Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a semiconductor device, a lid, and a thermal interface material. The interposer substrate is disposed on the carrier substrate. The semiconductor device is disposed on the interposer substrate. The lid is disposed on the carrier substrate to cover the semiconductor device. The thermal interface material is disposed between the lid and the semiconductor device. A first recess is formed on a lower surface of the lid facing the semiconductor device, and the first recess overlaps the semiconductor device in a top view.

Abstract: A control method in use of a flyback power converter is disclosed to provide an operation power source supplying power to a power controller controlling a main power switch. The flyback power converter has a transformer with a primary winding and an auxiliary winding. The main power switch and the primary winding are connected in series. A chopper switch and a buffer inductor are connected in series between the auxiliary winding and the power controller. The power controller turns ON the main power switch for an ON time to energize the transformer, and turns ON the chopper switch for at least a time period during the ON time, so that during the time period the buffer inductor conducts an induced current flowing from the auxiliary winding and through the chopper switch, to build up the operation power source.

Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.

Abstract: An apparatus is provided. The apparatus includes a laser generation device configured to emit a laser signal to a semiconductor fabrication component. The apparatus includes a reflection detection device configured to receive a reflection signal comprising light, of the laser signal, reflected by a surface of the semiconductor fabrication component. The reflection detection device includes an optical filter. The optical filter is configured to block light, of the reflection signal, that has a wavelength outside a defined range of wavelengths. The optical filter is configured to provide filtered light, from the reflection signal, that has a wavelength within the defined range of wavelengths. The reflection detection device includes a light sensor configured to generate an electrical signal based upon the filtered light. The apparatus includes a computer configured to determine, based upon the electrical signal, measures of electrostatic field strength at the surface of the semiconductor fabrication component.

Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.

Abstract: The present disclosure provides a method for preparing mesenchymal stem cell-derived extracellular vesicle, the mesenchymal stem cell-derived extracellular vesicle prepared by the method, and use of the mesenchymal stem cell-derived extracellular vesicle for reducing adipogenesis and treating osteoarthritis. The mesenchymal stem cell-derived extracellular vesicle of the present disclosure achieves the effect of reducing adipogenesis and treating osteoarthritis through various efficacy experiments.

Abstract: A triboelectric nanogenerating device is configured for providing an electric power to an electronic device and the triboelectric nanogenerating device includes at least one scaly triboelectric membrane configured for providing the electric power to the electronic device by frictional electrification. The at least one scaly triboelectric membrane includes a keratin and a polyvinyl alcohol, the at least one scaly triboelectric membrane has a first triboelectric surface, and the first triboelectric surface of the at least one scaly triboelectric membrane includes a plurality of scaly layers. Each of the scaly layers is arranged in order and extends along an orienting direction. A distal end of each of the scaly layers has a plurality of saw-tooth structures.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.

Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.

Abstract: An electronic device and housing thereof are provided. The electronic device includes housing, a partition, multiple electronic elements, and a fan. The housing has a side edge, where the side edge is provided with a slit. The partition is disposed in the case, is separated by a distance with the slit, and divides the interior of the case into a first and a second space. The partition has a through hole, the second space is in communication with the first space through the through hole, and the first space is in communication with the outside of the case through the slit. The electronic elements and the fan are disposed in the second space, and an air outlet of the fan is adjacent to the through hole, so that air in the second space can be driven to flow from the first space to the outside through the slit.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding will extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.

Abstract: An electronic device and housing thereof are provided. The electronic device includes housing, a partition, multiple electronic elements, and a fan. The housing has a side edge, where the side edge is provided with a slit. The partition is disposed in the case, is separated by a distance with the slit, and divides the interior of the case into a first and a second space. The partition has a through hole, the second space is in communication with the first space through the through hole, and the first space is in communication with the outside of the case through the slit. The electronic elements and the fan are disposed in the second space, and an air outlet of the fan is adjacent to the through hole, so that air in the second space can be driven to flow from the first space to the outside through the slit.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.

Abstract: Simplifying a manufacturing method for producing wick structures of a vapor chamber includes providing a metal lid, providing a powder thermal spray gun to generate a high temperature blaze to melt a sprayed first powder into a melting surface status, and directly spraying the first powder with the melting surface status on an inner surface of the metal lid to form a first wick structure with a porous status over the inner surface of the metal lid. The manufacturing method further includes putting a cooling system outside the metal lid to keep the metal lid low temperature.

Abstract: A heat sink and a method for manufacturing a heat sink are described. A plate-like base is manufactured with a plurality of parallel grooves and a plurality of fins by an impact extrusion process. A high temperature heat treatment is performed to soften the plate-like base. The fins are positioned in corresponding grooves and an equal force is applied to both ends of the plate-like base so that the grooves are deformed and the fins are fixedly positioned. The method is simpler and significantly cheaper than that for conventional heat sinks.

Abstract: A heat-radiating structure of chip provides effective heat-radiating paths and also maintains good structural stability to protect chips. A bearing rack is connected beside a flip chip type chip on a circuit substrate. The bearing rack is connected with a heat-radiating sheet. A projective portion is disposed at the center of the heat-radiating sheet facing the chip. The surfaces of the projective portion and the chip are connected together through adhesive. Several grooves are disposed on the surface of the heat-radiating sheet facing the chip to reduce the weight of the heat-radiating sheet and maintain its structural rigidity. Each side of the bearing rack is not connected together to avoid regions with a too large local thermal stress. Moreover, heat-spreading paths for hot, air are also provided to prevent the heat-radiating sheet from extra stress due to hot expansion and cold shrinkage during baking in the packaging process.

Abstract: A heat dissipation device includes a thermally conductive base plate and a plurality of thermally conductive fin plates that are in thermal communication with the base plate. Each adjacent pair of the fin plates defines a channel therebetween, through which cool air is forced to flow. Each of the fin plates has a proximate side that is proximate to the base plate, a distal side that is opposite to the base plate, and a plurality of integral ribs that extend from the proximate side to the distal side, thereby permitting heat transfer from the proximate side to the distal side along the ribs. In addition, because each of the ribs enables formation of a small turbulent flow of the cool air, a temperature boundary layer of the air is broken in each of the channels, thereby permitting heat transfer from upstream ends of the channels to downstream ends of the channels. Because the sizes of the ribs are relatively small with respect to the widths of the channels, the cool air can flow smoothly through the channels.

Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.