Abstract: A deep trench capacitor structure may include a metal-insulator-metal structure having an insulator layer between opposing conductive electrode layers. The deep trench capacitor structure may extend through a plurality of dielectric layers in a semiconductor device. The conductive electrode layers and the insulator layer may extend laterally into the dielectric layers. The lateral extensions of the conductive electrode layers and the insulator layer into the dielectric layers may be referred to as fin portions of the capacitor structure. The fin portions may extend laterally outward from a central portion (e.g., a trench portion) of the deep trench capacitor structure. The fin portions of the deep trench capacitor structure enable the surface area of the conductive electrode layers to be increased, which may increase the capacitance of the deep trench capacitor structure with minimal increase to the overall footprint of the deep trench capacitor structure.

Abstract: A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules.

Abstract: A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.

Abstract: A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.

Abstract: A circuit structure applied to a driver of an electronic device and for switching power supply units between series-connected and parallel-connected configurations includes an electricity output portion having a first end and a second end, two power supply units, and a switch unit. Each power supply unit includes an electricity element having a positive electrode and a negative electrode, a front diode having an anode connected to the positive electrode and a cathode electrically connected to the first end, and a rear diode having a cathode connected to the negative electrode and an anode electrically connected to the second end. The switch unit has a first end and a second end respectively connected to the positive electrode of one electricity element and the negative electrode of the other electricity element, and a closed-circuit state and an open-circuit state when the electricity elements are respectively series-connected or parallel-connected to output electricity.

Abstract: A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules.

Abstract: A real time multiple simulated targets generator for mono pulse radar, applied to a simulation control system of a radar system, having at least one signal processor, in which a real time multiple targets generator is built inside. The real time multiple target generator has a precision timing generator to generate a timing signal. Several PRN code generators receive the timing signal to generate the psendo random code. Several DMWG's which are connected to the PTG and the PRN code generators to generate the modulated waveforms. The extent target generators are coupled to the corresponding DMWG's to receive the modulated waveform signals and generate simulated target signals.

Abstract: A circuit for regulating output power varies the output power based on the time that a connection to an AC power source is open. A microprocessor determines the open-circuit time of the input power source and varies a power source signal in response to the open-circuit time. The power source signal is, in turn, supplied to a trigger circuit that supplies power to a load to control the output power.