Abstract: An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.

Abstract: An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.

Abstract: Apparatuses and methods for wide clock frequency range command paths are disclosed. An example apparatus includes a command decoder and a command timing circuit. The command decoder is configured to receive a command and is further configured to decode the command to provide a decoded command. The command timing circuit is configured to receive the decoded command responsive to a clock and is further configured to provide a delayed internal command having a delay relative to receiving the decoded command based on clock frequency information indicative of a clock frequency of the clock. The command timing circuit includes a plurality of command timing paths. Each of the plurality of command timing paths is configured to provide a respective delay to the decoded command for a respective range of clock frequencies.

Abstract: Apparatuses and methods for wide clock frequency range command paths are disclosed. An example apparatus includes a command decoder and a command timing circuit. The command decoder is configured to receive a command and is further configured to decode the command to provide a decoded command. The command timing circuit is configured to receive the decoded command responsive to a clock and is further configured to provide a delayed internal command having a delay relative to receiving the decoded command based on clock frequency information indicative of a clock frequency of the clock. The command timing circuit includes a plurality of command timing paths. Each of the plurality of command timing paths is configured to provide a respective delay to the decoded command for a respective range of clock frequencies.

Abstract: An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.

Abstract: An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.

Abstract: Systems and methods include capture circuitry configured to capture a write signal from a host device using a data strobe signal from the host device and to output one or more indications of capture of the write signal. Calculation circuitry is configured to receive the data strobe signal, receive the one or more indications of capture, and determine a delay between a first edge of the data strobe signal and receipt of the one or more indications of capture. The systems and methods also include transmission and control circuitry configured to launch subsequent write signals at a time based at least in part on the delay.

Abstract: An apparatus, such as a memory device, that includes circuits and techniques to synchronize various internal signals with an internal clock signal to ensure proper functionality of the memory device. A walk back circuit is provided to mimic propagation delays of an internal command signal, such as a write command signal, and to speed up the delayed internal command signal an amount equivalent to the propagation delays. The walk back circuit includes a mixture of delay elements provided to mimic propagation delays caused by both gate delays and routing delays.

Abstract: An apparatus, such as a memory device, that includes circuits and techniques to synchronize various internal signals with an internal clock signal to ensure proper functionality of the memory device. A walk back circuit is provided to mimic propagation delays of an internal command signal, such as a write command signal, and to speed up the delayed internal command signal an amount equivalent to the propagation delays. The walk back circuit includes a mixture of delay elements provided to mimic propagation delays caused by both gate delays and routing delays.

Abstract: Systems and methods include capture circuitry configured to capture a write signal from a host device using a data strobe signal from the host device and to output one or more indications of capture of the write signal. Calculation circuitry is configured to receive the data strobe signal, receive the one or more indications of capture, and determine a delay between a first edge of the data strobe signal and receipt of the one or more indications of capture. The systems and methods also include transmission and control circuitry configured to launch subsequent write signals at a time based at least in part on the delay.

Abstract: Systems and methods include capture circuitry configured to capture a write signal from a host device using a data strobe signal from the host device and to output one or more indications of capture of the write signal. Calculation circuitry is configured to receive the data strobe signal, receive the one or more indications of capture, and determine a delay between a first edge of the data strobe signal and receipt of the one or more indications of capture. The systems and methods also include transmission and control circuitry configured to launch subsequent write signals at a time based at least in part on the delay.

Abstract: An apparatus, such as a memory device, that includes circuits and techniques to synchronize various internal signals with an internal clock signal to ensure proper functionality of the memory device. A walk back circuit is provided to mimic propagation delays of an internal command signal, such as a write command signal, and to speed up the delayed internal command signal an amount equivalent to the propagation delays. The walk back circuit includes a mixture of delay elements provided to mimic propagation delays caused by both gate delays and routing delays.

Abstract: A method for storing a temperature threshold in an integrated circuit includes measuring operating parameters of the integrated circuit versus temperature, calculating a maximum temperature at which the integrated circuit performance exceeds predetermined specifications and storing parameters corresponding to the maximum temperature in a comparison circuit in the integrated circuit by selectively blowing fusable devices in the comparison circuit. The fusable devices may be antifuses.

Abstract: A method for storing a temperature threshold in an integrated circuit includes measuring operating parameters of the integrated circuit versus temperature, calculating a maximum temperature at which the integrated circuit performance exceeds predetermined specifications and storing parameters corresponding to the maximum temperature in a comparison circuit in the integrated circuit by selectively blowing fusable devices in the comparison circuit. The fusable devices may be antifuses.

Abstract: A method for storing a temperature threshold in an integrated circuit includes measuring operating parameters of the integrated circuit versus temperature, calculating a maximum temperature at which the integrated circuit performance exceeds predetermined specifications and storing parameters corresponding to the maximum temperature in a comparison circuit in the integrated circuit by selectively blowing fusable devices in the comparison circuit. The fusable devices may be antifuses. As a result, the integrated circuit is able to provide signals to devices external to the integrated circuit to indicate that the integrated circuit may be too hot to operate properly.

Abstract: A method for storing a temperature threshold in an integrated circuit includes measuring operating parameters of the integrated circuit versus temperature, calculating a maximum temperature at which the integrated circuit performance exceeds predetermined specifications and storing parameters corresponding to the maximum temperature in a comparison circuit in the integrated circuit by selectively blowing fusable devices in the comparison circuit. The fusable devices may be antifuses. As a result, the integrated circuit is able to provide signals to devices external to the integrated circuit to indicate that the integrated circuit may be too hot to operate properly.

Abstract: A method for storing a temperature threshold in an integrated circuit includes measuring operating parameters of the integrated circuit versus temperature, calculating a maximum temperature at which the integrated circuit performance exceeds predetermined specifications and storing parameters corresponding to the maximum temperature in a comparison circuit in the integrated circuit by selectively blowing fusable devices in the comparison circuit. The fusable devices may be antifuses. As a result, the integrated circuit is able to provide signals to devices external to the integrated circuit to indicate that the integrated circuit may be too hot to operate properly.

Abstract: A supply-voltage detecting stage (11) that supplies first and second reference currents (I.sub.REFP and I.sub.REFN) which vary with the supply voltage (V.sub.cc) and are coupled by first and second gain stages (12A and 12B), respectively, to first and second temperature-detecting stages (13A and 13B), respectively. First and second temperature-detecting stages (13A and 13B) increase the coupled reference currents (I.sub.REFP and I.sub.REFN), respectively, to compensate for temperature increase through use temperature-sensitive, long-channel transistors (M34-M37 and M42-M45), supplying temperature and supply-voltage compensated output bias voltages at output terminals (MIRN and MIRP).