Patents by Inventor Ming Chan

Ming Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141333
    Abstract: Particular forward and reverse primers may be used to link distant regions of the same large DNA molecule into a smaller DNA molecule. A reverse primer R1 can have a first portion complementary to an ending sequence of region A and can have a second portion having an overlapping sequence. A forward primer F2 can have a first portion complementary to a starting sequence of region B, where the forward primer includes a complementary overlapping sequence (e.g., the same first portion or a second portion) that is complementary to the overlapping sequence. The first portion of F2 may be the entire primer. The smaller DNA molecules can be used to determine haplotypes of regions. Kits including the particular forward and reverse primers are also described.
    Type: Application
    Filed: June 22, 2023
    Publication date: May 2, 2024
    Inventors: Kwan Chee Chan, Wanxia Gai, Yuk-Ming Dennis Lo
  • Publication number: 20240145421
    Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
  • Publication number: 20240145494
    Abstract: An image sensor structure including a substrate, a first pixel structure, a second pixel structure, a dielectric layer, and a conductive layer stack is provided. The first pixel structure includes a first light sensing device. The second pixel structure includes a second light sensing device. The conductive layer stack includes conductive layers. The conductive layer stack has a first opening and a second opening. The first opening is located directly above the first light sensing device and passes through the conductive layers. The second opening is located directly above the second light sensing device and passes through the conductive layers. The second minimum width of the second opening is smaller than the first minimum width of the first opening. The luminous flux of the second pixel structure is different from the luminous flux of the first pixel structure.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 2, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Ju-Sheng Lu, Yi-Ting Wang, Ming-Chan Liu
  • Patent number: 11970742
    Abstract: Methods are provided for diagnosing pregnancy-associated disorders, determining allelic ratios, determining maternal or fetal contributions to circulating transcripts, and/or identifying maternal or fetal markers using a sample from a pregnant female subject. Also provided is use of a gene for diagnosing a pregnancy-associated disorder in a pregnant female subject.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: April 30, 2024
    Assignee: The Chinese University of Hong Kong
    Inventors: Yuk-Ming Dennis Lo, Rossa Wai Kwun Chiu, Kwan Chee Chan, Peiyong Jiang, Bo Yin Tsui
  • Patent number: 11963279
    Abstract: A wearable electronic device including: a first portion and a second portion. The first portion includes a first conductive area on a first inner surface of the first portion and a third conductive area on a first outer surface of the first portion. The second portion includes one or more second conductive areas on a second outer surface of the second portion and a fourth conductive area on a second inner surface of the second portion, wherein the first portion is connected to the second portion. A circuit unit is disposed in a second space of the second portion, wherein the circuit unit is configured to enable an input/output unit of the circuit unit in response to the first conductive area and the second conductive areas are triggered.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: April 16, 2024
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Ming Leung Vincent Tse, Anson Chan, Yuelin Wang, Chun Zhang
  • Patent number: 11955507
    Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: April 9, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Hsin-Hung Li, Wei-Syun Wang, Chih-Chiang Chen, Yu-Cheng Shih, Cheng-Chan Wang, Chia-Hsin Chung, Ming-Jui Wang, Sheng-Ming Huang
  • Publication number: 20240102799
    Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
  • Patent number: 11943060
    Abstract: Methods and systems for managing an error correction mode at a first communications router. The first communication router transmits data packets to a second communications router and stores the first data packet in a local storage medium. When a delay inquiry message is received from the second communications router, the first communications router activates the error correction mode. When the error correction mode is activated, the first data packet is retransmitted to the second communications router and an error correction packet corresponding to the first data packet is also transmitted. When a back-to-normal message is received from the second communications router, the first communications router deactivates the error correction mode. The back-to-normal message indicates that the first communications router no longer needs to be in error correction mode.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: March 26, 2024
    Assignee: Pismo Labs Technology Limited
    Inventors: Patrick Ho Wai Sung, Kam Chiu Ng, Ho Ming Chan
  • Patent number: 11942543
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
  • Publication number: 20240097436
    Abstract: An electronic device and a method for protecting an equipment from voltage surge damage are provided. The method includes: electrically connecting an input terminal of a one-way pass circuit to a first equipment and electrically connecting an output terminal of the one-way pass circuit to a second equipment; electrically connecting an over-voltage check circuit to the output terminal and a regenerative resistor circuit, wherein the regenerative resistor circuit includes a resistor; detecting, by the over-voltage check circuit, a voltage of the output terminal; and electrically, by the over-voltage check circuit, connecting the output terminal to the resistor in response to the voltage being greater than a voltage threshold.
    Type: Application
    Filed: February 2, 2023
    Publication date: March 21, 2024
    Applicant: Bamboo Dynamics Corporation., Ltd.
    Inventors: Yuan Chen Chan, Chi-Ming Chuang
  • Patent number: 11923046
    Abstract: Disclosed herein are methods, systems, and apparatus for detecting microamplifications or microdeletions in the genome of a fetus. In some embodiments, the method comprises receiving sequence tags for each of a plurality of DNA fragments in a biological sample; determining genomic positions for the sequence tags; determining whether the density of DNA in each of a plurality of genomic regions is aberrantly high or low; identifying as a microamplification a set of consecutive genomic regions having aberrantly high density; and identifying as a microdeletion a set of consecutive genomic regions having aberrantly low density. The biological sample may be a blood sample obtained noninvasively from a female subject pregnant with the fetus.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: March 5, 2024
    Assignee: The Chinese University of Hong Kong
    Inventors: Yuk Ming Dennis Lo, Kwan Chee Chan, Peiyong Jiang, Cheuk Yin Jandy Yu, Rossa Wai Kwun Chiu
  • Publication number: 20240071407
    Abstract: Techniques for detecting certain acoustic events from audio data are described. A system may perform event aggregation for certain types of events before sending an output to a device representing the event is detected. The system may bypass the event aggregation process for certain types of events that the system may detect with a high level of confidence. In such cases, the system may send an output to the device when the event is detected. The system may be used to detect acoustic events representing presence of a person or other harmful circumstances (such as, fire, smoke, etc.) in a home, an office, a store, or other types of indoor settings.
    Type: Application
    Filed: September 8, 2023
    Publication date: February 29, 2024
    Inventors: Harshavardhan Sundar, Sheetal Laad, Jialiang Bao, Ming Sun, Chao Wang, Chungnam Chan, Cengiz Erbas, Mathias Jourdain, Nipul Bharani, Aaron David Wirshba
  • Patent number: 11799686
    Abstract: The present invention discloses methods and systems for sending information packets from a first network node to a second network node. An aggregated tunnel is established between the first network node and the second network node. An information packet is determined whether to be sent according to profile condition(s) of the aggregated tunnel and then according to a selected policy. When a selected policy is selected and the information packet is sent through a tunnel according to the selected policy. When no policy is selected, the information packet is sent through one of a first group of tunnels. When no profile is selected, the information packet is sent through a network interface of the first network node.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: October 24, 2023
    Assignee: Pismo Labs Technology Limited
    Inventors: Patrick Ho Wai Sung, Kam Chiu Ng, Wan Chun Leung, Ho Ming Chan
  • Publication number: 20230327815
    Abstract: The present invention discloses methods and systems for managing an error correction mode at a first communications router. The first communication router transmits data packets to a second communications router and stores the first data packet in a local storage medium. When a delay inquiry message is received from the second communications router, the first communications router activates the error correction mode. When the error correction mode is activated, the first data packet is retransmitted to the second communications router and an error correction packet corresponding to the first data packet is also transmitted. When a back-to-normal message is received from the second communications router, the first communications router deactivates the error correction mode. The back-to-normal message indicates that the first communications router no longer needs to be in error correction mode.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 12, 2023
    Applicant: Pismo Labs Technology Limited
    Inventors: Patrick Ho Wai Sung, Kam Chiu Ng, Ho Ming Chan
  • Publication number: 20230325434
    Abstract: A visual content search and retrieval platform comprising an object detection model, a coarse-grained image classification model, and a selection of fine-grained image classification models. During inference, the object detection model locates and extracts a query object in a query image; the coarse-grained image classification model classifies the query object's meta-category; the fine-grained image classification model trained and optimized for the meta-category of the query object is selected; and the selected fine-grained image classification model searches and retrieves from an image database images of objects most similar to the query object.
    Type: Application
    Filed: February 22, 2023
    Publication date: October 12, 2023
    Inventors: Chun Ming CHAN, Zheng Long LI, Yi Ping TSE, Sung Ho CHEUNG
  • Publication number: 20230278736
    Abstract: Systems and processes for packing complementary articles of footwear into a container are disclosed. The processes can include utilizing a reusable packing sheet positioned underneath complementary articles of footwear to transfer the complementary articles of footwear into a container. The processes can also include removing the reusable packing sheet from underneath the complementary articles of footwear while the complementary articles of footwear remain positioned in the container. Additional processes can include aligning and sizing complementary articles of footwear for packing in a container.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Inventors: Pu-Yuan Chang, Chin-Ming Chan, San-Bei Huang, Tsung-Sheng Huang, Kuo-Hung Lee
  • Patent number: 11702265
    Abstract: A packaging structure is used for carrying at least one carried object. The packaging structure includes a carrying unit and a covering member. The carrying unit includes a supporting plate, at least one first side plate connected to the edge of the supporting plate, and at least one combing member. The supporting plate has two opposite surfaces, and the first side plate is able to bend to one of the surfaces of the supporting plate, so that the carrying unit can be folded or unfolded. The first side plate is stacked on the supporting plate when the carrying unit is in the folded state, and the combing member keeps the first side plate stacked on the supporting plate. The covering member positions the carried object on the carrying unit. A delivering device is provided for clamping and positioning a plurality of the packaging structures in an upright manner.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: July 18, 2023
    Assignee: RADIANT OPTO-ELECTRONICS CORPORATION
    Inventors: Fang-Chun Liu, Hung-Lin Chou, Chao-Hsu Chen, Wei-Ju Chen, Shu-Juan Song, Ren-Zhu Cao, Tian-Yu Zhao, Chih-Ming Chan
  • Patent number: 11697516
    Abstract: Systems and processes for packing complementary articles of footwear into a container are disclosed. The processes can include utilizing a reusable packing sheet positioned underneath complementary articles of footwear to transfer the complementary articles of footwear into a container. The processes can also include removing the reusable packing sheet from underneath the complementary articles of footwear while the complementary articles of footwear remain positioned in the container. Additional processes can include aligning and sizing complementary articles of footwear for packing in a container.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: July 11, 2023
    Assignee: NIKE, Inc.
    Inventors: Pu-Yuan Chang, Chin-Ming Chan, San-Bei Huang, Tsung-Sheng Huang, Kuo-Hung Lee
  • Patent number: 11696131
    Abstract: Methods and apparatus for processing data packets originated from a mobile computing device to destinations at a wireless network node. The wireless network node receives an access request from the mobile computing device for the data packet transmission to the destinations and determines an identifier of the mobile computing device. The wireless network node then determines whether the identifier is in a wireless network node database. When the identifier is not in the wireless network node database, the wireless network node suspends to process data packets received from the mobile computing device and communicates with a server to determine whether status of the mobile computing device in a server database is the first state.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: July 4, 2023
    Assignee: Pismo Labs Technology Limited
    Inventors: Ho Ming Chan, Ka Kei Liu
  • Patent number: 11686690
    Abstract: A method of inspection or metrology of four sides of a sample is disclosed. The method includes providing samples in a carrier at a first side of an imaging tool and moving the samples from the carrier to the imaging tool via a pick-and-place stage assembly. The method includes imaging first and second sides of the samples via first and second channels of the imaging tool and returning the samples to the carrier. The method includes rotating the carrier by 90 degrees and translating the carrier to an opposite side of the imaging tool and moving the samples individually from the carrier to the imaging tool. The method includes imaging a third and fourth side of the sample via the first and second channel of the imaging tool and returning the one or more samples from the imaging tool to the carrier.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: June 27, 2023
    Assignee: KLA Corporation
    Inventors: Bert Vangilbergen, Harry Paredaens, Maarten Brocatus, Foon Ming Chan