Patents by Inventor Ming-Che Tsai
Ming-Che Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961762Abstract: A method includes forming a first conductive feature, depositing a passivation layer on a sidewall and a top surface of the first conductive feature, etching the passivation layer to reveal the first conductive feature, and recessing a first top surface of the passivation layer to form a step. The step comprises a second top surface of the passivation layer. The method further includes forming a planarization layer on the passivation layer, and forming a second conductive feature extending into the passivation layer to contact the first conductive feature.Type: GrantFiled: June 30, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang
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Patent number: 11935804Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.Type: GrantFiled: April 10, 2023Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
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Publication number: 20240080505Abstract: A method, comprising: detecting an outage of at least one functionality in a live streaming; performing an first operation toward a second user terminal; storing data of the first operation in a database of the first user terminal; and displaying an effect corresponding to the first operation during the outage. The present disclosure may store the data of operation performed by the user terminal during outage and process the operation after the outage is recovered. Therefore, the streamers and viewers may feel interested and satisfied, instead of feeling anxious, and the user experience may be enhanced.Type: ApplicationFiled: June 23, 2023Publication date: March 7, 2024Inventors: Yung-Chi HSU, Hsing-Yu TSAI, Chia-Han CHANG, Yi-Jou LEE, Ming-Che CHENG
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Patent number: 11923455Abstract: A semiconductor device and method of forming the same are disclosed. The semiconductor device includes a fin structure, a gate electrode, a source-drain region, a plug and a hard mask structure. The gate electrode crosses over the fin structure. The source-drain region in the fin structure is aside the gate electrode. The plug is disposed over and electrically connected to the gate electrode. The hard mask structure surrounds the plug and is disposed over the gate electrode, wherein the hard mask structure includes a first hard mask layer and a second hard mask layer, the second hard mask layer covers a sidewall and a top surface of the first hard mask layer, and a material of the first hard mask layer is different from a material of the second hard mask layer.Type: GrantFiled: June 10, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Sheng Liang, Kuo-Hua Pan, Hsin-Che Chiang, Ming-Heng Tsai
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Publication number: 20230122849Abstract: The present invention relates to a method of treating moderate or severe symptoms of COVID-19 using a plant composition. The plant composition comprises Prepared Monkshood Daughter Root (Aconitum carmichaelii), Fragrant Solomonseal Rhizome (Polygonatum odoratum), Indian Bread (Poria cocos), Pinellia tuber (Pinellia ternata), Oriental Wormwood Herb (Artemisia scoparia), Scutellaria Root (Scutellaria baicalensis), Mongolian Snakegourd Fruit (Trichosanthes kirilowii), Magnolia Bark (Magnolia officinalis), Heartleaf Houttuynia Herb (Houttuynia cordata), and Baked Licorice Root and Rhizome (Glycyrrhiza glabra), which is used as a traditional Chinese medicine composition.Type: ApplicationFiled: October 19, 2022Publication date: April 20, 2023Inventors: YI-CHANG SU, WEN-HUI CHIOU, YUH-CHIANG SHEN, WEN-CHI WEI, KENG-CHANG TSAI, CHIA-CHING LIAO, YU-HWEI TSENG, CHUN-TANG CHIOU, YU-CHI LIN, LI-HSIANG WANG, CHIEN-HSIEN HUANG, CHIA-MO LIN, CHI-KUEI LIN, YI-CHIA HUANG, CHIEN-JUNG LIN, JUI-SHAN LIN, YA-SUNG YANG, CHUN-HSIANG CHIU, SHUN-PING CHENG, HSIEN-HWA KUO, WU-PU LIN, CHEN-SHIEN LIN, BO-CHENG LAI, YUAN-NIAN HSU, TSUNG-LUNG TSAI, WEI-CHEN HSU, TIENG-SIONG FONG, YI-WEN HUANG, CHIA-I TSAI, YA-CHEN YANG, MING-CHE TSAI, MING-HUEI CHENG, SHIH-WEI HUANG
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Patent number: 11616069Abstract: The present application discloses a semiconductor structure and a manufacturing method thereof. The semiconductor structure comprises a substrate, a gate dielectric layer, a floating gate, a first dielectric layer and a control gate. The gate dielectric layer is disposed on the substrate. The floating gate is disposed on the gate dielectric layer and has at least one tip on a top surface of the floating gate. The first dielectric layer is disposed on the floating gate. The control gate is disposed above the first dielectric layer and at least partially overlaps the floating gate.Type: GrantFiled: October 19, 2020Date of Patent: March 28, 2023Assignee: UNITED MICROELECTRONICS CORP.Inventors: Ping-Chia Shih, Kuei-Ya Chuang, Chuang-Hsin Chueh, Ming-Che Tsai, Wen-Lin Wang, Yi-Chun Teng, Ssu-Yin Liu, Wan-Chun Liao
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Patent number: 11374335Abstract: An antenna system includes a ground plane, a first nonconductive support element, a first antenna element, a second nonconductive support element, and a second antenna element. The first nonconductive support element is adjacent to the ground plane. The first antenna element is distributed over the first nonconductive support element. The first antenna element is excited by a first signal source. The second nonconductive support element is adjacent to the ground plane. The second antenna element is distributed over the second nonconductive support element. The second antenna element is excited by a second signal source. Both the first antenna element and the second antenna element can cover a wide operation frequency band of LTE/5G.Type: GrantFiled: November 10, 2020Date of Patent: June 28, 2022Assignee: QUANTA COMPUTER INC.Inventor: Ming-Che Tsai
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Publication number: 20220109250Abstract: An antenna system includes a ground plane, a first nonconductive support element, a first antenna element, a second nonconductive support element, and a second antenna element. The first nonconductive support element is adjacent to the ground plane. The first antenna element is distributed over the first nonconductive support element. The first antenna element is excited by a first signal source. The second nonconductive support element is adjacent to the ground plane. The second antenna element is distributed over the second nonconductive support element. The second antenna element is excited by a second signal source. Both the first antenna element and the second antenna element can cover a wide operation frequency band of LTE/5G.Type: ApplicationFiled: November 10, 2020Publication date: April 7, 2022Inventor: Ming-Che TSAI
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Patent number: 11282799Abstract: A device for generating a security key includes a substrate, semiconductor units, contact structures, and defects. The semiconductor units are disposed on the substrate. The contact structures are disposed on and connected with the semiconductor units. The defects are disposed in at least a part of the contact structures randomly. A manufacturing method of a device for generating a security key includes the following steps. First semiconductor units are formed on a substrate. First contact structures are formed on the first semiconductor units. The first contact structures are connected with the first semiconductor units, and defects are formed in at least a part of the first contact structures randomly.Type: GrantFiled: January 14, 2020Date of Patent: March 22, 2022Assignee: UNITED MICROELECTRONICS CORP.Inventors: Wen-Lin Wang, Ping-Chia Shih, Ming-Che Tsai, Kuei-Ya Chuang, Yi-Chun Teng, Po-Hsien Chen, Wan-Chun Liao
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Publication number: 20220077166Abstract: The present application discloses a semiconductor structure and a manufacturing method thereof. The semiconductor structure comprises a substrate, a gate dielectric layer, a floating gate, a first dielectric layer and a control gate. The gate dielectric layer is disposed on the substrate. The floating gate is disposed on the gate dielectric layer and has at least one tip on a top surface of the floating gate. The first dielectric layer is disposed on the floating gate. The control gate is disposed above the first dielectric layer and at least partially overlaps the floating gate.Type: ApplicationFiled: October 19, 2020Publication date: March 10, 2022Inventors: Ping-Chia SHIH, Kuei-Ya CHUANG, Chuang-Hsin CHUEH, Ming-Che TSAI, Wen-Lin WANG, Yi-Chun TENG, Ssu-Yin LIU, Wan-Chun LIAO
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Publication number: 20210217708Abstract: A device for generating a security key includes a substrate, semiconductor units, contact structures, and defects. The semiconductor units are disposed on the substrate. The contact structures are disposed on and connected with the semiconductor units. The defects are disposed in at least a part of the contact structures randomly. A manufacturing method of a device for generating a security key includes the following steps. First semiconductor units are formed on a substrate. First contact structures are formed on the first semiconductor units. The first contact structures are connected with the first semiconductor units, and defects are formed in at least a part of the first contact structures randomly.Type: ApplicationFiled: January 14, 2020Publication date: July 15, 2021Inventors: Wen-Lin Wang, Ping-Chia Shih, Ming-Che Tsai, Kuei-Ya Chuang, Yi-Chun Teng, Po-Hsien Chen, Wan-Chun Liao
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Patent number: 11015388Abstract: A ladder cord fastening seat for a non-pull window blind includes two vertical posts located opposite to each other and an arc bridge. The ladder cord fastening seat is fastened in a top beam through the two vertical posts. Each of the vertical posts has a cord inserting hole for a ladder cord to be inserted therethrough. The arc bridge is used for fastening the ladder cord. The arc bridge connects the two vertical posts in such a way that an accommodation space is defined to accommodate a transmission member located in the top beam.Type: GrantFiled: October 31, 2018Date of Patent: May 25, 2021Assignee: SHEEN WORLD TECHNOLOGY CORPORATIONInventors: Hung-Hao Chen, Ming-Che Tsai
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Patent number: 10982488Abstract: A dual-torsion-spring cord rolling device includes driving and transmission units. The driving unit has first and second torsion spring gears engaged with each other, a first torsion spring connecting the first and second torsion spring gears, a wheel adjacent to the first torsion spring gear, and a second torsion spring connecting the second torsion spring gear and the wheel. The transmission unit has first and second transmission gears rotatable synchronously by the driving of the second torsion spring gear, and two lift transmission cords attached to the first and second transmission gears respectively.Type: GrantFiled: November 21, 2018Date of Patent: April 20, 2021Assignee: SHEEN WORLD TECHNOLOGY CORPORATIONInventors: Hung-Hao Chen, Ming-Che Tsai
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Publication number: 20200399955Abstract: A blind body actuator used in a non-cord window blind is provided to include a casing, a winding mechanism, a set of guide units, a set of lift-cord wheels, and a set of lift cords. The winding mechanism is rotatably mounted in the casing and includes a plurality of meshed and juxtaposed winding wheels and volute springs wound around the abovementioned winding wheels. The lift-cord wheels are meshed with the winding wheels and employed to wind the lift cords. The guide units contain some cylinder rollers that are employed for winding the lift cords based on actual needs.Type: ApplicationFiled: June 21, 2019Publication date: December 24, 2020Inventors: HUNG-HAO CHEN, MING-CHE TSAI
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Patent number: 10530055Abstract: A communication device includes a dielectric substrate, a housing, a first antenna, a second antenna, a third antenna, a fourth antenna, a fifth antenna, a sixth antenna, a seventh antenna, and an eighth antenna. The dielectric substrate has a top surface and a bottom surface. The housing has an outer surface and an inner surface. The first antenna and the third antenna are disposed on the top surface of the dielectric substrate. The second antenna and the fourth antenna are disposed on the bottom surface of the dielectric substrate. The fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna are disposed on the inner surface of the housing.Type: GrantFiled: January 3, 2018Date of Patent: January 7, 2020Assignee: QUANTA COMPUTER INC.Inventor: Ming-Che Tsai
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Publication number: 20190352961Abstract: A retainer includes an abutting portion, a protrusion integrally extended from a side of the abutting portion and having a through hole for a lift pull cord to be slidably threaded therethrough, and two opposite upper cantilever portions and two opposite lower cantilever portions integrally extended from another side of the abutting portion. A first positioning groove is provided between the upper and lower cantilever portions for a slat to be embedded in the first positioning groove. Second and third positioning grooves perpendicularly communicating with the first positioning groove are provided between the upper cantilever portions and between the lower cantilever portions respectively for a tilt cord to be inserted in the second and third positioning grooves.Type: ApplicationFiled: May 15, 2019Publication date: November 21, 2019Inventors: Hung-Hao CHEN, Ming-Che TSAI
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Publication number: 20190323289Abstract: A three-wheeled cord rolling device includes a driving unit having two torsion spring wheels engaged with each other and a torsion spring connecting the torsion spring wheels, and a cord rolling unit having a cord rolling wheel and two lift transmission cords. The cord rolling wheel is engaged with one of the torsion spring wheels, thereby rotatable with them synchronously. The cord rolling wheel has an axle having upper and lower axial portions and a separating portion connecting the upper and lower axial portions. The lift transmission cords are disposed on the upper and lower axial portions of the axle respectively, thereby capable of being rolled up or released from the upper and lower axial portions of the axle by the rotation of the cord rolling wheel.Type: ApplicationFiled: April 16, 2019Publication date: October 24, 2019Inventors: Hung-Hao CHEN, Ming-Che TSAI
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Publication number: 20190162019Abstract: A dual-torsion-spring cord rolling device includes driving and transmission units. The driving unit has first and second torsion spring gears engaged with each other, a first torsion spring connecting the first and second torsion spring gears, a wheel adjacent to the first torsion spring gear, and a second torsion spring connecting the second torsion spring gear and the wheel. The transmission unit has first and second transmission gears rotatable synchronously by the driving of the second torsion spring gear, and two lift transmission cords attached to the first and second transmission gears respectively.Type: ApplicationFiled: November 21, 2018Publication date: May 30, 2019Inventors: Hung-Hao CHEN, Ming-Che TSAI
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Publication number: 20190148830Abstract: A communication device includes a dielectric substrate, a housing, a first antenna, a second antenna, a third antenna, a fourth antenna, a fifth antenna, a sixth antenna, a seventh antenna, and an eighth antenna. The dielectric substrate has a top surface and a bottom surface. The housing has an outer surface and an inner surface. The first antenna and the third antenna are disposed on the top surface of the dielectric substrate. The second antenna and the fourth antenna are disposed on the bottom surface of the dielectric substrate. The fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna are disposed on the inner surface of the housing.Type: ApplicationFiled: January 3, 2018Publication date: May 16, 2019Inventor: Ming-Che TSAI
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Patent number: D1017482Type: GrantFiled: April 28, 2022Date of Patent: March 12, 2024Assignee: TRAN HUNG INTERNATIONAL CO., LTD.Inventor: Ming-Che Tsai