Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A case of an extending base for an electronic device includes a body, a cover, and at least two link elements. The body has a hollow. The cover is disposed aside the hollow. Each link element has a first pivot part, a first block part, a second pivot part, and a first elastic member. The first pivot part has a first end pivoted on the body and a second end connected to the first block part. The second pivot part has a first end pivoted on the cover and a second end connected to the first block part. The first elastic member provides a force to push the first block part from a first position to a second position so as to correspondingly push the cover. Herein, when the first block part is positioned at the first position, the first block part is separated from the body and the cover covers the body. In addition, when the first block part is positioned at the second position, the first block part is in contact with the body and the cover is separated from the body.

Abstract: A case of an extending base for an electronic device includes a body, a cover, and at least two link elements. The body has a hollow. The cover is disposed aside the hollow. Each link element has a first pivot part, a first block part, a second pivot part, and a first elastic member. The first pivot part has a first end pivoted on the body and a second end connected to the first block part. The second pivot part has a first end pivoted on the cover and a second end connected to the first block part. The first elastic member provides a force to push the first block part from a first position to a second position so as to correspondingly push the cover. Herein, when the first block part is positioned at the first position, the first block part is separated from the body and the cover covers the body. In addition, when the first block part is positioned at the second position, the first block part is in contact with the body and the cover is separated from the body.

Abstract: A notebook computer expansion base with a slidable cover structure is provided, which is applicable for the expansion of various types of notebook computers. Each notebook computer has an expansion joint and a plug specification, and the expansion base includes a base and a slidable cover. The base has an expansion component and an expansion slot electrically connected to each other, and the expansion slot is connected with the expansion joint directly, such that the expansion component is electrically connected with the notebook computer, so as to expand the expansion component to the notebook computer. The slidable cover is disposed on the base and being sildable, corresponding to a plugging reference, and the distance between the slidable cover and the expansion slot is adjusted through sliding the slidable cover, so as to be applicable for different plug specifications.