher than the stiffness coefficient of the glass body.

Abstract: A monitoring method and a monitoring system for a machine tool to machine a workpiece are provided. The monitoring method includes the following steps. First, a vibration signal of a spindle of the machine tool is detected. Next, a vibration feature value of the vibration signal is obtained. Whether the vibration feature value exceeds a threshold condition is determined, wherein the threshold condition is determined by a training model based on a predetermined surface quality of the workpiece. When the vibration feature value exceeds the threshold condition, a machining parameter of the machine tool is adjusted.

Abstract: A package includes a first die, a second die, and an encapsulant. The first die includes a first capacitor. The second die includes a second capacitor. The second die is stacked on the first die. The first capacitor is spatially separated from the second capacitor. The first capacitor is electrically connected to the second capacitor. The encapsulant laterally encapsulates the second die.

Abstract: There are provided systems and methods for a multi-layer cache to prevent user experience interrupts during feature flag management. A service provider may provide applications to computing devices of users including mobile applications. Use and availability of features in an application may be configured using feature flags, however, change of these feature flags may initiate an application refresh that affects user experiences with the application. To prevent interruptions, a multi-layer data cache may be used where feature flag data for the feature flags may initially be loaded, after a time period, to a first layer cache that is not used to update the application. When conditions exist for updating the application without affecting the user experience, such as if the user is no longer using a workflow, the feature flag data may be loaded to a second layer cache. The second layer cache may then be used for updating.

Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

Abstract: SRAM designs based on GAA transistors are disclosed that provide flexibility for increasing channel widths of transistors at scaled IC technology nodes and relax limits on SRAM performance optimization imposed by FinFET-based SRAMs. GAA-based SRAM cells described have active region layouts with active regions shared by pull-down GAA transistors and pass-gate GAA transistors. A width of shared active regions that correspond with the pull-down GAA transistors are enlarged with respect to widths of the shared active regions that correspond with the pass-gate GAA transistors. A ratio of the widths is tuned to obtain ratios of pull-down transistor effective channel width to pass-gate effective channel width greater than 1, increase an on-current of pull-down GAA transistors relative to an on-current of pass-gate GAA transistors, decrease a threshold voltage of pull-down GAA transistors relative to a threshold voltage of pass-gate GAA transistors, and/or increases a ? ratio of an SRAM cell.

Abstract: A semiconductor device with multiple silicide regions is provided. In embodiments a first silicide precursor and a second silicide precursor are deposited on a source/drain region. A first silicide with a first phase is formed, and the second silicide precursor is insoluble within the first phase of the first silicide. The first phase of the first silicide is modified to a second phase of the first silicide, and the second silicide precursor being soluble within the second phase of the first silicide. A second silicide is formed with the second silicide precursor and the second phase of the first silicide.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate. A first conductive feature is over the substrate. A second conductive feature is over the substrate and is adjacent to the first conductive feature. The first and second conductive features are separated by a cavity. A dielectric liner extends from the first conductive feature to the second conductive feature along a bottom of the cavity and further extends along opposing sidewalls of the first and second conductive features. A dielectric cap covers and seals the cavity. The dielectric cap has a top surface that is approximately planar with top surfaces of the first and second conductive features. The first conductive feature and the second conductive feature comprise graphene intercalated with one or more metals.

Abstract: Various systems and methods of initiating and performing contextualized AI inferencing, are described herein. In an example, operations performed with a gateway computing device to invoke an inferencing model include receiving and processing a request for an inferencing operation, selecting an implementation of the inferencing model on a remote service based on a model specification and contextual data from the edge device, and executing the selected implementation of the inferencing model, such that results from the inferencing model are provided back to the edge device. Also in an example, operations performed with an edge computing device to request an inferencing model include collecting contextual data, generating an inferencing request, transmitting the inference request to a gateway device, and receiving and processing the results of execution. Further techniques for implementing a registration of the inference model, and invoking particular variants of an inference model, are also described.

Abstract: A radio physical layer protocol data unit (PPDU) sending method includes: obtaining, a radio physical layer protocol data unit (PPDU), wherein the PPDU includes a high efficiency-signal field A (HE-SIG-A) and a high efficiency-signal field B (HE-SIG-B), the HE-SIG-A includes a field indicating a quantity of orthogonal frequency division multiplexing (OFDM) symbols in the HE-SIG-B, and wherein a value of the field indicates one of the following: that the quantity of OFDM symbols included in the HE-SIG-B is greater than or equal to 16, or the quantity of OFDM symbols included in the HE-SIG-B; and sending the PPDU.

Abstract: A thermostatic radiator valve supports a display that is configurable to display TRV information for a desired viewing direction to facilitate reading by a user, where the TRV comprises a configurable electronic display, a configuration circuit, and a processing device. The configuration circuit is capable of detecting when the TRV has been installed, determining a desired display orientation from a plurality of orientations with respect to a designated surface via a sensor in response to the detecting, and generating a display indicator indicative of the desired display orientation. The processing device is capable of receiving the display indicator and configuring the configurable electronic display to display the TRV information in the desired display orientation.

Abstract: Embodiments of this application disclose a method for determining a data buffer status, and an apparatus. The method includes: A first MLD receives first indication information from a second MLD, and determines, based on the first indication information and a correspondence between an association identifier of the first MLD and a data type supported by the first MLD, a buffer status of bufferable data that corresponds to the at least one data type and that is in the second MLD, where the first indication information is used to indicate the buffer status of the bufferable data. According to the embodiments of this application, a data buffer status in a data type dimension can be determined. The embodiments of this application may be applied to a wireless local area network system that supports a next-generation Wi-Fi EHT protocol of the IEEE 802.11, that is, the 802.11 protocol such as 802.11be.

Abstract: A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.

Abstract: An integrated circuit includes an array of word lines, and an array of memory cells configured to receive selection signals from the array of word lines. Each memory cell in the array of memory cells is connected to one or more data lines in a set of data lines. The integrated circuit also includes a read-write driver which is connected to the set of data lines and is configured to receive a flip-refresh control signal. The read-write driver has a catch circuit configured to store a first bit value related to a stored bit value in a selected memory cell. The read-write driver is configured to store into the selected memory cell a second bit value which is a bit inversion of the stored bit value.

Abstract: A preform for making a casing structure for turbine engines. The preform includes a plurality of reinforcing fiber tows arranged in a two-dimensional weave structure, a three-dimensional weave structure, or a braided structure. The plurality of reinforcing fiber tows include integrally woven or braided fiber tows having a diameter or a density greater than a respective diameter or density of other woven or braided fiber tows in the two-dimensional weave structure, the three-dimensional weave structure, or the braided structure. The integrally woven or braided fiber tows are located in an area of the preform that is bent to form an angled corner to thereby provide strength to a casing structure comprising the angled corner.

Abstract: A system and method for connecting semiconductor dies is provided. An embodiment comprises connecting a first semiconductor die with a first width to a second semiconductor die with a larger second width and that is still connected to a semiconductor wafer. The first semiconductor die is encapsulated after it is connected, and the encapsulant and first semiconductor die are thinned to expose a through substrate via within the first semiconductor die. The second semiconductor die is singulated from the semiconductor wafer, and the combined first semiconductor die and second semiconductor die are then connected to another substrate.

Abstract: A reference signaling scheme is provided that is based on the use of a Zadoff Chu sequence with cyclic repetition, optionally code division multiplexing precoding, together with frequency domain spectral shaping (FDSS). A specific pulse shape design for the FDSS part of the reference signal scheme in some embodiments involves the use of a raised cosine pulse raised to the power of ?. The new solution for generating reference signals has a Low peak average power ratio that matches the PAPR of SC-OQAM, good channel estimation performance, and the ability to implement CDM in the frequency domain to increase multiplexing gain.