Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.

Abstract: In an embodiment, a device includes: an integrated circuit die; a through via adjacent the integrated circuit die; a molding compound encapsulating the integrated circuit die and the through via; and a redistribution structure including: a first conductive via extending through a first dielectric layer, the first conductive via electrically connected to the integrated circuit die, the first dielectric layer being over the integrated circuit die, the through via, and the molding compound; and a first conductive line over the first dielectric layer and the first conductive via, the first conductive via extending into the first conductive line.

Abstract: A semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. The terminal is disposed on and electrically coupled to the redistribution circuit structure, where the redistribution circuit structure is disposed between the semiconductor die and the terminal, and the terminal includes an under-bump metallization (UBM) and a capping layer. The UBM is disposed on and electrically coupled to the redistribution circuit structure, where the UBM includes a recess. The capping layer is disposed on and electrically coupled to the UBM, where the UBM is between the capping layer and the redistribution circuit structure, and the capping layer fills the recess of the UBM.

Abstract: A molding die structure for forming oblique teeth on a rivet nut includes a mold seat, a first forging die, a second forging die, and a retaining member. The mold seat is provided with a mold cavity and a threaded portion. The first forging die is inserted into the mold cavity and provided with a die cavity and a nut cavity. The second forging die is inserted into the die cavity and has an inner face provided with an oblique toothed portion and a guide hole. The oblique toothed portion includes a plurality of oblique teeth. The retaining member is screwed into the threaded portion and limits the first forging die and the second forging die in the mold cavity. The second forging die and the die cavity of the first forging die form a low friction contact.

Abstract: A transmission mechanism with monitoring function includes a shaft, a moving part, a circulating device, a plurality of rollers and a monitoring module. The shaft has a roller groove. The moving part is movably disposed on the shaft. The moving part has a roller slot corresponding to the roller groove. The roller slot has an effective thread section and an ineffective thread section. The effective thread section and the roller groove together form a load path. The circulating device is disposed on the moving part. The circulating device has a return channel communicated with the load path. The return channel and the load path together form a circulating path. The plurality of rollers are disposed in the circulating path. The monitoring module includes a gathering body and a sensor. The sensor is for detecting a metal content of the lubricant in the gathering channel.

Abstract: A molding die structure for forming oblique teeth on a rivet nut includes a mold seat, a first forging die, a second forging die, and a retaining member. The mold seat is provided with a mold cavity and a threaded portion. The first forging die is inserted into the mold cavity and provided with a die cavity and a nut cavity. The second forging die is inserted into the die cavity and has an inner face provided with an oblique toothed portion and a guide hole. The oblique toothed portion includes a plurality of oblique teeth. The retaining member is screwed into the threaded portion and limits the first forging die and the second forging die in the mold cavity. The second forging die and the die cavity of the first forging die form a low friction contact.

Abstract: A transmission mechanism with monitoring function includes a shaft, a moving part, a circulating device, a plurality of rollers and a monitoring module. The shaft has a roller groove. The moving part is movably disposed on the shaft. The moving part has a roller slot corresponding to the roller groove. The roller slot has an effective thread section and an ineffective thread section. The effective thread section and the roller groove together form a load path. The circulating device is disposed on the moving part. The circulating device has a return channel communicated with the load path. The return channel and the load path together form a circulating path. The plurality of rollers are disposed in the circulating path. The monitoring module includes a gathering body and a sensor. The sensor is for detecting a metal content of the lubricant in the gathering channel.

Abstract: A ball screw with maintenance device includes a screw shaft including a helical rolling groove; a nut having an outer circumferential surface in which at least two mounting holes is formed; two recirculation elements, which are mounted to the nut and each having a through hole having an open end set in a spacing distance from the rolling groove; a fixing cover mounted to the outer circumferential surface of the nut and includes a concentration trough formed therein. The through hole has an end communicating with the concentration trough. The concentration trough is connectable to a suction tube or an oil/grease supply tube. The suction tube can remove contamination from the interior of the nut through the through hole, and the part that has been cleaned up with the suction tube can be replenished with fresh oil/grease with the oil/great supply tube to achieve complete maintenance of the ball screw.

Abstract: A circulating element for ball screw includes a first surface defining a circulating passage that extends from one lateral side of the first surface to the other lateral side of the first surface and has a coupling mouth located on each of the two opposite ends thereof, and a second surface defining a coupling groove between the two coupling mouths of the circulating passage and two guide blocks respectively protruding out of the coupling mouths of the circulating passage. Thus, the circulating element has the advantages of low processing cost, ease of installation, high alignment accuracy, and excellent running smoothness.

Abstract: A circulating element for ball screw includes a first surface defining a circulating passage that extends from one lateral side of the first surface to the other lateral side of the first surface and has a coupling mouth located on each of the two opposite ends thereof, and a second surface defining a coupling groove between the two coupling mouths of the circulating passage and two guide blocks respectively protruding out of the coupling mouths of the circulating passage. Thus, the circulating element has the advantages of low processing cost, ease of installation, high alignment accuracy, and excellent running smoothness.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A reading optical lens module, along an optical axis, comprising: two lens elements of meniscus shape, an aperture stop and an image sensor, wherein the first lens element with its convex surface on the object side having bi-aspherical surfaces and the second lens element with its convex surface on the image side having bi-aspherical surfaces, the aperture stop aligning between the first element and the second lens element and the image sensor disposing on the image plane for converting the objective image to electrical signal. Additionally, the reading optical lens module satisfies conditions related to reduction of total length, expansion of field of view angle and increase of resolution for use in the compact bar-code reader machine.

Abstract: A rain sensor mounted on a windshield of a vehicle comprises: a housing having an opening, at least an emitter disposed in the housing and used for emitting light beams, a coupler, and an optical detector. The coupler connecting and covering the opening of the housing, comprises: at least a collimator receiving and collimating the light beams into collimated light beams; and at least a groove having a deflection surface to reflect the collimated light beams that passes through the collimator and is incident to the deflection surface at an incident angle ? to the windshield. The optical detector disposed in the housing is used for receiving the collimated light beams reflected by the windshield and generating electrical signals. The present invention characterized in that the incident angle ? satisfies the following condition: 1.27<n*sin ?<1.52, wherein n is refractive index of the coupler.

Abstract: An miniature three-piece optical imaging lens with short back focal length, along an optical axis from the object side to the image side including: a first lens of positive refractive power that is a meniscus aspherical lens having a convex surface on the object side, an aperture stop, a second lens of negative refractive power that is a meniscus aspherical lens having a convex surface on the image side, a third lens of negative refractive power that is an aspherical lens whose center is on the optical axis, while on the lens center the convex surface is on the object side and the concave surface is on the image side. Moreover, from the center of the third lens element toward the edge, the refractive power changes from negative power, through an inflection point, to positive power. Furthermore, the optical imaging lens further satisfies conditions: 0.25 ? bf TL ? 0.4 wherein bf is back focal length, TL is total distance on the optical axis from the object side of the first lens to the image plane.

Abstract: An aspherical fiber coupling lens applied to a photoelectric coupling module is disclosed. The spherical fiber coupling lens is a bi-convex lens with positive refraction power and having a first optical surface and a second optical surface, both are aspherical surfaces while optical features of the lens satisfy the following conditions: 0.5 < d 2 f < 1.5 ; 1.0 < R 1 - R 2 R 1 + R 2 < 2.0 ; 1.2 < ( 1 R 1 - 1 R 2 ) · f < 2.2 wherein f is the effective focal length of the lens, d2 is thickness of the lens on optical axis, Nd is refraction index of the lens, R1, R2 respectively are curvature radiuses of the first optical surface and the second optical surface of the lens. Thereby the lens has features of small focus, compact volume and high coupling efficiency so that applications of the photoelectric coupling module are improved.

Abstract: An aspherical fiber coupling lens applied to a photoelectric coupling module is disclosed. The spherical fiber coupling lens is a bi-convex lens with positive refraction power and having a first optical surface and a second optical surface, both are aspherical surfaces while optical features of the lens satisfy the following conditions: 0.5 < d 2 f < 1.5 ; 1.0 < R 1 - R 2 R 1 + R 2 < 2.0 ; 1.2 < ( 1 R 1 - 1 R 2 ) · f < 2.2 wherein f is the effective focal length of the lens, d2 is thickness of the lens on optical axis, Nd is refraction index of the lens, R1, R2 respectively are curvature radiuses of the first optical surface and the second optical surface of the lens. Thereby the lens has features of small focus, compact volume and high coupling efficiency so that applications of the photoelectric coupling module are improved.

Abstract: An miniature three-piece optical imaging lens with short back focal length, along an optical axis from the object side to the image side including: a first lens of positive refractive power that is a meniscus aspherical lens having a convex surface on the object side, an aperture stop, a second lens of negative refractive power that is a meniscus aspherical lens having a convex surface on the image side, a third lens of negative refractive power that is an aspherical lens whose center is on the optical axis, while on the lens center the convex surface is on the object side and the concave surface is on the image side. Moreover, from the center of the third lens element toward the edge, the refractive power changes from negative power, through an inflection point, to positive power. Furthermore, the optical imaging lens further satisfies conditions: 0.25 ? bf TL ? 0.4 wherein bf is back focal length, TL is total distance on the optical axis from the object side of the first lens to the image plane.