Patents by Inventor Ming-Chen Kuo

Ming-Chen Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974479
    Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 30, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Shun-Yuan Hu, Chin-Lung Ting, Li-Wei Mao, Ming-Chun Tseng, Kung-Chen Kuo, Yi-Hua Hsu, Ker-Yih Kao
  • Patent number: 11923378
    Abstract: The present disclosure provides an electronic device including a substrate, a common electrode, and a plurality of pixels. The common electrode is disposed on the substrate. The pixels are disposed on the substrate, and at least one of the pixels includes a thin film transistor, a first electrode, a second electrode, and an auxiliary electrode. The first electrode is electrically connected to the thin film transistor. The auxiliary electrode is partially overlapped with the first electrode in a top view direction of the electronic device. The auxiliary electrode is electrically connected to the common electrode and electrically isolated from the first electrode, and the first electrode and the auxiliary electrode have a minimum distance less than a minimum distance between the first electrode and the common electrode.
    Type: Grant
    Filed: February 20, 2023
    Date of Patent: March 5, 2024
    Assignee: InnoLux Corporation
    Inventors: Chi-Lun Kao, Ker-Yih Kao, Ming-Chun Tseng, Kung-Chen Kuo
  • Publication number: 20240071722
    Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Sheng-Liang Pan, Bing-Hung Chen, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang, Jack Kuo-Ping Kuo
  • Publication number: 20120267612
    Abstract: Cross-linkable copper complexes comprising a copper phthalocyanine core and one or more cross-linkable functionalities linked to the phthalocyanine core. The copper complex may have a spacer group with the one or more cross-linkable functionalities on the spacer group. The spacer group contains a chain or one or more aryl groups. These cross-linkable copper complexes may be used in making organic electronic devices, such as OLEDs, by solution processing techniques.
    Type: Application
    Filed: January 14, 2009
    Publication date: October 25, 2012
    Applicant: UNIVERSAL DISPLAY CORPORATION
    Inventors: Chuanjun Xia, Raymond Kwong, Ken-Tsung Wong, Hsiao-Fan Chen, Ming-Chen Kuo, Kwang-Ohk Cheon