Patents by Inventor Ming Chen Lee

Ming Chen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145381
    Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu
  • Publication number: 20240117314
    Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Inventors: Ruei-Yue Liang, Chia-Hsin Lee, Kai-Ling Zhang, Po-Cheng Lin, Ming-Hsi Chuang, Yu-Chen Tsai, Peggy Leh Jiunn Wong
  • Patent number: 11948837
    Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Fu Yeh, Chin-Lung Chung, Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee
  • Publication number: 20240093416
    Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicant: ZENG HSING INDUSTRIAL CO., LTD.
    Inventors: Kun-Lung HSU, Ming-Ta LEE, Wei-Chen CHEN, Po-Hsien TSENG
  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Publication number: 20240079784
    Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Victor C. Lee, Jingni Zhong, Ming Chen, Bhaskara R. Rupakula, Yiren Wang, Yuan Tao, Christopher Q. Ma, Zhiheng Zhou, Sherry Cao, Kevin M. Froese, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240071822
    Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
  • Publication number: 20160192664
    Abstract: The present invention relates to a composition comprising white kidney bean extract Fabenol and trehalose, and optionally water-soluble dietary fiber, for combing with food materials, such as butter, flour and egg to manufacture baked products in the high temperature baking process, for example at 120 to 200° C. The composition of present invention remains the inhibitory activity on ?-amylase under the baking condition of high temperature, which will offer a lowered degradation rate of starch in the baked products to make the baked food meeting the taste without increasing burden to consumers.
    Type: Application
    Filed: January 6, 2015
    Publication date: July 7, 2016
    Inventor: MING CHEN LEE
  • Patent number: 9295684
    Abstract: The present invention relates to a cream composition of glucosamine, including at least 10 wt %-15 wt % of glucosamine HCL, a methylsulfonylmethane component, a chondroitin component, and a cream base, wherein the composition promotes penetration of glucosamine from skin of affected area by synergistic interaction between components, in order to enhance absorption of human body.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: March 29, 2016
    Inventor: Ming-Chen Lee
  • Publication number: 20150031646
    Abstract: A carrier enhancing absorption of medication includes a target medication, an emulsifier, a small-molecular hyaluronic acid (HA) component, an absorption enhancer and a cream base, wherein the carrier promotes infiltration of target medication from skin over affected area and enhance the absorption efficacy of human body by synergistic interaction.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 29, 2015
    Inventor: MING-CHEN LEE
  • Publication number: 20130330373
    Abstract: The resent invention relates to a cream composition of glucosamine, including at least 10 wt %-15 wt % of glucosamine HCL, a methylsulfonylmethane component, a chondroitin component, and a cream base, wherein the composition promotes penetration of glucosamine from skin of affected area by synergistic interaction between components, in order to enhance absorption of human body.
    Type: Application
    Filed: June 7, 2013
    Publication date: December 12, 2013
    Inventor: MING-CHEN LEE
  • Publication number: 20130164233
    Abstract: A skin-whitening essence composition containing a tyrosinase inhibitor is disclosed. The skin-whitening essence composition includes: 0.1-2.5 wt % of the tyrosinase inhibitor (CitrusC), 0.1-2.5 wt % of ascorbic acid 2-glucoside (AA2G), 0.1-2.5 wt % of tranexamic acid and a moisturizing essence base that work synergistically to provide the skin-whitening essence composition with skin-whitening effect.
    Type: Application
    Filed: December 23, 2011
    Publication date: June 27, 2013
    Inventor: Ming-Chen LEE
  • Publication number: 20120321577
    Abstract: A skin-whitening composition containing a tyrosinase inhibitor is disclosed. The skin-whitening composition includes: the tyrosinase inhibitor (CitrusC) of 0.1-2.5 wt % based on a weight of the skin-whitening composition; ascorbic acid 2-glucoside of 0.1-2.5 wt % based on the weight of the skin-whitening composition; and tranexamic acid of 0.1-2.5 wt % based on the weight of the skin-whitening composition; wherein the ingredients of the composition work synergistically on whitening skin.
    Type: Application
    Filed: June 15, 2011
    Publication date: December 20, 2012
    Inventor: Ming-Chen Lee
  • Patent number: 7125572
    Abstract: The present invention discloses a tyrosinase inhibitor extract from lemon peels. The tyrosinase inhibitor extract contains a tyrosinase inhibitor content and provides advantageous skin whitening effects.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: October 24, 2006
    Assignee: Kaoder Industry Company, Ltd.
    Inventor: Ming Chen Lee